Infineon and Amkor looks to strengthen European supply chain
April 10, 2024
Infineon Technologies says that it is strengthening its outsourced backend manufacturing footprint in Europe and announced a multi-year partnership with Amkor Technology.
SEALSQ Corp will open an OSAT in the US next year
April 02, 2024
Post-quantum tech firm SEALSQ has revelled plans to create an Open Semiconductors Assembly and Test (OSAT) plant in the US, which will be operational by end of 2025.
Moov launches EU expansion
March 13, 2024
Moov, a company operating a marketplace for used semiconductor equipment, has hired Eric Tribolet as Director of European Sales, to help the company expand its presence in European markets.
Pentagon Tech to open $50m precision cleaning facility
March 04, 2024
Pentagon Technologies Group is set to launch a new precision cleaning facility in Mesa, Arizona to serve local chip fabs. It should be operational by late 2024.
Amkor closes in on approval for $2bn US facility
February 23, 2024
Council leaders in Preoria voted unanimously to wave through Amkor's proposed semiconductor packaging and testing facility in the city.
US semiconductor firms mull $8bn investment in Vietnam
January 26, 2024
A US government official has revealed that 15 companies are preparing to start manufacturing to Vietnam, subject to their partners meeting renewable energy standards.
Amkor and GlobalFoundries kickstart European partnership
January 16, 2024
Amkor Technology and GlobalFoundries have officially kicked off their strategic partnership in Europe with a ribbon-cutting ceremony at Amkor's Porto, Portugal, facility today January 16, 2024.
Amkor announces $2bn US semiconductor packaging plant
December 01, 2023
Amkor Technology has confirmed it will package and test chips at a new Arizona-based facility – and that Apple will be its first and biggest customer.
Amkor's set to opend its newest factory in Vietnam
October 10, 2023
Semiconductor packaging and test services provider Amkor Technology is gearing up to officially open its newest factory in Bac Ninh, Vietnam on October 11, 2023.
Major CSPs aggressively constructing AI servers and boosting demand for AI chips
June 23, 2023
TrendForce reports that explosive growth in generative AI applications like chatbots has spurred significant expansion in AI server development in 2023.
Amkor and GF partner to expand European supply chain
February 20, 2023
Amkor Technology and GlobalFoundries have formed a partnership aiming to enable a comprehensive EU/US supply chain from semiconductor wafer production at GF to OSAT services at Amkor’s site in Porto, Portugal.
Amkor reportedly plans to shut down Shanghai plant for a week
February 14, 2023
Amkor Technology, one of the world’s largest providers of outsourced semiconductor packaging and test services, is reportedly planning to shut down production at its site in Shanghai as the company is looking to cut costs.
Revenue ranking of the top 10 OSAT companies for 3Q21
November 23, 2021
For 3Q21, the revenues of the top 10 OSAT outsourced semiconductor assembly and test) companies reached USD 8.89 billion, a 31.6% YoY increase, says TrendForce.
Global OSAT revenue reaches $8.89 billion in 3Q21
November 23, 2021
As the global vaccination rate rose, and border restrictions in Europe and North America eased, social activities also began to enter a period of recovery, with the consumer electronics market seemingly ready for the arrival of the traditional peak season in 2H21, according to TrendForce’s latest investigations.
Amkor to expand capacity with new factory in Vietnam
November 05, 2021
Semiconductor packaging and test service provider, Amkor Technology, plans to build a new factory in Bac Ninh, Vietnam. The first phase of the factory will focus on providing System in Package (SiP) assembly and test solutions to semiconductor and electronic manufacturing companies.
Revenue of Top10 OSAT companies for 2Q21 reaches USD 7.88bn
September 07, 2021
Despite the intensifying COVID-19 pandemic that swept Taiwan in 2Q21, the domestic OSAT (outsourced semiconductor assembly and test) industry remained largely intact, according to TrendForce.
Lockdown in Malaysia to have no effect on chip companies
June 02, 2021
National governments in Southeast Asian countries, including Thailand, Vietnam, and Malaysia, have been instituting increasingly stringent pandemic control measures in response to the intensifying COVID-19 pandemic in these countries.
Top 10 packaging/testing (OSAT) companies for 1Q21
May 19, 2021
Revenues of the top 10 largest packaging/testing (OSAT, outsourced semiconductor assembly and test) companies reached USD 7.17 billion in 1Q21, a 21.5% increase YoY, with most of these companies recording double-digit growths, according to TrendForce.
Top 10 tech industry trends for 2021
October 06, 2020
As the DRAM industry officially enters the EUV era, NAND Flash stacking technology advances past 150L, says TrendForce as it provides its forecast of 10 key trends in the tech industry for 2021.
ASE takes the lead among Top10 largest OSAT companies in 2Q20
August 17, 2020
The border restrictions and national lockdowns instituted by various governments due to the COVID-19 pandemic’s impact in 1Q20 resulted in low inventory levels for clients of packaging and testing (OSAT, outsourced semiconductor assembly and test) companies and for distribution channels as well, according to TrendForce’s latest investigations.
ASE, Amkor and JCET top OSAT provider list for 2017
November 17, 2017
The annual revenue from the global IC testing and packaging industry for 2017 is estimated to grow by 2.2 percent to reach USD 51.73 billion, according to the latest research from TrendForce.
Amkor with net income of USD 116 million
August 01, 2017
Amkor Technology reported on net sales of USD 989 million for the second quarter ended June 30, 2017; a sequential and year-on-year growth of 8 percent. Net income stood at USD 116 million.
Amkor completes Nanium acquisition
May 24, 2017
Amkor Technology has completed the acquisition of Nanium S.A., a Portugal-based provider of wafer-level fan-out (WLFO) semiconductor packaging solutions.
Amkor Technology to acquire Nanium
February 03, 2017
Amkor Technology has entered into a definitive agreement to acquire Nanium, provider of wafer-level fan-out (WLFO) semiconductor packaging solutions. Terms of the transaction were not disclosed.
China’s Semi sector to undergo rapid consolidation in 2017
November 11, 2016
Numerous major participants in the global semiconductor sector are engaging in deal-making to make themselves larger and more competitive. As a result, different industries within the sector will be controlled by fewer companies in the future.
Qualcomm opens facility in Shanghai for semiconductor test manufacturing
September 13, 2016
Qualcomm Incorporated is opening Qualcomm Communication Technologies (Shanghai) Co. Ltd., a semiconductor test facility in the Waigaoqiao (WGQ) free-trade zone in Shanghai.
Amkor Technology chooses Orbotech system
July 12, 2016
Obrotech's Inkjet 600 system has been selected by Amkor Technology, a provider of semiconductor packaging and test services.
Amkor Technology opens MEMS packaging line in China
June 29, 2016
Driven by the increase in global demand for sensors from the smartphone and automotive markets, Amkor Technology is ramping up a new MEMS and sensor packaging line at its facility in Shanghai.
Amkor Technology reaches shipment milestone
March 28, 2016
Amkor Technology, a semiconductor packaging and test service provider, has shipped 700 million RF and front-end advanced system-in-package (SiP) modules for mobile device applications.
Amkor Technology buys the remaining shares of J-Devices
January 07, 2016
Amkor Technology has increased its ownership interest in J-Devices Corporation from 65.7% to 100%.
Amkor expands China operations
August 26, 2015
Amkor Technology plans to expand its assembly and test factory located in China’s Shanghai Waigaoqiao Free Trade Zone.
Amkor appoints CTO
January 05, 2015
Dr. Choon Heung Lee has been appointed Executive Vice President and Chief Technology Officer at Amkor Technology, Inc.
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