Top 10 tech industry trends for 2021
October 06, 2020As the DRAM industry officially enters the EUV era, NAND Flash stacking technology advances past 150L, says TrendForce as it provides its forecast of 10 key trends in the tech industry for 2021.
ASE takes the lead among Top10 largest OSAT companies in 2Q20
August 17, 2020The border restrictions and national lockdowns instituted by various governments due to the COVID-19 pandemic’s impact in 1Q20 resulted in low inventory levels for clients of packaging and testing (OSAT, outsourced semiconductor assembly and test) companies and for distribution channels as well, according to TrendForce’s latest investigations.
ASE, Amkor and JCET top OSAT provider list for 2017
November 17, 2017The annual revenue from the global IC testing and packaging industry for 2017 is estimated to grow by 2.2 percent to reach USD 51.73 billion, according to the latest research from TrendForce.
Amkor with net income of USD 116 million
August 01, 2017Amkor Technology reported on net sales of USD 989 million for the second quarter ended June 30, 2017; a sequential and year-on-year growth of 8 percent. Net income stood at USD 116 million.
Amkor completes Nanium acquisition
May 24, 2017Amkor Technology has completed the acquisition of Nanium S.A., a Portugal-based provider of wafer-level fan-out (WLFO) semiconductor packaging solutions.
Amkor Technology to acquire Nanium
February 03, 2017Amkor Technology has entered into a definitive agreement to acquire Nanium, provider of wafer-level fan-out (WLFO) semiconductor packaging solutions. Terms of the transaction were not disclosed.
China’s Semi sector to undergo rapid consolidation in 2017
November 11, 2016Numerous major participants in the global semiconductor sector are engaging in deal-making to make themselves larger and more competitive. As a result, different industries within the sector will be controlled by fewer companies in the future.
Qualcomm opens facility in Shanghai for semiconductor test manufacturing
September 13, 2016Qualcomm Incorporated is opening Qualcomm Communication Technologies (Shanghai) Co. Ltd., a semiconductor test facility in the Waigaoqiao (WGQ) free-trade zone in Shanghai.
Amkor Technology chooses Orbotech system
July 12, 2016Obrotech's Inkjet 600 system has been selected by Amkor Technology, a provider of semiconductor packaging and test services.
Amkor Technology opens MEMS packaging line in China
June 29, 2016Driven by the increase in global demand for sensors from the smartphone and automotive markets, Amkor Technology is ramping up a new MEMS and sensor packaging line at its facility in Shanghai.
Amkor Technology reaches shipment milestone
March 28, 2016Amkor Technology, a semiconductor packaging and test service provider, has shipped 700 million RF and front-end advanced system-in-package (SiP) modules for mobile device applications.
Amkor Technology buys the remaining shares of J-Devices
January 07, 2016Amkor Technology has increased its ownership interest in J-Devices Corporation from 65.7% to 100%.
Amkor expands China operations
August 26, 2015Amkor Technology plans to expand its assembly and test factory located in China’s Shanghai Waigaoqiao Free Trade Zone.
Amkor appoints CTO
January 05, 2015Dr. Choon Heung Lee has been appointed Executive Vice President and Chief Technology Officer at Amkor Technology, Inc.
Amkor posts record sales in Q3
October 31, 2014Amkor Technology's third quarter delivered record figures to the company, net sales amounted to USD 813 million, an increase of 6% year-over-year.
Amkor Technology and Carsem settle dispute
May 29, 2014Amkor Technology and Carsem (M) Sdn Bhd announced the settlement of the litigation initiated by Amkor against Carsem alleging infringement of Amkor’s MicroLeadFrame (MLF) patents.
Amkor appoints Giel Rutten as executive VP, Advanced Products
January 16, 2014Amkor Technology has appointed Giel Rutten to Executive Vice President responsible for Advanced Products, reporting to Steve Kelley, Amkor’s President and Chief Executive Officer.
Nakaya, Amkor and Toshiba to form joint venture
September 23, 2013Nakaya Microdevices Corporation (NMD), Amkor Technology, and Toshiba Corporation have signed definitive agreements for the formation of a joint venture to provide semiconductor assembly and final testing services in Japan.
Chip carrier packaging grows
September 10, 2013Advanced packaging of semiconductor chips has emerged as a key enabler in many of today’s electronic system products.
Amkor completes acquisition of Toshiba’s facilityLoad more news
July 31, 2013Amkor has completed the acquisition of Toshiba Electronics Malaysia Sdn. Bhd. (“TEM”), Toshiba’s semiconductor packaging operation in Malaysia.