Claus Aasholm: “The semiconductor cycle is broken”
July 02, 2025
During Evertiq Expo Malmö 2025, Claus Aasholm, founder of Semiconductor Business Intelligence, offered a sobering reassessment of the global semiconductor market. In his keynote and follow-up interview, Aasholm argued that the industry’s historical four-year cycle has broken down – replaced by a fragmented, profit-driven upswing felt by only a select few.
Ad
Struggling US chipmaker Wolfspeed files for bankruptcy
July 01, 2025
Upon emergence from the process, it expects to have reduced its overall debt by about 70%, representing a reduction of USD 4.6 billion and a reduction of its annual total cash interest payments by approximately 60%.
World’s largest Sand Battery now in operation in Finland
July 01, 2025
The Sand Battery, developed by Finnish company Polar Night Energy, is a high-temperature thermal energy storage system that stores clean and affordable electricity as heat in sand or similar solid materials.
SEALSQ partners with ColibriTD, Xdigit to develop solution for wafer yields
June 30, 2025
The solution aims to significantly improve wafer yield for advanced semiconductor designs at nodes below 7nm by addressing IR Drop issues. It features an advanced mathematical modeling of IR Drop and leverages quantum computing’s ability to solve the resulting complex Partial Differential Equations.
NXP Semiconductors completes acquisition of TTTech Auto
June 27, 2025
The open and modular offering of the NXP CoreRide platform and TTTech Auto’s MotionWise safety middleware helps automakers overcome software and hardware integration barriers, while reducing complexity and development efforts and increasing scalability and cost-efficiency required for next-generation vehicles.
Advanced chip capacity to surge 69% by 2028 on AI demand
June 26, 2025
The global semiconductor industry is expected to significantly expand its advanced manufacturing capacity through 2028, driven by accelerating demand for artificial intelligence applications, according to SEMI’s latest 300mm Fab Outlook report.
Mindgrove partners with Bosch to enhance chip design solutions
June 26, 2025
Indian fabless firm Mindgrove will provide Bosch with chips and boards for field deployment and testing, supported with engineering and logistics assistance. Data generated from these deployments will be used for improvements.
Xanadu opens advanced photonic packaging facility in Ontario
June 25, 2025
Canadian quantum computing company Xanadu has opened a CAD 10 million advanced photonic packaging facility at its headquarters in Toronto. The new site, described as the first of its kind in Canada, aims to strengthen the country’s domestic quantum supply chain and manufacturing capabilities.
Nordic Semiconductor acquires Memfault
June 25, 2025
Nordic Semiconductor acquires its long-term partner, Memfault Inc., a cloud platform provider for large-scale deployments of connected products. Through the acquisition Nordic Semi takes the step from a hardware supplier to a complete solution partner.
Cybersecurity in IoT: Mandatory from August 2025
June 24, 2025
From 1 August 2025, all new radio-connected devices entering the EU market must comply with strict cybersecurity standards. What does this mean, and how can manufacturers prepare? We explored the topic at Evertiq Expo Krakow 2025.
Claus Aasholm on the ripples and tsunamis in the chip supply chain
June 23, 2025
“This tide does not lift all boats” – Aasholm warns of structural industry shifts driven by AI, geopolitics and China’s quiet semiconductor conquest.
Report: Apple considers using AI to design its chips
June 20, 2025
Johny Srouji, Apple’s senior vice president of hardware technologies, said one of the key lessons the tech giant learned was that it needed to use the most cutting-edge tools available to design its chips.
Inventory weighs on Top 5 enterprise SSD vendors in 1Q25
June 19, 2025
TrendForce’s latest investigations reveal that several negative factors weighed on the enterprise SSD market in the first quarter of 2025. These include production challenges for next-gen AI systems and persistent inventory overhang in North America.
Voltfang raises €15M to boost grid resilience across Europe
June 19, 2025
With this new capital, German cleantech startup Voltfang aims to scale its production capacities and deliver an additional 250 megawatt-hours of sustainable battery storage across Europe by the end of 2026.
LG Chem, Noritake co-develop paste for automotive power semiconductors
June 19, 2025
The silver paste co-developed by LG Chem and Noritake is a high-performance paste containing nano-sized silver (Ag) particles, combining LG Chem’s particle engineering technology with Noritake’s particle dispersion expertise.
TI to invest $60 billion is US manufacturing expansion
June 18, 2025
Texas Instruments plans to invest more than USD 60 billion in US-based semiconductor manufacturing, marking what the company describes as the largest investment in foundational chip production in US history. The investment spans seven fabs across three major sites in Texas and Utah and is expected to support more than 60,000 new jobs.
