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When is the most critical phase in the launch of a new electronic product? Is it development, which regularly takes place under great time and cost pressure? Or is it the transition to series production, when large quantities of components have to be delivered quickly - with precisely specified characteristics and exact timing? Each of these phases confronts companies with its own challenges. The support of a competent and reliable distributor often makes all the difference.
Hitachi and Sagar Semi agree MoU on high-power devices
April 19, 2024
Hitachi's Power Semiconductor Device (HPSD) division has agreed a deal to help India's Sagar Semiconductors to build a new facility to produce high-voltage semiconductors for the automotive industry.
Infineon launches innovation centre with Anker
January 26, 2024
Germany's Infineon and China's Anker Innovations have opened a new R&D lab in Shenzhen. It will research fast charging solutions based on Infineon’s Hybrid Flyback (HFB) controller product family.
X-FAB acquires M-MOS
January 02, 2024
X-FAB Silicon Foundries SE announces the acquisition of M-MOS Semiconductor Hong Kong Limited, a fabless company focused on the development of MOSFET technologies.
STMicroelectronics to supply SiC chips to Li Auto
December 22, 2023
Chinese EV manufacturer Li Auto has signed a silicon carbide (SiC) power chip supply agreement with European chipmaker STMicroelectronics.
Magnachip now mass producing field-effect transistors
December 18, 2023
South Korea's Magnachip Semiconductor Corporation has started manufacturing its new 30V MXT LV metal-oxide semiconductor field-effect transistors as it scales up its business in the automative sector.
Mitsubishi Electric and Nexperia to develop SiC power semiconductors
November 13, 2023
Mitsubishi Electric says that it will enter into a strategic partnership with Nexperia B.V. to jointly develop silicon carbide (SiC) power semiconductors for the power electronics market.
Adding a flexible current limit
October 25, 2023
Question: Could I easily and precisely limit a current to my load?
Sponsored content by Diotec Semiconductor AG
What Do Smart Meters, Electric Cars and Notebooks Have in Common? Diotec Knows the Answer!
For 50 years now, Diotec Semiconductor AG has been a specialist in the design and manufacturing of discrete semiconductor components. With our headquarters in Heitersheim, Germany, we are experts in the design and manufacturing of discrete semiconductor components. Our Diodes, Rectifiers, Transistors, LDOs and MOSFETs are ideally suited for a wide range of applications. We have four manufacturing locations on three continents and are proud of a worldwide network of sales and support offices.
XSemi to transfer its IC and SiC product lines to Foxconn
June 12, 2023
Hon Hai Technology Group (otherwise known as Foxconn) and Yageo Group say that XSemi Corporation, the semiconductor joint venture of the two companies, will transfer its IC and SiC product and module business to Hon Hai’s newly set up IC design subsidiary for an all-cash consideration of NTD 204 million (USD 6.63 million).
onsemi and Zeeker ink long-term supply deal for SiC power devices
April 26, 2023
onsemi and electric mobility brand Zeeker have entered into a long-term supply agreement under which onsemi will provide its EliteSiC silicon carbide power devices to increase the powertrain efficiency of Zeeker's smart EVs.
ZF signs multi-year supply deal with STMicroelectronics
April 14, 2023
From 2025, ZF will purchase silicon carbide devices from STMicroelectronics. Under the terms of the multi-year contract, ST will supply a volume of double-digit millions of SiC devices to be integrated in ZF’s new modular inverter architecture going into series production in 2025.
Sponsored content by Diotec Semiconductor AG
What Do Smart Meters, Electric Cars and Notebooks Have in Common? Diotec Knows the Answer!
For 50 years now, Diotec Semiconductor AG has been a specialist in the design and manufacturing of discrete semiconductor components. With our headquarters in Heitersheim, Germany, we are experts in the design and manufacturing of discrete semiconductor components. Our Diodes, Rectifiers, Transistors, LDOs and MOSFETs are ideally suited for a wide range of applications. We have four manufacturing locations on three continents and are proud of a worldwide network of sales and support offices.
SiC power device market will surpass $2.2 billion in 2023
March 09, 2023
The market for third-generation (compound) semiconductors encompasses products based on silicon carbide (SiC) and gallium nitride (GaN). In particular, SiC products account for about 80% of the total market value.
