Amkor moves one step closer to packaging facility in Peoria August 28, 2025 Amkor Technology says that the City of Peoria, Arizona, has successfully acquired 834.5 acres of state land for future development, including a 104-acre parcel designated for the company’s new semiconductor packaging and test facility.
Apple commits $100B to US manufacturing and expansion August 07, 2025 Apple has announced a new USD 100 billion investment as part of a broader initiative to expand its operations and manufacturing footprint in the United States. The move raises the company’s total planned U.S. investment to USD 600 billion over the next four years.
Chinese firms gain ground in 2024 top 10 OSAT ranking May 23, 2025 The combined revenue of the world’s top 10 outsourced semiconductor assembly and test (OSAT) companies reached USD 41.56 billion in 2024, a 3% YoY increase, according to a new report from TrendForce. While established players ASE Holdings and Amkor retained their top positions, Chinese firms including JCET and HT-Tech posted double-digit growth, reshaping the competitive landscape.
Lightmatter’s photonic superchip advances interconnect innovation April 18, 2025 With fully integrated fiber attachment supporting 256 fibers, Passage M1000 delivers an order of magnitude higher bandwidth in a smaller package size compared to existing CPO solutions.
Nvidia Blackwell chip production starts in Arizona — Nvidia opens first US factories April 15, 2025 Nvidia has started US-based production of its next-generation Blackwell AI chips, marking a significant shift in the company’s global manufacturing strategy. Together with its manufacturing partners, Nvidia will produce its AI supercomputers on American soil for the first time.
Global OSAT market to touch $94 billion by 2031 March 28, 2025 Increasing circuit complexity spurs OSAT market growth, as integrating various functionalities into a single device demands specialized assembly and test capabilities.
Vietnam approves $500 million for semiconductor plant March 05, 2025 The new plant will focus on the production of small-scale, high-tech chips to support domestic industries and national security, reducing Vietnam’s reliance on global supply chains.
Chip packaging tech in US gets $1.6 billion boost October 21, 2024 Semiconductor packaging allows components to be combined as a single electronic device, and the latest funding under the CHIPS and Science Act seeks to drive innovation in this process.
Amkor and TSMC partner on advanced packaging in Arizona October 08, 2024 Amkor Technology and TSMC have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region's semiconductor ecosystem.
US government confirms $400m grant to Amkor for Peoria plant July 29, 2024 The US Department of Commerce has signed a non-binding preliminary MOA to provide up to USD 400 million for Amor's semiconductor assembly and test facility in Peoria.
Infineon and Amkor agree decarbonisation pact July 19, 2024 Two chip giants, Infineon Technologies and Amkor Technology, have signed a momorandum of understanding (MoA) to boost decarbonisation and sustainability strategies across the supply chain.
US government launches $1.6bn advanced chip R&D competition July 10, 2024 The CHIPS for America program will make awards of around USD 150 million each to promote private sector investment in five research areas.
Avnet names Rebeca Obregon as new president of Farnell June 26, 2024 Avnet has appointed Rebeca Obregon as the new president of Farnell, an Avnet company, effective July 1, 2024.
Infineon and Amkor looks to strengthen European supply chain April 10, 2024 Infineon Technologies says that it is strengthening its outsourced backend manufacturing footprint in Europe and announced a multi-year partnership with Amkor Technology.
SEALSQ Corp will open an OSAT in the US next year April 02, 2024 Post-quantum tech firm SEALSQ has revelled plans to create an Open Semiconductors Assembly and Test (OSAT) plant in the US, which will be operational by end of 2025.
Moov launches EU expansion March 13, 2024 Moov, a company operating a marketplace for used semiconductor equipment, has hired Eric Tribolet as Director of European Sales, to help the company expand its presence in European markets.
Pentagon Tech to open $50m precision cleaning facility March 04, 2024 Pentagon Technologies Group is set to launch a new precision cleaning facility in Mesa, Arizona to serve local chip fabs. It should be operational by late 2024.