Sparc Foundry secures €17.2M public funding for photonic chip plant
June 18, 2025
Sparc Foundry, a Spanish startup focused on photonic semiconductors, has received a EUR 17.2 million capital injection from the Spanish Society for Technological Transformation (SETT). The funding has been approved by the Council of Ministers under the national PERTE Chip initiative and represents 43.9% of the company's capital expansion.
Trymax installs 500th process chamber in Asia
June 17, 2025
Trymax Semiconductor Equipment has reached a key milestone with the installation of its 500th process chamber in Asia. The Dutch company, known for its plasma- and UV-based solutions for semiconductor manufacturing, reported continued demand from regional markets including China, Taiwan, South Korea, Malaysia, and the Philippines.
Applied Materials and CEA-Leti expand joint lab
June 17, 2025
Applied Materials and CEA-Leti have entered what they call the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors. Under a memorandum of understanding (MOU), the companies plan to expand their joint lab and develop materials engineering solutions to address emerging infrastructure challenges in AI data centres.
InCore unveils SoC generator: from idea to FPGA validation in minutes
June 17, 2025
At the heart of this innovation is Indian fabless semiconductor startup InCore’s SoC Generator, a powerful automation platform built to radically simplify and accelerate SoC development.
Taiwan adds China’s Huawei and SMIC to export control list
June 16, 2025
The two Chinese companies, who are already on a US trade blacklist, have been put on Taiwan’s “Strategic High-Tech Commodities Entity List” together with many of their international subsidiaries.
FlexGen partners with Rosendin to deliver BESS solution for data centers
June 16, 2025
The project will integrate proprietary technology and innovations from both Rosendin and FlexGen, including Rosendin’s BESSUPS design and method patent and FlexGen’s Soft Grid Interconnection and Island Grid Transient Frequency Stabilization patents.
Report: Crusoe to buy $400M worth of AMD chips for AI data centers
June 13, 2025
The 13,000 AMD MI355X chips Crusoe plans to purchase include high-bandwidth memory, making them suitable for running AI applications.
Trump's first onshoring win isn’t the iPhone – it's the AI server
June 12, 2025
As Nikkei Asia reports in a new investigation, the US is quietly assembling a domestic supply chain for one of the most complex machines in the world: the AI server. And while Apple has resisted political pressure to move iPhone production onshore, a host of data centre suppliers – including Foxconn, Wistron, TSMC and SK Hynix – are rapidly expanding their US footprint to serve customers like Nvidia, Microsoft and Amazon.
Micron commits $200B to US DRAM and AI memory manufacturing
June 12, 2025
Micron Technology will expand its US investment to approximately USD 150 billion in memory manufacturing and USD 50 billion in R&D, marking one of the largest semiconductor initiatives since the CHIPS Act.
NXP reportedly to close four 8-inch fabs in shift toward 12-inch production
June 11, 2025
NXP Semiconductors is reportedly planning to shut down four of its 8-inch (200mm) wafer fabrication plants – one in the Netherlands and three in the United States — as part of a strategic transition to 12-inch (300mm) wafer production.
ERS electronic opens demonstration centre in Taiwan
June 10, 2025
ERS electronic GmbH has opened a new demonstration centre in Zhubei, Taiwan, aimed at supporting the rising demand for panel-level packaging (PLP) in the region.
GENESIS project launches to steer Europe towards sustainable chipmaking
June 09, 2025
With a budget of close to €55 million, GENESIS will drive innovative solutions in emission control, eco-friendly materials such as alternatives to PFAS-based ones, waste minimization, and raw material reuse.
GF looks to reshore chipmaking in $16B US investment
June 04, 2025
Working with the Trump administration and supported by tech companies seeking to onshore critical supply chain components, GlobalFoundries plans to invest USD 16 billion to expand its manufacturing and advanced packaging capabilities in New York and Vermont.
Europe’s declining PCB and EMS production threatens security
June 04, 2025
The German Electrical and Electronic Manufacturers' Association (ZVEI) warns that the ongoing decline in PCB and electronics manufacturing services (EMS) in Europe threatens both security and technological sovereignty.
AT&S opens Europe’s first IC substrate plant facility in Leoben
June 04, 2025
Austrian microelectronics and PCB manufacturer AT&S has officially inaugurated Europe's first local research and production centre for IC substrates.
Load more news