Toshiba to axe 5,000 jobs as re-structure continues
April 22, 2024
Japan's Toshiba Corp is reported to have cut its staff count by 5000 – that's 10% of the total – as it tries to streamline its operations as a private company.
Sponsored content by Multi Leiterplatten GmbH
PCBs: price reduction of up to -50.3% through AI
Thanks to the increased use of AI in production preparation, Multi-CB, a leading European PCB specialist, has been able to permanently reduce the prices for 1- and 2-layer PCBs. The price for a half Eurocard (80x100mm), for example, is now € 14.80 instead of € 29.80. Due to the process, the price reduction has the most significant effect on small quantities, although medium quantities are also benefiting.
Siltronic ends wafer production for "small diameters"
April 11, 2024
Siltronic plans to gradually cease production of polished and epitaxial small diameter wafers at its Burghausen site. The process, which excludes unpolished wafers, is set to be completed in 2025.
SolarEdge acquires EV charging startup Wevo Energy
April 05, 2024
Publicly listed US firm SolarEdge has bought the entire share capital of Wevo Energy to boost its presence in the commercial and industrial (C&I) segment.
Infineon signs MoU with Korean shipbuilding firm
April 02, 2024
Germany's semiconductor group Infineon has agreed a partnership with HD Korea Shipbuilding & Offshore Engineering Co to develop energy-efficient semiconductor tech for electric-powered shipping.
Pragmatic opens the UK's first 300mm wafer manufacturing fab
March 27, 2024
Pragmatic Semiconductor has officially opened the UK's first 300mm semiconductor wafer fabrication line at Pragmatic Park in Durham.
Coherent expands capacity in US and Europe
March 27, 2024
Compound semiconductor specialist Coherent Corp. has established the world’s first capability for 6-inch indium phosphide (InP) wafer fabrication, at the company’s Sherman, Texas, and Järfälla, Sweden, wafer fabs.
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Arrow Electronics presents an accelerated path to market for technology megatrends at embedded world
During embedded world 2024, Arrow Electronics will highlight how its connections with leading suppliers and engineering providers combine with insightful customer services to accelerate imaginative new products to market. Diverse demonstrations and displays will highlight Arrow’s role in today’s dominant megatrends: electrification of everything, smart everything, energy management, autonomous machines and AI.
Innoscience responds to Infineon’s lawsuit
March 21, 2024
Innoscience Technology says that it "firmly denounces the accusations" made by German semiconductor company Infineon in a recent patent infringement lawsuit against three Innoscience entities.
Management change at Mycronic
March 19, 2024
Evertiq has previously reported on Mycronic's possible listing Axxon – the core of the High Volume division. A move which the Swedish company claims would create the best possible conditions for Axxon to realise its full potential.
Samsung to use MR-MUF tech in a bid to boost its HBM yields?
March 19, 2024
Korean memory giant Samsung is rumoured to have purchased a range of chipmaking equipment related to the mass reflow molded underfill (MR-MUF) method.
Singaporean researchers develop ultra-thin wearable chips
March 15, 2024
A team at Nanyang Technological University, Singapore (NTU Singapore) has successfully fabricated a hair-thin semiconducting fibre that can be woven into fabrics to create wearable electronics.
Infineon sues Innoscience for patent infringement
March 14, 2024
Infineon Technologies has filed a lawsuit against China's Innoscience, seeking a permanent injunction for infringement of a US patent relating to gallium nitride (GaN) technology.
LG and LS Electric team up on smart factory projects
March 08, 2024
The two South Korean companies have confirmed a strategic alliance to accelerate smart factory innovation and develop overseas markets.
Can inkjet technology revolutionise semiconductor manufacturing?
March 06, 2024
That is what Heraeus Printed Electronics GmbH and SUSS MicroTec intend to find out. Through a joint development agreement, the companies aim to pave the way for digital inkjet printing of metallic coatings for semiconductor manufacturing.
Sponsored content by Comarch S.A.
PCB – what is the key component in electronics manufacturing?
