Intel, US government edge closer to $8.5 billion in chip funding
September 27, 2024
Any takeover of all or part of Intel’s business could risk disrupting the talks, according to a report in the Financial Times.
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TSMC, Samsung consider building $100 billion chip factories in UAE
September 23, 2024
The projects, which will help meet the soaring demand for AI computing, could be funded by the UAE, with the Abu Dhabi-based sovereign development vehicle Mubadala playing a key role, the WSJ says.
Qualcomm approaches Intel about a possible takeover
September 23, 2024
Qualcomm generates less revenue than Intel. It reported USD 35.8 billion in sales in fiscal 2023, compared with Intel’s USD 54.2 billion for the same period.
TSMC’s Japan fab spillover benefits may cross $70 billion
September 09, 2024
The previous estimate only considered the benefits of TSMC’s Kumamoto Fab 1. The latest evaluation includes the impact of the planned construction of Kumamoto Fab 2.
Rivals TSMC and Samsung join hands for HBM4 development
September 06, 2024
Dan Kochpatcharin, Head of Ecosystem and Alliance Management at TSMC, revealed that the two companies are working together on developing a buffer-less HBM4 chip.
VIS and NXP to build a new 300mm JV fab
September 05, 2024
Vanguard International Semiconductor (VIS) and NXP Semiconductors have secured the necessary approvals and injected capital to establish their joint venture VisionPower Semiconductor Manufacturing Company (VSMC). The new company will now proceed with the planned construction its first 300mm wafer manufacturing facility.
CoWos Packaging Driving Growth in Advanced Packaging Equipment
September 05, 2024
Chip-on-wager-on-substrate (CoWos) packaging technology has taken the packaging business by storm, with TrendForce reporting growth in advanced packaging growth of more than 10% in 2024. What is important, this trend could even surpass 20% in 2025.
Urgent orders boost wafer foundry utilisation in Q2
September 03, 2024
Customers have started to restock components following the arrival of China's 618 mid-year shopping season and consumer electronics inventory levels approaching healthy levels. This has led to urgent orders for wafer foundries, reports TrendForce.
Taiwan and Czechia plan to build EU semiconductor cluster
September 02, 2024
Taiwan’s National Security Council Secretary-General Joseph Wu said as TSMC builds an advanced wafer fab in Dresden, Germany, it needs a comprehensive supply chain in Europe.
Intel working hard to address investor concerns, says CEO Pat Gelsinger
August 30, 2024
Gelsinger said though AI was a weak link in its server business, the company would soon launch Lunar Lake, “the most compelling AI PC product ever.”
TSMC gets $1.96 billion subsidy boost from Japan and China
August 26, 2024
These funds are mainly for real estate, equipment and plant purchases, and to offset building and operational costs.
China is 5 years behind global chip leaders, says report
August 23, 2024
However, China is catching up with global leaders in the design of logic chips and is only two years behind.
SK hynix hints at new HBM product with 30 times higher performance
August 23, 2024
TrendForce predicts that the HBM industry will become more customization-oriented, breaking away from the standard DRAM framework.
TSMC acquires Innolux's 5.5G factory in Tainan
August 21, 2024
In a regulatory filing, TSMC states that it has signed an agreement to acquire buildings and
facilities from Innolux Corporation.
ESMC officially breaks ground on Dresden fab
August 20, 2024
Ground has been broken and the land preparation for ESMC's first semiconductor fab in Dresden, Germany has officially started.
EU approves €5 billion subsidy to support TSMC's German fab
August 20, 2024
The European Commission has approved, under EU State aid rules, a EUR 5 billion German measure to support European Semiconductor Manufacturing Company (ESMC) in the construction and operation of a microchip manufacturing plant in Dresden.
Samsung to bring in ASML’s High-NA EUV equipment
August 19, 2024
Samsung’s first High-NA EUV machine may be used for foundry operations. SK hynix’s High-NA equipment is expected to be introduced in 2026.
SK hynix, TSMC, NVIDIA join hands to develop next-gen HBM
August 16, 2024
SK hynix and TSMC may collaborate on developing and producing HBM4, which is scheduled for mass production in 2026.
Korea’s memory exports to Taiwan spike 225% driven by strong HBM demand
August 12, 2024
The main driver of this surge is South Korean chipmaker SK hynix’s supply of HBM to U.S. firm NVIDIA.
Intel to cut thousands of jobs to fund new strategy
July 31, 2024
US chip pioneer Intel is rumoured to be planning mass lay-offs in an effort to reverse its lost market share.
Construction at TSMC's Dresden plant could be weeks away
July 30, 2024
Work at TSMC's German facility has been delayed many times, but new reports suggest it is almost ready to break ground.
US government confirms $400m grant to Amkor for Peoria plant
July 29, 2024
The US Department of Commerce has signed a non-binding preliminary MOA to provide up to USD 400 million for Amor's semiconductor assembly and test facility in Peoria.
Japanese PM promises new law to support chip firms
July 26, 2024
Japan's Prime Minister Fumio Kishida has pledged to boost domestic mass production of advanced semiconductors and related R&D with new legislation.
TSMC beats expectations with bumper Q2 profits
July 18, 2024
The world's largest contract chip manufacturer, TSMC, has reported Q2 net profits of $7.60 billion – up from around £5 billion a year earlier.
TSMC to begin trial production of 2nm chips
July 12, 2024
Market-leading contract chip firm TSMC is rumoured to be gearing up its 2nm process at its Baoshan Plant in Hsinchu, Taiwan. Reports says the chips could be destined for Apple's forthcoming iPhone 17.
TSMC revenues soar by 28% in H1 2024
July 10, 2024
Taiwan Semiconductor Manufacturing Co has just reported a dramatic rise in income for the first half of the year powered by demand for AI and data centre applications.
Demand from AMD and Nvidia drives FOPLP development
July 03, 2024
In 2016, TSMC developed and named its InFO FOWLP technology, and applied it to the A10 processor used in the iPhone 7. Since then, OSAT providers have been striving to develop FOWLP and FOPLP technologies to offer more cost-effective packaging solutions, TrendForce reports.
New tool shows progress of CHIPS Act R&D programmes
July 01, 2024
The Semiconductor Industry Association (SIA) has launched an online tracker that reports on the work of the US CHIPS Act's various R&D initiatives.
VSMC set to acquire seven technology licenses from TSMC
June 28, 2024
Singapore-based VisionPower Semiconductor Corporation will purchase a range of technology licenses from Taiwan Semiconductor Manufacturing Company for around $150 million. The tech is needed to support its 300mm wafer fab in Singapore.
US government pledges $75 million to Entegris
June 28, 2024
The Biden-Harris Administration will provide Entegris with up to $75 million in proposed federal incentives under the CHIPS and Science Act to boost the US chip supply chain.
Global semiconductor fab capacity to expand 6% in 2024
June 26, 2024
To keep pace with the growth in demand for chips, the global semiconductor manufacturing industry is expected to increase capacity by 6% in 2024 and post a 7% gain in 2025, reaching a record capacity high of 33.7 million wafers per month (wpm: 8-inch equivalent), SEM reports.
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