Eurofins to divest electronics testing unit for €575 million April 16, 2026 Eurofins Scientific SE has signed an agreement to sell its Electrical & Electronic Testing business, MET Labs, to UL Solutions Inc. for an enterprise value of EUR 575 million on a cash- and debt-free basis.
Hitachi Rail announces agreement to acquire Clever Devices April 16, 2026 Clever Devices’ portfolio of onboard and centralized data solutions will complement Hitachi Rail’s HMAX Mobility suite. HMAX Mobility is Hitachi Rail’s digital asset management platform that optimizes the performance of railways around the world.
Toshiba begins sampling of 30-34 TB SMR nearline HDDs April 14, 2026 M12 Series HDDs leverage Toshiba’s proprietary design and analysis technologies cultivated through the development of slimmer and more compact components. The new M12 is the first glass substrate nearline HDD for Toshiba.
Siemens joins ESA’s EPIC program to empower European startups April 10, 2026 Siemens will provide industrial-grade, comprehensive digital twin capabilities and a fully digital engineering and simulation backbone for the European space industry along with access to mentors and experts in the field.
Europe at a turning point for PCB base materials April 08, 2026 As performance requirements for printed circuit boards continue to rise — driven by high-speed digital as well as RF and microwave applications — the development and selection of base materials is becoming a balancing act between electrical performance, regulatory compliance and supply chain resilience. What used to be a largely engineering-driven decision is now increasingly influenced by external constraints that are harder to control and even harder to predict.
BASF, Sevnce to advance smart transformation of chemical industry April 08, 2026 The two companies will explore potential applications of Sevnce’s robotic and intelligent inspection solutions at BASF sites, and advance materials innovation for key robotic components.
Spain allocates €19 million to semiconductor research and quantum chip development April 07, 2026 The Spanish government has approved the allocation of €19 million to support research in semiconductors and the development of quantum chips, according to a statement from the Ministry for Digital Transformation and Public Service.
iBase-t secures investment to advance digital manufacturing April 07, 2026 The investment from TA will support iBase-t’s product innovation and expansion as aerospace and defense manufacturers scale production, modernize sustainment operations, and accelerate adoption of AI-enabled digital manufacturing technologies.
Wonderful PCB launches PCB reverse engineering services April 01, 2026 The China-based company delivers high-precision reverse engineering solutions that transform physical PCBs or PCB assemblies (PCBA) into complete, production-ready digital files.
Sintavia accelerates design of next-gen heat exchangers March 27, 2026 Sintavia, an all-digital aerospace component manufacturer, adopted a simulation-driven approach, integrating CFD in Siemens Simcenter STAR-CCM+ software and implicit modeling in nTop, leveraging Nvidia Blackwell architecture.
Fanuc America invests $90M to boost robot manufacturing March 25, 2026 This expands Fanuc America’s engineering capacity and advanced manufacturing capabilities to support the growing demand for automation solutions across North America, including physical AI, virtual commissioning and digital-twin technologies.
Siemens launches Fuse EDA AI Agent for automated workflows March 23, 2026 Supporting NVIDIA Agent Toolkit, advanced Nemotron models and NVIDIA AI infrastructure, the Fuse EDA AI Agent manages workflows across Siemens’ comprehensive EDA portfolio.
Lyten plans industrial hub in Poland following Northvolt site acquisition March 20, 2026 US-based energy technology company Lyten has announced plans to establish an industrial hub in Gdańsk, centred around a facility acquired from Northvolt in late 2025.
Infineon collaborates with Subaru to enhance next-gen ADAS March 20, 2026 Infineon plays a key role in Subaru’s integrated electronic control unit (ECU) for next‑generation advanced driver assistance systems (ADAS) and vehicle motion control.
Exicom inaugurates $23M facility to advance EV charging March 18, 2026 The Indian company’s new manufacturing plant in Hyderabad will support the growing demand for EV charging infrastructure, lithium-ion battery systems and critical power solutions across Indian and export markets.
Synopsys launches eDT Platform to advance Physical AI March 18, 2026 Initially focused on high-value automotive use cases, the Synopsys Electronics Digital Twin (eDT) Platform enables OEMs to achieve up to 90% of software validation prior to hardware availability.