Today, printed circuits are with us at every turn. They are present in smart phones, computers, household appliances, as well as medical devices and aircraft. In an era of miniaturisation of electronics and increasing complexity of board designs both, PCB suppliers and PCB assembly factories, are meeting customer needs with innovative technical solutions and materials. What is the process of ordering a PCB and assembling the PCBA components? What are the challenges involved? The answers to these questions are provided by the work of Comarch IoT Plant, a state-of-the-art manufacturing facility offering services in the field of rapid prototyping and assembly of electronic devices (EMS).
Micron begins volume production of HBM3e memory
March 01, 2024
The US's biggest memory firm, Micron, has joined the race to compete in the next-gen HBM3e space, and says its new products will be used by Nvidia.
AI chip deals remain low; chip makers take over as major buyers
February 28, 2024
New research from Omdia reveals that while demand for AI chips is soaring, AI chip deals remain low – and that chip manufacturers are taking over as the major buyers.
Stellantis to make electric drive modules in Hungary
February 19, 2024
Car giant Stellantis is set to increase its production capacity of electric drive modules (EDMs) by bringing production to its Szentgotthard, Hungary plant from 2026.
Sponsored content by Würth Elektronik eisos
MagI³C-FIMM: DC/DC converters from Würth Elektronik
Data acquisition, test and measurement systems, interface, and microcontroller power supplies: The isolated power module MagI³C-FIMM is for universal use with low development costs for many industrial electronics requirements.
Helios Technologies and Balboa opens expanded facility in Mexico
February 15, 2024
Helios Technologies says that its operating company Balboa has officially cut the ribbon for its 68,000 square foot expansion of its Tijuana, Mexico facility.
Intel loses German patent infringement case
February 09, 2024
A German court has judged against Intel in a patent dispute surrounding a number of its older processors.
Faraday is developing a 64-core SoC with Arm and Intel
February 07, 2024
Faraday Technology Corporation is working on a 64-core System-on-Chip (SoC) utilising Intel 18A technology and Arm Neoverse Compute Subsystems.
SCREEN opens new semiconductor equipment facility
February 05, 2024
Japan's SCREEN Semiconductor Solutions has completed construction of its S3-5 (S-Cube 5) factory, which is based at its existing Hikone site.
DigiKey added over 450 new suppliers in 2023
February 01, 2024
The global distributor of electronics components massively expanded its portfolio in 2023 – adding more than 450 new suppliers across its core business. In total DigiKey added more than 1.7 million new accessible parts, including 230,000+ parts with inventory available during 2023.
Fujifilm invests to expand its electronic materials business
January 18, 2024
Fujifilm Corporation says that it plans to invest approximately JPY 6 billion (EUR 37 million) in its Kumamoto site to further expand its Electronic Materials business.
SÜSS MicroTec completes sale of the MicroOptics division
January 18, 2024
SÜSS MicroTec has completed the sale of its Swiss subsidiary SUSS MicroOptics SA.
BluGlass acquires GaNWorks to further vertical integration
January 15, 2024
Australia-based semiconductor developer BluGlass Limited has announced the successful purchase of GaNWorks Foundry for for USD 800,000.
Cadence acquires Invecas
January 09, 2024
Cadence Design Systems says it has acquired Invecas, a provider of design engineering, embedded software and system-level solutions, headquartered in Santa Clara, California.
Chinese team presents 256-core multi-chiplet 'big chip'
January 05, 2024
Researchers at the Chinese Academy of Sciences believe they have made a major breakthrough – a chip combining 16 chiplets, each holding 16 RISC-V cores, interconnected via network-on-chip.
Nokia to sell businesses to Lumine Group
January 04, 2024
Nokia has reached an agreement under which Lumine Group Inc. will buy the Finnish company's Device Management (DM) and Service Management Platform (SMP) businesses.
Electrolux has completed the Memphis factory divestment
January 03, 2024
Electrolux Group says it has officially divested its factory in Memphis, Tennessee, USA, for a cash consideration of USD 35 million.
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