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Toppan boosts FC-BGA substrate production for AI chips

December 17, 2025
Tokyo-based Toppan Inc., a subsidiary of Toppan Holdings Inc., has completed construction of a new manufacturing line for advanced flip-chip ball-grid array (FC-BGA) substrates at its Niigata Plant in Japan, targeting mass production by the end of the current fiscal year. This move is part of the company’s strategic response to rising demand for high-density semiconductor packaging driven by data center, edge computing and AI workloads, according to a company press release issued on 17 December 2025.


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Sivers Semiconductors partners With POET Technologies

November 06, 2025
Swedish photonics and wireless technologies specialist, Sivers Semiconductors, has released additional details on the strategic partnership with POET Technologies Inc., a specialist the design and implementation of highly integrated optical engines and light sources for artificial intelligence networks. The collaboration will combine Sivers’ lasers with POET’s optical interposer to deliver scalable, energy-efficient light sources.




















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