Axonex partners with Synergy to boost digital twins, drone tech March 17, 2026 The joint venture will combine Axonex’s operational resources and international business capabilities with Synergy Technology Group’s digital twins and drone flight control systems technology.
Vector, Microchip expand collaboration on embedded solutions March 16, 2026 Vector and Microchip closely align their products to ensure early hardware and software compatibility and to facilitate joint further development.
Manz Asia and Epson partner to advance inkjet technology for chip manufacturing March 12, 2026 Semiconductor advanced packaging equipment manufacturer Manz Asia has entered into a strategic partnership with Seiko Epson Corporation (Epson) to accelerate the adoption of advanced inkjet technology in semiconductor manufacturing.
Foxconn pilots ABB–NVIDIA AI robotics platform for electronics assembly March 10, 2026 ABB has announced a collaboration with Nvidia to integrate Nvidia Omniverse libraries into ABB’s RobotStudio software platform, aiming to enable large-scale deployment of AI-driven industrial robotics.
Qualcomm, Tata Electronics to manufacture automotive modules March 09, 2026 Qualcomm Technologies will manufacture Qualcomm Automotive Module products in India at Tata Electronics’ upcoming semiconductor assembly and test (OSAT) facility in Jagiroad, Assam.
India’s C2i Semiconductors raises $15 million in Series A March 06, 2026 C2i Semiconductors is redesigning how electricity flows inside a server from the incoming power source to the processor chip using a grid-to-core approach.
Top 100 EMS and ODM providers grow 23% in 2025 as AI infrastructure drives market March 06, 2026 The world’s largest EMS and ODM companies posted strong revenue growth in 2025, largely driven by demand for AI infrastructure and cloud data centres, according to new market data from analysts in4ma and industry publication EMSNOW.
Qnovo secures strategic investment from Hyundai, Kia March 06, 2026 By delivering a verifiable digital accounting of battery health via a scalable, hardware-free architecture, Qnovo enables automakers to maximize performance and safety in real-time.
Siemens to invest €200 million in AI-driven factory in Amberg March 05, 2026 Siemens plans to invest more than EUR 200 million to build a new digitalised and automated factory at its manufacturing and development site in Amberg, Germany. The facility is intended to support the company’s Smart Infrastructure business and is scheduled to be completed by 2030.
NEC, Nokia to expand Eletronet’s optical fiber network in Brazil March 04, 2026 The project adds 8,000 km of new fiber routes. This expansion is expected to reach a total of 26,000 km across 23 Brazilian states by the end of 2026. Eletronet is investing USD 30.4 million in this initiative.
ams OSRAM completes EUR 114m lamps business sale March 03, 2026 Sensor and photonics company ams OSRAM has completed the sale of its Entertainment and Industry Lamps business to Japan-based Ushio Inc. for EUR 114 million. The transaction was closed on 2 March 2026.
Siemens to deliver cloud-based SCADA system for green energy March 02, 2026 Siemens’ platform-independent and AI-enabled Simatic WinCC Open Architecture SCADA will connect eight renewable energy generation and storage assets in New South Wales, Victoria, Western Australia, and the Australian Capital Territory.
European EMS downturn continues as modest recovery eyed for 2026 February 27, 2026 At Evertiq Expo Warsaw on 23 October 2025, Mareike Haass of market research firm in4ma and Christoph Solka of the Global Electronics Association presented new data showing a European EMS industry still struggling to recover from a sharp post-pandemic correction.
Western Digital to sell part of Sandisk stake for $3.17 billion February 20, 2026 Western Digital plans to sell part of its stake in flash memory unit Sandisk for USD 3.17 billion as the company seeks to cut debt, Reuters reports.
Thales to recruit more than 9,000 employees in 2026 February 19, 2026 French aerospace, defence and electronics company Thales says it plans to recruit more than 9,000 employees globally in 2026.
Infineon: GaN market to reach USD 3 billion by 2030 February 18, 2026 German semiconductor manufacturer Infineon Technologies expects the gallium nitride (GaN) power semiconductor market to reach nearly USD 3 billion by 2030, according to the 2026 edition of its annual “GaN Insights” report.