indie to sell its interest in Wuxi indie Microelectronics October 29, 2025 Automotive solutions provider indie has entered into an asset purchase agreement with United Faith Auto-Engineering, a publicly-listed Chinese company, to sell its entire 34.38% outstanding equity interest in Wuxi indie Microelectronics Technology to United Faith.
Pixelworks to sell Shanghai subsidiary to VeriSilicon October 17, 2025 Pixelworks has entered into a definitive agreement to sell its shares in Pixelworks Semiconductor Technology (Shanghai) Co., Ltd. to a special purpose entity led by VeriSilicon Microelectronics (Shanghai) Co., Ltd.
GlobalWafers opens new 300mm wafer plant in Italy October 16, 2025 Taiwanese semiconductor company, GlobalWafers, has officially inaugurated FAB300, a new 300mm semiconductor wafer manufacturing facility at MEMC Electronic Materials in Novara, Italy. The company describes the site as one of Europe’s most advanced and fully integrated silicon wafer fabs.
Semiconductor innovation at Penn State gets $7.5M boost October 06, 2025 Funded through the US Defense Advanced Research Projects Agency (DARPA)’s Next-Generation Microelectronics Manufacturing (NGMM) program, the work at Penn State is part of a USD 840 million multi-institutional effort.
Space Forge Inc., United Semiconductors advance in-space chipmaking October 03, 2025 The partnership establishes a collaborative foundation for developing commercially viable in-space semiconductor manufacturing capabilities, combining Space Forge Inc.’s microgravity-enabled materials deposition processes with United Semiconductors’ expertise in ternary III-V semiconductor crystal growth and wafer processing.
GSME acquires Muse Semiconductor October 02, 2025 GS Microelectronics US, Inc. (GSME), a supplier of IC design and manufacturing solutions, has acquired Muse Semiconductor, a provider of multi-project wafer (MPW) services, enabling chip designs built on TSMC technology.
PsiQuantum breaks ground on quantum computing project in Chicago October 01, 2025 PsiQuantum has broken ground on the company’s site at the Illinois Quantum and Microelectronics Park (IQMP) in Chicago, where America’s first million-qubit scale, fault-tolerant quantum computer will be built and deployed.
Northrop Grumman opens semiconductor facilities to external partners September 23, 2025 Northrop Grumman says that its Microelectronics Center will now provide external access to the company’s three US government-accredited semiconductor manufacturing facilities. The move is intended to expand secure domestic production of defense-grade microelectronics and strengthen US supply chain.
CG Semi unveils one of India’s first end-to-end OSAT facilities August 29, 2025 CG Semi, a subsidiary of CG Power and Industrial Solutions and part of the Murugappa Group, has launched its first Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat.
Ecolab to acquire Ovivo’s electronics business for $1.8 billion August 15, 2025 The acquisition will strengthen Ecolab’s high-tech growth engine by bringing together Ovivo’s ultra-pure water technologies with Ecolab’s leading water solutions, digital technologies and global service capabilities.
Silex Microsystems returns to Swedish ownership June 16, 2025 Pure-play MEMS foundry Silex Microsystems, is once again Swedish-owned. A consortium of Swedish investors, led by Bure Equity and Creades, has entered into an agreement to acquire a majority stake in the company from the current main owner, Chinese Sai Microelectronics.
Siemens expands OSAT Alliance to boost US chip supply chains June 06, 2025 Mosaic Microsystems will use Siemens‘ EDA technologies to develop ADKs for its thin glass substrate technology, while NHanced Semiconductors will employ Siemens EDA tech to develop ADKs for their silicon interposer-based tech.
Agfa, Technica announce partnership for US Orgacon distribution June 04, 2025 Orgacon is Agfa’s advanced portfolio of conductive inks and coatings that includes coating formulations and EL-P screen inks for optical, anti-static and printed electronic applications.
AT&S opens Europe’s first IC substrate plant facility in Leoben June 04, 2025 Austrian microelectronics and PCB manufacturer AT&S has officially inaugurated Europe's first local research and production centre for IC substrates.
IIT Kharagpur, A*STAR team up to advance semiconductor innovation June 02, 2025 The MoU opens new avenues for joint research in advanced CMOS and post-CMOS technologies; heterogeneous integration and packaging; AI hardware accelerators; next-generation memory systems; photonics and quantum devices; and chip reliability, thermal management and failure analysis.
