IIT Kharagpur, A*STAR team up to advance semiconductor innovation
June 02, 2025
The MoU opens new avenues for joint research in advanced CMOS and post-CMOS technologies; heterogeneous integration and packaging; AI hardware accelerators; next-generation memory systems; photonics and quantum devices; and chip reliability, thermal management and failure analysis.
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AT&S to open Europe's first advanced IC substrate facility in June
May 28, 2025
AT&S is preparing to open a new high-tech production facility for advanced IC substrates and packaging technologies in Leoben, Austria. Set to officially launch in June 2025, the site will be the first of its kind in Europe and is expected to play a key role in strengthening Europe's microelectronics supply chain.
ST expands "Lab-in-Fab" initiative in Singapore
May 27, 2025
STMicroelectronics says that it is partnering with the A*STAR Institute of Microelectronics (A*STAR IME) and ULVAC, to expand its “Lab-in-Fab” (LiF) in Singapore. The focus of the collaboration is to advance piezoelectric MEMS for applications in personal electronics, medical devices, and other applications.
ClassOne, IBM Research team up to develop non-NMP solvent processing
May 26, 2025
The focus of the joint project will be to develop best known methods (BKMs) for non-NMP solvent processing in manufacturing IBM semiconductor devices.
Nearfield, A*STAR IME to partner on chip metrology tech research
May 21, 2025
By leveraging Nearfield’s expertise in high-precision metrology and A*STAR’s cutting-edge semiconductor research, the partnership will accelerate the development of advanced metrology solutions that enable efficient AI chip production.
Chemical mechanical planarization market to reach $10.5B by 2035
May 13, 2025
This upward trajectory is driven by the increased complexity in semiconductor architectures, growing demand for miniaturized electronic components, and the expanding integration of advanced node technology across the microelectronics industry.
Germany greenlights €1B in support for Infineon's massive Dresden fab
May 08, 2025
Infineon Technologies has secured final approval from the German Federal Ministry for Economic Affairs for public funding to support its EUR 5 billion investment in a new semiconductor manufacturing fab in Dresden (Smart Power Fab).
AT&S starts high-volume manufacturing at new Kulim plant
May 06, 2025
IC substrate and PCB manufacturer AT&S is commencing high-volume manufacturing at its new facility in Kulim, Malaysia. AT&S Malaysia will deliver high-end IC substrates for AMD’s data centre processors, as well as for other customers.
Sophia Antipolis: Half a century of innovation and future ambitions
April 24, 2025
Sophia Antipolis, Europe’s first science and technology park, marks more than 50 years of growth and innovation. During the Evertiq Expo 2025, Sylvain Rouget and Valérie Gooris from the Sophia Antipolis Foundation reflected on the park’s past achievements and its outlook for the future.
Frontgrade opens the doors to its Microelectronics Facility
April 15, 2025
Frontgrade Technologies is allowing third-party access to its Colorado Springs manufacturing facility for microelectronics production. The move enables aerospace and defense programs to utilise Frontgrade’s experience in manufacturing, packaging, testing, and qualification.
UMC opens new fab expansion in Singapore
April 01, 2025
Semiconductor foundry United Microelectronics Corporation (UMC) has officially opened its new fab facility in Singapore. The first phase of the new facility will start volume production in 2026, bringing UMC’s total production capacity in Singapore to more than 1 million wafers annually.
AKTANTIS strengthens deep-tech innovation and international collaboration
April 01, 2025
At the Evertiq Expo 2025 in Sophia Antipolis, representatives from AKTANTIS, a deep-tech technology cluster, highlighted the organisation's role in fostering innovation, supporting startups, and facilitating international collaboration.
FAMES Pilot Line launches open-access call for EU chip industry
March 25, 2025
Participants whose requests are selected will have access to FAMES technologies as they become available. Open-Access Calls will take place each spring through 2028.
The electronics market in Europe – what needs to happen?
March 20, 2025
The EU Chips Act was introduced in several phases to the wider public from 2021 onwards and, following approval by the European Parliament and the Council, the regulation came into force on 21 September 2023.
