Sponsored content by PEI-GENESIS Connector Technology at the Core of Ground Vehicle Modernization Ground combat vehicles are rapidly evolving from fixed-function platforms into modular, software-defined systems. This shift demands interconnect solutions that support continuous upgrades without requiring redesigns of wiring infrastructure. Scalable, high-reliability connectors, particularly those based on MIL-DTL-38999, are central to enabling this transformation.
X-FAB receives €127 million to build new cleanroom in Erfurt July 02, 2026 X-FAB MEMS Foundry has received a grant notification of EUR 127.4 million from the German federal government and the Free State of Thuringia for the construction of a new cleanroom at its Erfurt site. The Fab4Micro project will expand capacity for MEMS, microsystems and photonics, with initial production targeted for the end of 2028.
Kingboard sells stake in subsidiary to ramp up PCB capacity July 01, 2026 Kingboard Holdings has sold a 4.92% stake in its laminates subsidiary, Kingboard Laminates Holdings, raising net proceeds of approximately HKD 11.8 billion – roughly EUR 1.4 billion. The capital is earmarked for PCB capacity expansion and multi-layer and HDI capabilities.
Fujifilm partners with Gujarat to boost chip materials manufacturing July 01, 2026 Fujifilm India aims to assess opportunities to establish a semiconductor materials production base in Dholera, Gujarat, while working closely with government stakeholders, industry bodies and private enterprises to strengthen a semiconductor supply chain.
Assel upgrades SMT line to boost production capacity June 30, 2026 EMS provider Assel has completed the modernisation of its surface-mount technology (SMT) line. The Polish company has replaced its existing pick-and-place machines with three new ASM SIPLACE SX systems. The investment is expected to increase production efficiency, improve placement accuracy, and reduce line changeover times.
FTG opens its first manufacturing facility in India June 30, 2026 Firan Technology Group has held the grand opening of FTG Aerospace Hyderabad, marking the culmination of a three-year effort to establish operations in India. The facility produces cockpit and avionics products and becomes FTG's fourth global manufacturing location, alongside Canada, the United States and China.
IBM debuts ‘world’s first’ sub-1 nanometer chip technology June 29, 2026 IBM’s new sub-1 nm chip packs nearly 100 billion transistors onto a chip the size of a fingernail, nearly twice the density of IBM’s 2 nm chip, unveiled in 2021.
SK keyfoundry develops Bi-SCR-based On-Chip EMC protection tech June 29, 2026 While conventional ESD protection devices were primarily limited to controlling momentary discharges during chip manufacturing or assembly processes, the new technology enables complete on-chip control of harsh system-level EMC environments.
Sponsored content by POLYRACK TECH-GROUP How developers choose the right solution between LCD, OLED and e-paper Today, displays are a central element of electronic systems – far beyond their traditional role as output devices. They directly influence user interaction, power consumption, thermal behavior and ultimately the overall system architecture. Whether in embedded systems, medical devices, test equipment or mobile applications, developers must define the display technology early in the design phase. This decision has a direct impact on hardware, software and mechanical integration – and is difficult and costly to change later.
Schweizer Electronic and Ascent Circuits plan PCB cooperation in India June 26, 2026 German PCB manufacturer Schweizer Electronic and Indian PCB maker Ascent Circuits – part of the Amber Group – have announced plans for a strategic cooperation in PCBs. The partnership targets automotive and industrial applications and is framed around supply chain resilience for customers in Europe and the United States.
Why does signal integrity determine the effectiveness of defence systems? June 25, 2026 The effectiveness of modern defence systems is no longer defined solely by the number of tanks, aircraft, missile launchers, or soldiers. Increasingly, real military capability depends on the reliability of the electronics responsible for maintaining communications, surveillance, data processing, and weapons control.
TTM Technologies opens Ultra-HDI PCB facility in Syracuse June 23, 2026 TTM Technologies has opened a new Ultra-HDI printed circuit board manufacturing facility in Syracuse, New York, in the United States. The USD 130 million investment – including USD 30 million from the US Department of War – is set to create up to 400 new jobs and bring TTM's total workforce in the region to approximately 1,000.
Evertiq Expo Berlin 2026 wraps up the first half of the year June 22, 2026 Evertiq Expo Berlin 2026 took place on June 18 at TEC Event Campus in Berlin's Siemensstadt district – a new venue for the event, which previously called Technology Park Berlin Adlershof home. The day brought together 328 people from 199 companies, with 163 visitors meeting 78 exhibiting companies.
Fideltronik secures USD 30 million contract in the renewable energy sector June 22, 2026 Polish electronics manufacturer Fideltronik has signed an agreement with one of the leading companies operating in the renewable energy industry. The contract, valued at USD 30 million, covers comprehensive printed circuit board (PCB) assembly services.
TTI Europe stocks and offers VG-qualified connector series June 19, 2026 By maintaining a stock of key VG-qualified connector series and associated components, TTI IP&E – Europe helps defence OEMs and system integrators reduce programme risk, improve supply continuity, and mitigate extended industry lead times.
