RAFI ELTEC supplies key technology for TU Dresden’s new supercomputer
May 23, 2025
RAFI ELTEC GmbH, based in Überlingen, has played a crucial role in the development of one of Europe’s most advanced neuromorphic computing systems. The “SpiNNcloud” supercomputer, developed at TU Dresden under the direction of Professor Christian Mayr, is now officially operational. As a key industrial partner, RAFI ELTEC was responsible for producing highly complex, customized circuit boards based on the innovative SpiNNaker2 chip.
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Germany greenlights €1B in support for Infineon's massive Dresden fab
May 08, 2025
Infineon Technologies has secured final approval from the German Federal Ministry for Economic Affairs for public funding to support its EUR 5 billion investment in a new semiconductor manufacturing fab in Dresden (Smart Power Fab).
Jenoptik opens the doors to its new fab in Dresden
May 07, 2025
After around two and a half years of construction, Jenoptik has completed its largest single investment in recent history and officially inaugurated its new fab in Dresden, Germany.
NCAB acquires Germany's B&B Leiterplattenservice
April 23, 2025
NCAB has signed an agreement to acquire 100% of B&B Leiterplattenservice GmbH (B&B) headquartered in Mittweida, west of Dresden.
Gradiant secures 2nd semiconductor water treatment project in Dresden
March 14, 2025
The Boston-headquartered water and wastewater treatment company Gradiant also announced the full integration of H+E into the Gradiant brand.
Infineon secures EU Chips Act funding for smart power fab in Dresden
February 20, 2025
Infineon Technologies has secured European Commission approval for funding under the EU Chips Act. This investment will advance its Smart Power Fab in Dresden, strengthening Europe's semiconductor industry.
Chipmetrics set up Dresden-based subsidiary
January 23, 2025
Chipmetrics has officially launched its new Dresden-based German subsidiary, Chipmetrics GmbH. Originally hailing from Joensuu in Finland, 2025 is set to be an important year for the company as it aims to aggressively scale both sales and marketing of its 3D semiconductor metrology products.
Zeiss opens semiconductor applications lab in Dresden
October 10, 2024
Zeiss has recently opened the Zeiss Microscopy semiconductor applications lab in Dresden, a new facility dedicated to addressing physical analysis challenges and pushing the limits of nanoscale analysis with the Zeiss Crossbeam focused ion beam-scanning electron microscope (FIB-SEM).
Taiwan and Czechia plan to build EU semiconductor cluster
September 02, 2024
Taiwan’s National Security Council Secretary-General Joseph Wu said as TSMC builds an advanced wafer fab in Dresden, Germany, it needs a comprehensive supply chain in Europe.
TSMC gets $1.96 billion subsidy boost from Japan and China
August 26, 2024
These funds are mainly for real estate, equipment and plant purchases, and to offset building and operational costs.
ESMC officially breaks ground on Dresden fab
August 20, 2024
Ground has been broken and the land preparation for ESMC's first semiconductor fab in Dresden, Germany has officially started.
EU approves €5 billion subsidy to support TSMC's German fab
August 20, 2024
The European Commission has approved, under EU State aid rules, a EUR 5 billion German measure to support European Semiconductor Manufacturing Company (ESMC) in the construction and operation of a microchip manufacturing plant in Dresden.
Construction at TSMC's Dresden plant could be weeks away
July 30, 2024
Work at TSMC's German facility has been delayed many times, but new reports suggest it is almost ready to break ground.
EV Group and Fraunhofer IZM-ASSID expand partnership
June 18, 2024
Wafer bonding and lithography equipment supplier EV Group (EVG) has entered into a strategic partnership with Fraunhofer IZM-ASSID (All Silicon System Integration Dresden), to develop and optimise alternative bonding and debonding technologies for advanced CMOS and heterogeneous integration applications, including quantum computing.
Green light for the final phase of Infineon's smart power fab
June 04, 2024
Infineon Technologies is on schedule with the construction of the Smart Power Fab in Dresden and is initiating the final construction phase.
TSMC to start construction of European plant this year
May 22, 2024
TSMC is reportedly planning to start construction of its first European manufacturing facility during the fourth quarter of 2024.
TSMC on track to mass produce 3nm chips this year
May 17, 2024
The world's biggest chip maker, TSMC, it set to make 3mn chips in the second half of 2024 following successful testing of its N3E process.
Fraunhofer to expand its collaboration with South Korea
April 30, 2024
Working together to expedite technological innovations in the fields of battery cell and semiconductor technology. That is the aim of an international collaboration program funded by the Korean Ministry of Trade, Industry and Energy (MOTIE).
Quanta Computer to build production facility in Germany
April 17, 2024
Taiwanese Quanta Computer has signed a deal with CTP, a European developer and manager of industrial properties, for a high-tech 22,500 square metre production facility at CTPark Jülich in the Brainergy Park Jülich in northwest Germany.
Moov launches EU expansion
March 13, 2024
Moov, a company operating a marketplace for used semiconductor equipment, has hired Eric Tribolet as Director of European Sales, to help the company expand its presence in European markets.
Taiwanese firms target Czech Republic for chip production
February 02, 2024
Business groups from Taiwan and the Czech Republic have signed a memorandum of understanding (MOU) to explore semiconductor manufacturing in the region.
SCIO Automation completes takeover of Fabmatics
January 26, 2024
Germany's SCIO Automation has boosted its clean room offering with the acquisition of intralogistics specialist Fabmatics.
TSMC pushes back opening of Arizona plant for a second time
January 19, 2024
Taiwanese chip maker TSMC says a shortage of specialist workers has forced it to delay the opening of its second factory in Arizona from 2025 to 2027 or 2028.
Amkor and GlobalFoundries kickstart European partnership
January 16, 2024
Amkor Technology and GlobalFoundries have officially kicked off their strategic partnership in Europe with a ribbon-cutting ceremony at Amkor's Porto, Portugal, facility today January 16, 2024.
Jenoptik invest in high-tech equipment for Dresden fab
January 11, 2024
Jenoptik says that it is investing a low double-digit million-euro amount in a new electron-beam lithography system for the high-tech fab currently under construction in Dresden.
Christian Koitzsch to head TSMC's European operation
January 05, 2024
Christian Koitzsch has left Bosch to become the president of TSMC's under-construction subsidiary in Dresden, Germany.
X-FAB acquires M-MOS
January 02, 2024
X-FAB Silicon Foundries SE announces the acquisition of M-MOS Semiconductor Hong Kong Limited, a fabless company focused on the development of MOSFET technologies.
Infineon CEO Jochen Hanebeck becomes new ESIA President
December 11, 2023
Jochen Hanebeck, CEO of Infineon Technologies, was named the new ESIA President for a two-year mandate at the General Assembly of the European Semiconductor Industry Association (ESIA). Hanebeck is succeeding NXP Semiconductors’ President and CEO Kurt Sievers.
German court ruling 'could cost Intel billions'
November 24, 2023
A decision to cancel German government funding of climate-related projects is threatening Intel's plans to build manufacturing plants in Saxony-Anhalt.
Germany clears Bosch, Infineon and NXP stakes in TSMC fab
November 07, 2023
The German cartel office (the Bundeskartellamt) has cleared plans by Bosch, Infineon and NXP to each acquire 10% of the shares in European Semiconductor Manufacturing Company (ESMC), a company established by TSMC.
TSMC’s global expansion is on track
October 25, 2023
During its 3Q23 earning call, semiconductor behemoth TSMC provided some updates on its global expansion. The company's new fab in Phoenix, Arizona, USA, is on track to commence production in the first half of 2025
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