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Migdal-Haemek-Plant

October 22, 2026
Semtech will invest in dedicated silicon germanium (SiGe) capacity at Tower Semiconductor under an expanded multi-year agreement. The capacity spans Tower’s fabs in the US, Israel and Japan and will support Semtech’s growing business in optical and copper interconnect components for AI data centres.

Sponsored content by TME Transfer Multisort Elektronik

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Contemporary communication has been dominated by wireless systems. Electronics increasingly rely on data exchange without the use of cables. This applies to household appliances, as well as industrial, medical automation, and Internet of Things solutions. One of the most commonly used short-range communication standards is Bluetooth, particularly its energy-efficient variant, Bluetooth Low Energy (BLE), which allows for the construction of compact battery-powered devices.

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fab_Singapore

September 28, 2026
VisionPower Semiconductor Manufacturing Company (VSMC) is a joint venture established by Vanguard International Semiconductor Corporation and NXP Semiconductors. Following 22 months of construction, the fab successfully processed its first sample lot.

Nexperia-deal

September 23, 2026
Nexperia has announced a strategic partnership with Tata Electronics covering wafer fabrication, assembly and test, and technology development across two sites in India.

CEO-vincent-Roche

September 10, 2026
Analog Devices has announced a definitive agreement to acquire Alif Semiconductor in an all-cash transaction valued at USD 1.35 billion, with potential additional contingent consideration of up to USD 200 million. The deal is expected to close before the end of 2026.

M4VGroup

September 07, 2026
The TXZ+ Family Entry-Class M4V Group feature an Arm Cortex-M4 core with a floating-point unit to enhance security and data management in IoT devices and industrial equipment.

September 01, 2026
Diodes Incorporated has completed the acquisition of ElevATE Semiconductor, a San Diego-based fabless semiconductor company specialising in integrated circuits for the automated test equipment market. The all-cash transaction is valued at USD 250 million.

GeneSiC

August 24, 2026
Under the terms of the agreement, Magnachip will license Navitas’ GeneSiC Trench-Assisted PlanarTM (TAP) technology to enter the HV and UHV SiC markets. The license covers 1200 V, 2300 V, 3300 V and higher voltage GeneSiC technologies.

July 31, 2026
The expanded footprint is expected to strengthen the US company’s global innovation network, supporting the design and development of advanced semiconductor solutions for AI, cloud and data infrastructure applications

Technology_building

July 29, 2026
The acquisition is expected to expand Microchip’s processing portfolio for intelligent edge systems and strengthen its ability to deliver accelerated, power-efficient edge AI solutions for robotics, advanced vision processing and intelligent edge applications.

BeRex_agreement

July 21, 2026
South Korean company BeRex leverages over two decades of experience and expertise in developing RF and microwave components in the industry that enable the efficient transmission of voice, video, and data traffic over leading communications networks worldwide.

Semiconductor_building

July 20, 2026
Track one adds new 300mm Silicon Photonics capacity, with full production readiness expected during the fourth quarter of 2027. It consists of repurposing the Arai facility for 300mm Silicon Photonics capacity and advanced packaging capabilities.

geralt-computer-chip

July 08, 2026
The two companies had earlier announced that they had entered into a definitive agreement under which Analog Devices would acquire Empower in an all-cash transaction for USD 1.5 billion.

open-smart-power-fab

July 02, 2026
Infineon Technologies has opened its Smart Power Fab in Dresden, Germany – described as the world's largest fab for power semiconductors and analog/mixed-signal technologies.

logos-on-buildings

July 02, 2026
ams OSRAM has completed the sale of its non-optical analog/mixed-signal sensor business to Infineon Technologies in a transaction valued at EUR 570 million.

quantum-technologies-1

June 05, 2026
Rather than relying on a single architecture, SEALSQ is investing into several complementary approaches to fault-tolerant quantum computing and binding them to its own QS7001 secure hardware, QVault TPM and PQC product portfolio.

axonite_chip

May 21, 2026
Empower’s silicon capacitors are already in production, and IVR programs are advancing in close collaboration with leading hyperscalers and AI silicon providers — capabilities ADI will accelerate through its scale, manufacturing and customer reach.

chip

May 19, 2026
The US company’s MLX200 platform integrates multi-level RRAM arrays with mixed-signal compute engines to enable high-throughput vector-matrix operations within memory, while maintaining compatibility with advanced CMOS processes.

PCB-India_2

May 07, 2026
Crystal Matrix will establish an integrated facility for compound semiconductor fabrication and ATMP while Suchi Semicon will set up an OSAT facility for manufacturing discrete semiconductors, in Gujarat.

buildings

May 05, 2026
Less than a year after announcing a strategic semiconductor partnership, Denso has pulled its proposal to acquire shares in ROHM — after failing to secure support from ROHM's board of directors and special committee.

PCB-India_1

April 10, 2026
Cyient Semiconductors’ global reach enables Kinetic Technologies to tap into India’s semiconductor ecosystem, gaining access to engineering talent, OSAT and manufacturing partners, and stronger design capabilities.

Evertiq-Expo-TMP26-Scholarship-1

April 01, 2026
At Evertiq Expo Tampere on March 26, the moment was brief but meaningful. A check was handed over, applause followed, and two students – Razib Hasan and Jingjing Yang – stood on stage, representing something much bigger than a thesis project.

building

March 26, 2026
Israeli foundry Tower Semiconductor and Nuvoton Technology Corporation Japan will enter into mutual long-term supply agreements, ensuring continued support for existing customers of both companies.

building_logo

March 20, 2026
Under the agreement, Soitec will provide POI wafers for Skyworks’ Sky5 platform to address RF requirements of today’s 5G smartphones. Soitec POI provides the performance necessary for seamless advanced coexistence in dense signal environments.

new-thailand-facility-2026

March 19, 2026
US semiconductor company Analog Devices has opened a new manufacturing facility in Thailand aimed at expanding its production and test capacity and strengthening supply chain resilience.

PCB-India_3

March 04, 2026
The Indian company will accelerate commercialisation of its machine learning-enhanced analog signal chain chip portfolio, including advanced data converters and intelligent power and sensing solutions for industrial, smart energy, motor control and avionics applications.

Sponsored content by Arrow Electronics

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Arrow Electronics will showcase a broad range of technologies from its global supplier network at embedded world 2026 (Stand 4A-342), demonstrating core embedded capabilities across system design, development and deployment.

Haviv-Ilan

February 04, 2026
Texas Instruments has signed a definitive agreement to acquire Silicon Labs in an all-cash transaction valuing the wireless connectivity specialist at approximately USD 7.5 billion.

logos-on-buildings

February 04, 2026
Infineon Technologies has entered into an agreement to acquire the non-optical analog and mixed-signal sensor portfolio from ams OSRAM Group for EUR 570 million.

January 22, 2026
German semiconductor company Elmos Semiconductor has opened a new research and development site in Brno, Czech Republic.

Toshiba_EDA

January 02, 2026
Toshiba’s deployment of Siemens’ EDA tools includes advanced thermal design and analysis for 3D IC architectures; power optimization, integrity and reliability enhancement; and next-generation analog simulation acceleration.

Semiconductors

December 19, 2025
It brings together Cyient Semiconductors’s design expertise with Kinetic Technologies’s portfolio of high-performance analog and mixed-signal ICs, including power conversion solutions, display power, protection and interface solutions.

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