AT&S to open Europe's first advanced IC substrate facility in June May 28, 2025 AT&S is preparing to open a new high-tech production facility for advanced IC substrates and packaging technologies in Leoben, Austria. Set to officially launch in June 2025, the site will be the first of its kind in Europe and is expected to play a key role in strengthening Europe's microelectronics supply chain.
ST expands "Lab-in-Fab" initiative in Singapore May 27, 2025 STMicroelectronics says that it is partnering with the A*STAR Institute of Microelectronics (A*STAR IME) and ULVAC, to expand its “Lab-in-Fab” (LiF) in Singapore. The focus of the collaboration is to advance piezoelectric MEMS for applications in personal electronics, medical devices, and other applications.
ClassOne, IBM Research team up to develop non-NMP solvent processing May 26, 2025 The focus of the joint project will be to develop best known methods (BKMs) for non-NMP solvent processing in manufacturing IBM semiconductor devices.
Nearfield, A*STAR IME to partner on chip metrology tech research May 21, 2025 By leveraging Nearfield’s expertise in high-precision metrology and A*STAR’s cutting-edge semiconductor research, the partnership will accelerate the development of advanced metrology solutions that enable efficient AI chip production.
Chemical mechanical planarization market to reach $10.5B by 2035 May 13, 2025 This upward trajectory is driven by the increased complexity in semiconductor architectures, growing demand for miniaturized electronic components, and the expanding integration of advanced node technology across the microelectronics industry.
Germany greenlights €1B in support for Infineon's massive Dresden fab May 08, 2025 Infineon Technologies has secured final approval from the German Federal Ministry for Economic Affairs for public funding to support its EUR 5 billion investment in a new semiconductor manufacturing fab in Dresden (Smart Power Fab).
AT&S starts high-volume manufacturing at new Kulim plant May 06, 2025 IC substrate and PCB manufacturer AT&S is commencing high-volume manufacturing at its new facility in Kulim, Malaysia. AT&S Malaysia will deliver high-end IC substrates for AMD’s data centre processors, as well as for other customers.
Sophia Antipolis: Half a century of innovation and future ambitions April 24, 2025 Sophia Antipolis, Europe’s first science and technology park, marks more than 50 years of growth and innovation. During the Evertiq Expo 2025, Sylvain Rouget and Valérie Gooris from the Sophia Antipolis Foundation reflected on the park’s past achievements and its outlook for the future.
Frontgrade opens the doors to its Microelectronics Facility April 15, 2025 Frontgrade Technologies is allowing third-party access to its Colorado Springs manufacturing facility for microelectronics production. The move enables aerospace and defense programs to utilise Frontgrade’s experience in manufacturing, packaging, testing, and qualification.
UMC opens new fab expansion in Singapore April 01, 2025 Semiconductor foundry United Microelectronics Corporation (UMC) has officially opened its new fab facility in Singapore. The first phase of the new facility will start volume production in 2026, bringing UMC’s total production capacity in Singapore to more than 1 million wafers annually.
AKTANTIS strengthens deep-tech innovation and international collaboration April 01, 2025 At the Evertiq Expo 2025 in Sophia Antipolis, representatives from AKTANTIS, a deep-tech technology cluster, highlighted the organisation's role in fostering innovation, supporting startups, and facilitating international collaboration.
FAMES Pilot Line launches open-access call for EU chip industry March 25, 2025 Participants whose requests are selected will have access to FAMES technologies as they become available. Open-Access Calls will take place each spring through 2028.
The electronics market in Europe – what needs to happen? March 20, 2025 The EU Chips Act was introduced in several phases to the wider public from 2021 onwards and, following approval by the European Parliament and the Council, the regulation came into force on 21 September 2023.
Infineon aims to double India workforce to 5,000 by 2030 March 19, 2025 However, the German semiconductor firm clarified that it has no immediate plan to set up a chip manufacturing plant in India.
AT&S opens new sales office in Seoul March 13, 2025 Austrian PCB and IC substrates manufacturer AT&S is strengthening its presence in Korea with the opening of a new sales office in Seoul.
GF and MIT to advance research on essential chips for AI March 04, 2025 GlobalFoundries (GF) and the Massachusetts Institute of Technology (MIT) have entered into a new master research agreement aimed at advancing semiconductor technologies.
Penn State to set up advanced semiconductor lab February 28, 2025 The USD 4.3 million funding will help the University establish an advanced lab for semiconductor thin films and device research in the Materials Research Institute’s (MRI) facilities.