Toshiba to expand power semiconductor production capacity
December 19, 2022
Toshiba Electronic Devices & Storage Corporation says that it will construct a new back-end production facility for power semiconductors at its Himeji Operations – Semiconductor, in Hyogo Prefecture in western Japan.
TrendForce lists five tech industry trends for 2023
October 11, 2022
TrendForce is detailing 10 major trends that are expected to take place across various segments in the tech industry.
Allegro completes acquisition of Heyday Integrated Circuits
September 02, 2022
Allegro MicroSystems has completed its previously-announced acquisition of Heyday Integrated Circuits (Heyday).
2022 will see a focus on 12-inch capacity expansion
June 23, 2022
TrendForce says that global wafer foundry capacity will increase by approximately 14% annually in 2022.
Farnell expands Toshiba portfolio to support design engineers
June 15, 2022
The global distributor says that it has strengthened its global partnership with Toshiba Electronics Europe GmbH (Toshiba), resulting in a significant product line expansion and increased stock holding.
Foxconn and Yageo JV invests in Taiwan MOSFET manufacturer
May 24, 2022
Hon Hai Technology Group (more commonly know as Foxconn) and Yageo Group have – via their joint venture XSemi – invested NTD 2.89 billion (EUR 91.6 million) in Taiwanese MOSFET manufacturer Advanced Power Electronics Corp.
Renesas to convert closed factory to 300mm wafer fab
May 17, 2022
Renesas plans to conduct a JPY 90 billion (EUR 664 million) investment in its Kofu factory, located in Kai City, Yamanashi Prefecture, Japan. The company closed the factory back in October 2014, but now intends to reopen the fab in 2024 as a 300mm wafer fab.
Wolfspeed invests in new tools to ramp 200mm production
March 15, 2022
Aixtron says that Wolfspeed will deploy the company's 200mm Planetary Reactor technology in the manufacturing of SiC based MOSFET and Schottky diode power devices at its production facilities.
Third gen power semiconductor CAGR to reach 48% by 2025
March 10, 2022
TrendForce research estimates, the output value of third generation power semiconductors will grow from USD 980 million in 2021 to USD 4.71 billion in 2025, with a CAGR of 48%.
Intel's acquisition of Tower – two birds with one stone
February 16, 2022
Intel officially confirmed on February 15 that it will acquire Israeli foundry Tower Semiconductor for nearly USD 6 billion, and the deal will likely contribute to the growth of Intel’s foundry business if it closes successfully, TrendForce reports.
8-inch wafer capacity remains tight, shortage to ease in 2H23
February 08, 2022
From 2020 to 2025, the compound annual growth rate (CAGR) of 12-inch equivalent wafer capacity at the world's top ten foundries will be approximately 10% – with the majority of these companies focusing on 12-inch capacity expansion, which will see a CAGR of approximately 13.2%, according to TrendForce’s research.
Revenue of micro LED large-sized display chips to reach $4.5B in 2026
January 21, 2022
Micro LED large-sized displays will move towards the home theatre and high-end commercial display markets and the revenue of Micro LED large-sized display chips is estimated to reach USD 54 million in 2022, according to TrendForce’s latest research.
A*STAR and Soitec to develop next-gen SiC semiconductors
January 11, 2022
The Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) and Soitec have entered into a research collaboration with the aim of developing next-generation silicon carbide (SiC) semiconductor devices to power electric vehicles.
Component shortage continues to impact device shipments
January 10, 2022
Driven by forces such as the pandemic, geopolitics, and the digital transformation of everyday life, there has been a shortage of global foundry production capacity for nearly two years and shortages have been especially severe for mature 1Xnm~180nm nodes, according to TrendForce’s investigations.
Showa Denko to supply SiC epitaxial wafers to Toshiba
September 29, 2021
Showa Denko K.K. concluded a long-term supply contract with Toshiba Electronic Devices & Storage Corporation to supply SiC epitaxial wafers for power semiconductors (SiC epi-wafers) for two and a half years with an optional extension clause.
Infineon & Blixt collaborate to accelerate growth of SSCB's
September 22, 2021
Infineon Technologies and Swedish company Blixt Tech AB have entered an agreement to co-develop solid state circuit breakers (SSCB) based on Infineon's product portfolio.
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