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Sponsored content by Shenzen Kinwong Electronic
The development trend of printed circuit board products and Kinwong's solution
With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
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Sponsored content by Hamamatsu
Moduł C14093 do detekcji promieniowania rentgenowskiego metodą Dual Energy
Moduł został wyposażony w matrycę fotodiod do detekcji rentgena. 32-elementowa linijka na wierzchniej stronie przeznaczona jest do detekcji promieniowanie o niskiej energii, a 32-elementowa linijka na spodniej stronie do detekcji promieniowania z wyższego zakresu. Każda linijka połączona jest ze scyntylatorem.
Sponsored content by iTAC
iTAC presents milestone at productronica 2021: MES becomes MOM
The MES specialist iTAC Software AG will present an important milestone in its product development at productronica 2021: The iTAC.MES.Suite becomes the iTAC.MOM.Suite. The company is thus decisively further developing the existing Manufacturing Execution System for the digitalized factory world. The solution, which is being developed in cooperation with iTAC's holding company Dürr AG, has significant new features for controlling, optimizing and predicting production processes in real time. It is based on a completely new, open architecture and can therefore be integrated into existing ecosystems. iTAC will be attending the trade fair from November 16 to 19, 2021 in hall A3 at booth 161.
Sponsored content by Kyzen
The Effects of pH: Cleaning Agent Properties and Performance in Production
As cleaning agents evolve to meet customer and supplier environmental challenges, we take a closer look at the effect of pH cleaning agent properties and performance including material compatibility and rinsing behavior all while answering questions with SIR data.
Sponsored content by Rochester Electronics
The POWER of Authenticity and Reliability
Critical End-of-Life Component ManagementProduct lifecycles typically extend far beyond active semiconductor component availability, making lifecycle status a key factor when planning, at any phase, in the new product introduction (NPI) process.
