From wafer sawing to the finished packaged component
Encapsulation is essential for the reliability of a component, as it needs to protect the sensitive silicon and bonding joints even under variable environmental conditions or temperature ranges. High-quality packaging is therefore indispensable to ensure the functionality and reliability of a component and the entire device.
Microchip unveils first low-power DAC - simplifies handheld designs by including nonvolatile memory Implementing multi-channel system control or signal outputs using Digital-to-Analog Converters (DACs) in today’s portable and handheld industrial, communications, consumer and medical systems has been difficult to do without significant processor overhead for device configuration during power-up.
Infineon launches Traveo II Body microcontroller family for next-gen vehicle electronic system As drivetrain electrification and advanced driver assistance systems change the way we drive, the number and complexity of comfort features and other body functions in cars increases constantly.
New PIC24F MCUs Feature Low Power Animated Display Driver for Battery-powered Devices Low power MCU family offers power-saving peripherals, hardware safety and secure code protection
SnapEDA launches new KiCad plugin to help engineers design electronics faster Today, SnapEDA - a company that helps engineers design electronics faster by removing barriers - is launching a new KiCad plugin, allowing designers to search and download its computer-aided design (CAD) models directly within the KiCad PCB design environment.
Sponsored content by JBCHigh Quality & efficient fume extraction is not only important to meet workplace regulations It's also important to ensure the safety and health of everyone. Soldering fumes and gases may be one of the main causes of potential health problems at any soldering workplace without a proper fume extraction. To protect all employees and their health, keep the following suggestions in mind!
- US foundry makes the case for a secure domestic chip production
- Terry Gou addresses Foxconn's Wisconsin investment
- Harman to cut 1’500 jobs globally
- SK Hynix holds second highest NAND market share via acquisition of Intel’s NAND capacity
- While close to settling legal case with US, UMC to focus more on foundry business