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The development trend of printed circuit board products and Kinwong's solution
With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
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There’s a better way to dispense thermal gap filler.
We hear a lot about the advancement, properties, and use of dispensable thermal interface materials (TIM) to keep devices cool. But what about the dispensing process? If you're choosing a dispensable thermal gap filler for your application, download our new guide.
