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Branch Education’s previous videos have taken viewers through the process of how microchips are made and the machines that print them. Now, it’s time to go even smaller – down to the level of transistors, the fundamental building blocks of every CPU.

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Electronic components distributor DigiKey has officially launched its Indian subsidiary, Digi-Key Electronics & Automation Trading Private Limited, which will operate a Global Capability Centre (GCC) in Bengaluru.

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The semiconductor industry is back in the mainstream spotlight. Unfortunately, that usually happens during times of volatility, shortage, and turmoil.

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All 27 EU Member States have called for a reinforced “Chips Act 2.0” to secure Europe’s position in the global semiconductor industry, issuing a joint declaration urging stronger action to reduce vulnerabilities and strengthen technological leadership.

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In this ABI Research whitepaper, see why manufacturers are replacing outdated systems and what to look for in a flexible, future-ready ops platform.

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The world produced a record 62 million tonnes of electronic waste in 2022, according to the UN’s latest Global E-waste Monitor. Less than a quarter of that was properly collected and recycled. With volumes projected to rise to 82 million tonnes by 2030, the gap between e-waste generation and recycling is widening.

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Siemens Digital Industries Software says its continued collaboration with Intel Foundry, has resulted in new product certifications, updated foundry reference flows, and new technology enablements for Intel’s advanced process nodes and packaging technologies.

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Magnachip Semiconductor plans to transition into a pure-play power semiconductor company, a move aimed at boosting revenue growth, improving profitability, and increasing shareholder value. The company is now exploring strategic options for its display business, which could include a sale, merger, joint venture, licensing agreement, or even a complete wind-down.

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Nordic Semiconductor and Skylo, a specialist in Non-Terrestrial Network (NTN) communications, have entered into a strategic partnership to certify Nordic’s nRF9151 low-power cellular module on Skylo’s satellite network service.

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“It’s inevitable; you just have to accept it. The first step is to be aware that it will happen, whether you want it to or not.” That’s what Ronny Nietzsche, regional sales manager Nordic-Baltic region at Rochester Electronics, says about component obsolescence.

Specialist memory distributor Memphis Electronic has entered into a strategic collaboration with Ramxeed, formerly Fujitsu Semiconductor Memory Solution.

DigiKey and Qorvo, a provider of connectivity and power solutions, have entered into a worldwide distribution agreement.

Funded by the Silicon Crossroads Microelectronics Commons Hub, University of Michigan researchers are leading a collaborative effort to bring more such semiconductors to the market.

Innoscience filed lawsuits against Infineon Technologies in China and two affiliates in the Suzhou Intermediate People's Court of Jiangsu Province, alleging patent infringement.

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RF interconnects sit at the heart of every high-frequency system, enabling reliable performance across industries from telecom and defense to medical and industrial applications. As technologies evolve — driven by 5G expansion, IoT, AI, and even emerging fields like quantum computing — engineers face new challenges: tighter frequency requirements, miniaturization, extreme environmental demands, and the pressure to accelerate development cycles while managing supply chain risks.

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Canon says that it has shipped its most advanced lithography platform, the FPA-1200NZ2C nanoimprint lithography (NIL) system for semiconductor manufacturing, to the Texas Institute for Electronics (TIE), a Texas-based semiconductor consortium.

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Vishay Intertechnology, one of the world's largest manufacturers of discrete semiconductors and passive components, has announced a major restructuring program which will result in the company closing three plants.

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Rohm Semiconductor and United Automotive Electronic Systems Co., Ltd. (UAES), a Tier 1 automotive supplier in China, have entered into a long-term supply agreement for SiC power devices.

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Kyocera has broken ground for the construction of its new production facility at the Minami Isahaya Industrial Park in Isahaya City, Nagasaki Prefecture, Japan.

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Illinois-based manufacturer Dover has acquired Criteria Labs, Inc., a provider of RF device and microelectronic engineering solutions.

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Rochester Electronics and u-blox have joined forces to offer global ongoing support for current and end-of-life semiconductor chips, modules, and IoT solutions designed to meet the needs of the industrial, automotive, and consumer sectors.

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Milexia Group has signed an agreement to acquire Scandinavian company Cabcongroup, a value-added distributor of passive, electromechanical components and cable harness solutions to the electronics industry.

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The startup dedicated to lab-grown diamond production is ready to open up about its tech and business vision.

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SiPearl, the company building the high-performance low-power European microprocessor for HPC and AI inference, has signed a partnership with Samsung to equip its Rhea series with the South Korean company's memory solution.

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German semiconductor giant Infineon will launch a company-wide savings program as the company again cuts its full-year revenue outlook for 2024.

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In late April, Heilind Electronics Europe opened a new state-of-the-art distribution center in Hanau near Frankfurt, Germany.

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Germany-based chip maker Infineon has confirmed it will supply its HybridPACK Drive G2 CoolSiC and bare die products to Xiaomi until 2027.

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Component obsolescence is a topic that is not talked about frequently enough. It is after all an inevitable aspect of our industry driven by constant innovation – but that doesn't have to mean product obsolescence.

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R2 Semiconductor has filed a patent infringement lawsuit in Le Tribunal Judiciaire de Paris against the French subsidiaries of Intel and its customers, Dell Technologies and Hewlett Packard Enterprise Company and HP Inc.

Farnell has signed a global distribution agreement with Alliance Memory, bringing a significant new supplier to Farnell’s semiconductor portfolio.

Reports say Huawei Technologies has achieved a breakthrough that will enable it to design advanced chips without the need for extreme ultraviolet lithography (EUV) machines.

bitswitch

Academic researchers have created a microelectronic device that can potentially function as a high-performance “bit-switch”. It consumes 1,000 times less power than commercial memory technologies.

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Dutch Innatera, a developer of ultra-low power neuromorphic processors, has secured EUR 15 million in Series-A funding which will allow the company to accelerate mass production, broaden application offerings, and expand customer engagements.

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The South Korean memory giant has started volume production of HBM3E1, the latest AI memory product with ultra-high performance, for supply to a customer from late March.

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