UMC opens new fab expansion in Singapore
April 01, 2025
Semiconductor foundry United Microelectronics Corporation (UMC) has officially opened its new fab facility in Singapore. The first phase of the new facility will start volume production in 2026, bringing UMC’s total production capacity in Singapore to more than 1 million wafers annually.
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AKTANTIS strengthens deep-tech innovation and international collaboration
April 01, 2025
At the Evertiq Expo 2025 in Sophia Antipolis, representatives from AKTANTIS, a deep-tech technology cluster, highlighted the organisation's role in fostering innovation, supporting startups, and facilitating international collaboration.
FAMES Pilot Line launches open-access call for EU chip industry
March 25, 2025
Participants whose requests are selected will have access to FAMES technologies as they become available. Open-Access Calls will take place each spring through 2028.
The electronics market in Europe – what needs to happen?
March 20, 2025
The EU Chips Act was introduced in several phases to the wider public from 2021 onwards and, following approval by the European Parliament and the Council, the regulation came into force on 21 September 2023.
Infineon aims to double India workforce to 5,000 by 2030
March 19, 2025
However, the German semiconductor firm clarified that it has no immediate plan to set up a chip manufacturing plant in India.
AT&S opens new sales office in Seoul
March 13, 2025
Austrian PCB and IC substrates manufacturer AT&S is strengthening its presence in Korea with the opening of a new sales office in Seoul.
GF and MIT to advance research on essential chips for AI
March 04, 2025
GlobalFoundries (GF) and the Massachusetts Institute of Technology (MIT) have entered into a new master research agreement aimed at advancing semiconductor technologies.
Penn State to set up advanced semiconductor lab
February 28, 2025
The USD 4.3 million funding will help the University establish an advanced lab for semiconductor thin films and device research in the Materials Research Institute’s (MRI) facilities.
Taiwan semiconductor market to reach $66 billion by 2031
February 28, 2025
It is anticipated that the industry will maintain strong growth to meet rising demand for semiconductor materials in emerging technologies like AI, autonomous driving, the Internet of Things, and 5G.
Saab extends research collaboration with Aalto University
February 26, 2025
Saab and Aalto University in Finland have extended their research collaboration for another 10 years, until 2036. The new agreement includes a minimum investment of EUR 10 million to ensure ongoing research in key areas vital to Saab's business.
U-M awarded up to $7.5M to develop heat-tolerant chips
February 21, 2025
Funded by the Silicon Crossroads Microelectronics Commons Hub, University of Michigan researchers are leading a collaborative effort to bring more such semiconductors to the market.
Infineon secures EU Chips Act funding for smart power fab in Dresden
February 20, 2025
Infineon Technologies has secured European Commission approval for funding under the EU Chips Act. This investment will advance its Smart Power Fab in Dresden, strengthening Europe's semiconductor industry.
EU funding strengthens semiconductor innovation in Finland
February 19, 2025
The European semiconductor industry is receiving a boost through the APECS pilot line project, which has been awarded funding under the EU Chips Act. This initiative focuses on developing and providing new packaging and integration solutions for the industry.
Kokoon-IA: transforming senior care with ethical AI
January 16, 2025
Nodeus Solutions, a startup rooted in the innovation hub of Sophia Antipolis, is setting a new standard in e-health with Kokoon-IA. The system empowers seniors living independently by providing non-intrusive health monitoring while prioriting dignity and privacy.
SkyWater secures $16 million in federal funds
December 09, 2024
Minnesota chip manufacturer SkyWater will use USD 127 million, including USD 19 million in matching state funds, to improve its infrastructure and cybersecurity systems, among other upgrades.
ULVAC, SAL partner to develop tech for making TFLN
December 09, 2024
SAL, an Austrian research center for Electronics and Software Based Systems, is implementing ULVAC’s plasma etching system Model “NLD-5700” to advance R&D of thin-film lithium niobate (TFLN).
Germany plans $2.1 billion in new chip subsidies
December 02, 2024
The Ministry of Economic Affairs plans to use the newly proposed funds to support 10 to 15 projects, ranging from wafer production to microchip assembly, the Bloomberg report says.
Microelectronics hubs get $160 million in fresh DoD funding
November 15, 2024
Most of the new funding will go to the eight established Microelectronics Commons Hubs that focus on building infrastructure, supporting operations and accelerating workforce developments.
Continental and Novosense partner to advance vehicle safety systems
November 14, 2024
Semiconductor company Novosense Microelectronics and Continental Automotive Technologies are teaming up to collaborate on the development of automotive-grade sensors to advance safety in-vehicle systems.
Applied Materials and NUS expand semiconductor lab
October 29, 2024
Applied Materials South East Asia Pte. Ltd. and the National University of Singapore (NUS) are furthering their collaboration to bring advanced semiconductor research capabilities and talent development opportunities to Singapore.
Russia to spend $2.5 billion on domestic chipmaking tool tech
October 14, 2024
The initiative includes launching 110 R&D projects to reduce dependence on imported wafer fab tools and make chips on a 28nm-class process technology.
Jacobs secures design contract for CG Semi’s OSAT unit in Gujarat
October 11, 2024
As the project’s EPCS partner for the mini Line and the engineering partner for the main Line, Jacobs will play a critical role in helping CG Semi establish the semiconductor hub.
Zeiss opens semiconductor applications lab in Dresden
October 10, 2024
Zeiss has recently opened the Zeiss Microscopy semiconductor applications lab in Dresden, a new facility dedicated to addressing physical analysis challenges and pushing the limits of nanoscale analysis with the Zeiss Crossbeam focused ion beam-scanning electron microscope (FIB-SEM).
UMC and Ngee Ann Polytechnic to strengthen semiconductor talent pipeline
October 01, 2024
UMC’s Singapore fab expansion is set to begin operations in 2026, and is expected to create significant job opportunities for engineering talents. The company has signed a Memorandum of Understanding (MOU) with Ngee Ann Polytechnic (NP) to enhance training for engineering talents and expand the workforce for the semiconductor industry.
NC State University gets $19 million funding for chip research
September 20, 2024
The amount will fund four additional projects for the Commercial Leap Ahead for Wide Bandgap Semiconductors (CLAWS) Microelectronics Hub.
A*STAR and Applied Materials to open joint lab
September 10, 2024
The Agency for Science, Technology and Research (A*STAR) has partnered with Applied Materials to establish a joint lab aimed at developing innovative, cost-effective solutions for semiconductor equipment and strengthening the local chip ecosystem.
NEOTech upgrades with new microelectronics and SMT expansion
August 28, 2024
US EMS provider NEOTech is enhancing its manufacturing edge through a new integrated microelectronics and SMT assembly expansion
Weeroc pledges $4.5 million for Malaysian expansion
July 25, 2024
France's fabless microelectronics company Weeroc has signed a letter of intent with the Selangor Information Technology & Digital Economy Corporation (Sidec).
Rogue Valley Microdevices bags $6.7m from US Chips Act
July 25, 2024
Florida-headquartered Rogue Valley Microdevices (RVM) has secured government support to build a pure play microelectromechanical systems (MEMS) and sensor foundry facility.
Texas University secures $840m for semiconductor research
July 22, 2024
The US government has selected the Texas Institute for Electronics (TIE) at The University of Texas to develop next-gen chips for the Department of Defense.
Melexis opens its largest wafer testing plant
July 15, 2024
Belgian microelectronics engineering firm Melexis has opened a 4,500 square metre wafer testing facility in Kuching, Malaysia. It says the architect-designed plant is its biggest to date.
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