Edge, Safran sign deal to deepen aerospace, defense cooperation June 19, 2026 The two companies have also announced a joint venture term sheet for the co-development of an extended-range precision-guided weapon based on the Hammer family.
TTM Technologies expands into the Swiss and German PCB markets June 18, 2026 U.S.-based TTM Technologies has announced plans to acquire Switzerland’s Swiss Technology Group and Germany’s ILFA GmbH. Both transactions are expected to be completed in the third quarter of 2026.
Semiconductor market hits record quarter, driven by memory surge June 16, 2026 Semiconductor revenue grew 27% QoQ in Q1 2026 to reach USD 319 billion – the highest quarterly growth Omdia has recorded since it began tracking the market in 2002. It marks the third consecutive quarter of double-digit growth, putting the market on track to surpass USD 700 billion in the first half of 2026.
Cadence unveils fully autonomous virtual engineer for chip design June 15, 2026 Built on Cadence’s AI-driven electronic design automation (EDA) portfolio with Nvidia Nemotron models, and secured by Nvidia OpenShell runtime, the new agentic capabilities enable customers to run dynamic simulations in automated workflows.
Evertiq Expo Berlin 2026: a closer look at the conference programme June 12, 2026 From AI-driven production planning and advanced PCB manufacturing to supply chain resilience and Europe's industrial competitiveness, Evertiq Expo Berlin 2026 will bring together experts from across the electronics industry to discuss some of the sector's most pressing challenges. Ahead of the event on 18 June, we take a closer look at this year's conference programme.
Alltronics officially opens manufacturing facility in Malaysia June 12, 2026 The Penang facility spans 60,000 square feet and houses 12 production lines, providing a monthly production capacity of upto 300,000 units. It operates as an OEM manufacturing base for industrial electronics, environmental control and electronics power modules.
Nvidia, Doosan Group collaborate to advance Physical AI June 11, 2026 The collaboration will bring together Nvidia’s full-stack accelerated computing platforms with Doosan Group’s capabilities in industrial automation, power generation and advanced electronics materials to support next-generation AI infrastructure.
NCAB warns PCB supply chain is facing a structural reset June 10, 2026 Swedish PCB supplier NCAB has published a stark supply chain outlook in May 2026, describing a market under simultaneous pressure from AI demand, geopolitical disruption and raw material shortages. The company's conclusion is direct: what the industry is experiencing now is not a temporary disruption — it is a structural reset.
BEL, DGQA sign MoU for long-term provisioning of electronic fuzes June 10, 2026 The proposed agreement aims at the timely supply of electronic fuzes as per stipulated specifications and quality standards to undertake proof firing and evaluation or trials of weapons and ammunition being procured by the Indian Army.
Itera raises $12M to bring real-time prototyping to electronics June 09, 2026 San Francisco-based deep tech startup Itera’s patented technology uses a novel architecture of glass and liquid metal, allowing circuit rewiring in less than a minute.
Siemens partners with Samsung Foundry to advance silicon design June 09, 2026 Through close engineering alignment, Siemens continues to qualify and deploy its electronic design automation (EDA) software — including design, verification, simulation and silicon manufacturing enablement — with Samsung Foundry’s latest process technologies.
UCLA Samueli launches $125 million semiconductor hub June 08, 2026 The mission of the semiconductor hub is to foster sustained collaboration between leading faculty and industry partners Broadcom, Applied Materials, GlobalFoundries, Meta and Synopsys to drive advances in connectivity, computing and intelligent systems.
DRAM prices surge – industry revenue up 81% in a single quarter June 08, 2026 The DRAM industry posted revenue of USD 97 billion in the first quarter of 2026, up 81% quarter-on-quarter, driven by a rapid surge in contract prices for conventional DRAM. Contract prices rose approximately 93 to 98 percent compared to the previous quarter, according to TrendForce.
Cicor wins major aerospace & defence program in France June 04, 2026 Swiss EMS provider Cicor Group has been selected by a leading European aerospace & defence (A&D) prime to supply electronic assemblies for a major defence program.
Tessalia plans €250M semiconductor packaging site in France June 04, 2026 Foxconn, Radiall and Thales laid the foundation stone of their future JV. Tessalia is expected to have 800 employees at full production. Production is expected to start at the end of 2029 and to reach more than 50 million SiP components per year by 2033.
Tata AutoComp partners with Jahwa to manufacture EV components June 04, 2026 The partnership brings together Jahwa Electronics’ Korean engineering expertise and Tata AutoComp’s manufacturing ecosystem in India. The companies will manufacture low and high voltage PTC heaters critical for thermal management in electric and hybrid vehicles.
Sponsored content by Shanghai Yongming Electronic Co.,Ltd Cold Start & Vibration in Auto Water Pumps: YMIN Hybrid Caps Enable Pin-to-Pin Replacement YMIN VHT/VHU/VHR solid-liquid hybrid capacitors for automotive electronic water pumps solve cold-start noise and high-vibration challenges. They enable pin-to-pin replacement of Japanese brands with equivalent performance and stable supply.