Infineon aims to double India workforce to 5,000 by 2030
March 19, 2025
However, the German semiconductor firm clarified that it has no immediate plan to set up a chip manufacturing plant in India.
AT&S opens new sales office in Seoul
March 13, 2025
Austrian PCB and IC substrates manufacturer AT&S is strengthening its presence in Korea with the opening of a new sales office in Seoul.
GF and MIT to advance research on essential chips for AI
March 04, 2025
GlobalFoundries (GF) and the Massachusetts Institute of Technology (MIT) have entered into a new master research agreement aimed at advancing semiconductor technologies.
Penn State to set up advanced semiconductor lab
February 28, 2025
The USD 4.3 million funding will help the University establish an advanced lab for semiconductor thin films and device research in the Materials Research Institute’s (MRI) facilities.
Taiwan semiconductor market to reach $66 billion by 2031
February 28, 2025
It is anticipated that the industry will maintain strong growth to meet rising demand for semiconductor materials in emerging technologies like AI, autonomous driving, the Internet of Things, and 5G.
Saab extends research collaboration with Aalto University
February 26, 2025
Saab and Aalto University in Finland have extended their research collaboration for another 10 years, until 2036. The new agreement includes a minimum investment of EUR 10 million to ensure ongoing research in key areas vital to Saab's business.
U-M awarded up to $7.5M to develop heat-tolerant chips
February 21, 2025
Funded by the Silicon Crossroads Microelectronics Commons Hub, University of Michigan researchers are leading a collaborative effort to bring more such semiconductors to the market.
Infineon secures EU Chips Act funding for smart power fab in Dresden
February 20, 2025
Infineon Technologies has secured European Commission approval for funding under the EU Chips Act. This investment will advance its Smart Power Fab in Dresden, strengthening Europe's semiconductor industry.
EU funding strengthens semiconductor innovation in Finland
February 19, 2025
The European semiconductor industry is receiving a boost through the APECS pilot line project, which has been awarded funding under the EU Chips Act. This initiative focuses on developing and providing new packaging and integration solutions for the industry.
Kokoon-IA: transforming senior care with ethical AI
January 16, 2025
Nodeus Solutions, a startup rooted in the innovation hub of Sophia Antipolis, is setting a new standard in e-health with Kokoon-IA. The system empowers seniors living independently by providing non-intrusive health monitoring while prioriting dignity and privacy.
SkyWater secures $16 million in federal funds
December 09, 2024
Minnesota chip manufacturer SkyWater will use USD 127 million, including USD 19 million in matching state funds, to improve its infrastructure and cybersecurity systems, among other upgrades.
ULVAC, SAL partner to develop tech for making TFLN
December 09, 2024
SAL, an Austrian research center for Electronics and Software Based Systems, is implementing ULVAC’s plasma etching system Model “NLD-5700” to advance R&D of thin-film lithium niobate (TFLN).
Germany plans $2.1 billion in new chip subsidies
December 02, 2024
The Ministry of Economic Affairs plans to use the newly proposed funds to support 10 to 15 projects, ranging from wafer production to microchip assembly, the Bloomberg report says.
Microelectronics hubs get $160 million in fresh DoD funding
November 15, 2024
Most of the new funding will go to the eight established Microelectronics Commons Hubs that focus on building infrastructure, supporting operations and accelerating workforce developments.
Continental and Novosense partner to advance vehicle safety systems
November 14, 2024
Semiconductor company Novosense Microelectronics and Continental Automotive Technologies are teaming up to collaborate on the development of automotive-grade sensors to advance safety in-vehicle systems.
Applied Materials and NUS expand semiconductor lab
October 29, 2024
Applied Materials South East Asia Pte. Ltd. and the National University of Singapore (NUS) are furthering their collaboration to bring advanced semiconductor research capabilities and talent development opportunities to Singapore.
Russia to spend $2.5 billion on domestic chipmaking tool tech
October 14, 2024
The initiative includes launching 110 R&D projects to reduce dependence on imported wafer fab tools and make chips on a 28nm-class process technology.
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