Amkor closes in on approval for $2bn US facility February 23, 2024 Council leaders in Preoria voted unanimously to wave through Amkor's proposed semiconductor packaging and testing facility in the city.
US semiconductor firms mull $8bn investment in Vietnam January 26, 2024 A US government official has revealed that 15 companies are preparing to start manufacturing to Vietnam, subject to their partners meeting renewable energy standards.
Amkor and GlobalFoundries kickstart European partnership January 16, 2024 Amkor Technology and GlobalFoundries have officially kicked off their strategic partnership in Europe with a ribbon-cutting ceremony at Amkor's Porto, Portugal, facility today January 16, 2024.
Amkor announces $2bn US semiconductor packaging plant December 01, 2023 Amkor Technology has confirmed it will package and test chips at a new Arizona-based facility – and that Apple will be its first and biggest customer.
Amkor's set to opend its newest factory in Vietnam October 10, 2023 Semiconductor packaging and test services provider Amkor Technology is gearing up to officially open its newest factory in Bac Ninh, Vietnam on October 11, 2023.
Major CSPs aggressively constructing AI servers and boosting demand for AI chips June 23, 2023 TrendForce reports that explosive growth in generative AI applications like chatbots has spurred significant expansion in AI server development in 2023.
Amkor and GF partner to expand European supply chain February 20, 2023 Amkor Technology and GlobalFoundries have formed a partnership aiming to enable a comprehensive EU/US supply chain from semiconductor wafer production at GF to OSAT services at Amkor’s site in Porto, Portugal.
Amkor reportedly plans to shut down Shanghai plant for a week February 14, 2023 Amkor Technology, one of the world’s largest providers of outsourced semiconductor packaging and test services, is reportedly planning to shut down production at its site in Shanghai as the company is looking to cut costs.
Revenue ranking of the top 10 OSAT companies for 3Q21 November 23, 2021 For 3Q21, the revenues of the top 10 OSAT outsourced semiconductor assembly and test) companies reached USD 8.89 billion, a 31.6% YoY increase, says TrendForce.
Global OSAT revenue reaches $8.89 billion in 3Q21 November 23, 2021 As the global vaccination rate rose, and border restrictions in Europe and North America eased, social activities also began to enter a period of recovery, with the consumer electronics market seemingly ready for the arrival of the traditional peak season in 2H21, according to TrendForce’s latest investigations.
Amkor to expand capacity with new factory in Vietnam November 05, 2021 Semiconductor packaging and test service provider, Amkor Technology, plans to build a new factory in Bac Ninh, Vietnam. The first phase of the factory will focus on providing System in Package (SiP) assembly and test solutions to semiconductor and electronic manufacturing companies.
Revenue of Top10 OSAT companies for 2Q21 reaches USD 7.88bn September 07, 2021 Despite the intensifying COVID-19 pandemic that swept Taiwan in 2Q21, the domestic OSAT (outsourced semiconductor assembly and test) industry remained largely intact, according to TrendForce.
Lockdown in Malaysia to have no effect on chip companies June 02, 2021 National governments in Southeast Asian countries, including Thailand, Vietnam, and Malaysia, have been instituting increasingly stringent pandemic control measures in response to the intensifying COVID-19 pandemic in these countries.
Top 10 packaging/testing (OSAT) companies for 1Q21 May 19, 2021 Revenues of the top 10 largest packaging/testing (OSAT, outsourced semiconductor assembly and test) companies reached USD 7.17 billion in 1Q21, a 21.5% increase YoY, with most of these companies recording double-digit growths, according to TrendForce.
Top 10 tech industry trends for 2021 October 06, 2020 As the DRAM industry officially enters the EUV era, NAND Flash stacking technology advances past 150L, says TrendForce as it provides its forecast of 10 key trends in the tech industry for 2021.