Extending component lifecycles crucial for greener electronics
The world produced a record 62 million tonnes of electronic waste in 2022, according to the UN’s latest Global E-waste Monitor. Less than a quarter of that was properly collected and recycled. With volumes projected to rise to 82 million tonnes by 2030, the gap between e-waste generation and recycling is widening.
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Siemens and Intel expand collaboration on IC and packaging solutions
Siemens Digital Industries Software says its continued collaboration with Intel Foundry, has resulted in new product certifications, updated foundry reference flows, and new technology enablements for Intel’s advanced process nodes and packaging technologies.
Magnachip to drop display business, goes all-in on power
Magnachip Semiconductor plans to transition into a pure-play power semiconductor company, a move aimed at boosting revenue growth, improving profitability, and increasing shareholder value. The company is now exploring strategic options for its display business, which could include a sale, merger, joint venture, licensing agreement, or even a complete wind-down.
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Cinch ModICE Connector Solutions for Heavy Equipment
What commonalities do hydraulic shovels, bulldozers, and threshing machines share? Each example of the above equipment operates in challenging environments where establishing reliable connections is highly difficult. The likelihood of disrupted operations from a single loose connection can be greatly minimized by selecting the appropriate connectivity solution.
Nordic Semi partners with Skylo
Nordic Semiconductor and Skylo, a specialist in Non-Terrestrial Network (NTN) communications, have entered into a strategic partnership to certify Nordic’s nRF9151 low-power cellular module on Skylo’s satellite network service.
Obsolescence: a question of when, not if
“It’s inevitable; you just have to accept it. The first step is to be aware that it will happen, whether you want it to or not.” That’s what Ronny Nietzsche, regional sales manager Nordic-Baltic region at Rochester Electronics, says about component obsolescence.
U-M awarded up to $7.5M to develop heat-tolerant chips
Funded by the Silicon Crossroads Microelectronics Commons Hub, University of Michigan researchers are leading a collaborative effort to bring more such semiconductors to the market.
Innoscience launches lawsuits against Infineon
Innoscience filed lawsuits against Infineon Technologies in China and two affiliates in the Suzhou Intermediate People's Court of Jiangsu Province, alleging patent infringement.
Canon delivers NIL system to Texas Institute for Electronics
Canon says that it has shipped its most advanced lithography platform, the FPA-1200NZ2C nanoimprint lithography (NIL) system for semiconductor manufacturing, to the Texas Institute for Electronics (TIE), a Texas-based semiconductor consortium.
Vishay launches global restructuring – closes three plants
Vishay Intertechnology, one of the world's largest manufacturers of discrete semiconductors and passive components, has announced a major restructuring program which will result in the company closing three plants.
Rohm and UAES ink a long-term supply deal for SiC power devices
Rohm Semiconductor and United Automotive Electronic Systems Co., Ltd. (UAES), a Tier 1 automotive supplier in China, have entered into a long-term supply agreement for SiC power devices.
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Amphenol Socapex D38999 Style Connectors & Derivatives
PEI-Genesis carries one of the largest inventories of Amphenol MIL-DTL-38999 circular connectors (formerly MIL-C-38999), including the Amphenol Socapex D38999 Series III extended range. This portfolio features both fully qualified connectors and derivative variants designed for demanding applications.
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Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025
Seoul, Korea – Koh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany. Visitors can explore Koh Young’s latest advances in electronics manufacturing and semiconductor packaging at Booth A2.377 for Surface Mount Technology (SMT) and software innovations, and at Booth B1.213 for advanced packaging and semiconductor metrology.
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