Mobis India unveils EV battery assembly plant in Tamil Nadu
The plant has an initial installed capacity of 36,000 units per annum, which is designed to meet the growing demand for electric mobility, and is scalable to a capacity of 75,000 units.
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NEO unveils 1T1C and 3T0C IGZO-based 3D X-DRAM tech
Built on a 3D NAND-like architecture and with proof-of-concept test chips expected in 2026, the new 1T1C and 3T0C designs combine the performance of DRAM with the manufacturability of NAND.
AOS enables 48V hot swap in AI servers with high SOA MOSFET
The AOTL66935 hot swap MOSFET prevents damage to the system by limiting the high inrush current with low power losses due to the very low on-resistance.
ABB's YuMi becomes a burger-flipping robot
ABB Robotics is serving up the future of fast food with BurgerBots – a robotics restaurant concept launched in Los Gatos, California. The automated kitchen uses ABB’s IRB 360 FlexPicker and YuMi collaborative robot.
InspeCity secures $5.6M to boost satellite life-extension tech
The funding will be deployed to space-qualify the Indian startup’s proprietary tech, grow its high-performance engineering team, and fasten the deployment of satellite life-extension platforms in global markets.
Serentica signs power supply and consumption deal with INOXAP
Serentica will supply 75 MW hybrid renewable energy to INOXAP through Inter-State Transmission System project, enabling competitive tariffs and flexible power usage across multiple locations across India.
Scatec starts construction of solar and BESS project in Egypt
The first phase of 561 MW solar + 100 MW/200 MWh battery storage is targeted to reach commercial operational date (COD) in the first half of 2026 and the second phase of 564 MW solar in the second half of 2026.
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Techno Electric unveils $1 billion data centre plan in India
The Indian company plans to set up hyperscale and edge data centres with a cumulative capacity of 250 MW spread across the country. Techno is partnering with RailTel Corporation to build edge data centres in 102 cities.
Semiconductors take centre stage at Evertiq Expo Malmö 2025
Sweden is setting its sights on a stronger position in the global semiconductor industry. At Evertiq Expo Malmö 2025, experts, researchers, and industry leaders will gather to explore the future of Swedish electronics – from innovation and supply chains to concrete investments in domestic semiconductor capabilities.
KIST develops ultrasonic wireless battery charging technology
The receiver overcomes many of the limitations of existing wireless power transmission methods while improving biocompatibility, and is expected to be applied to next-generation wearable and implantable electronic devices.
MeTime Healing receives grant to develop AI-powered mental health platform
MeTime Healing received $125,000 from the Montgomery County Technology Innovation Fund in Maryland to address the growing mental health crisis.
IIT Madras launches two silicon photonics products
An R&D centre at IIT Madras has developed a fibre array attachment tool in partnership with izmo Microsystems, which will be integrated with izmo’s packaging facility for photonics chip packaging. The centre also launched a high-speed silicon photonics QRNG.
Tasmania’s Incat launches ‘world’s largest battery-electric ship’
When it enters service between Buenos Aires and Uruguay, the 130 metre-long vessel, called Hull 096, will operate entirely on battery-electric power, carrying up to 2,100 passengers and 225 vehicles across the River Plate.
VSORA raises $46M to bring powerful AI inference chip to market
The investment was led by Otium and a French family office with additional participation from Omnes Capital, Adélie Capital and co-financing from the European Innovation Council (EIC) Fund.
Southampton opens E-beam lithography chip facility
University of Southampton’s new E-beam lithography facility, just the second in the world, provides incredible accuracy critical to designing the tiny components that power technologies of the future.
Forge Nano’s battery and chip ambitions get $40M boost
Forge Nano’s total capital investment now exceeds USD 140 million, adding RockCreek to a shareholder roster that includes GM Ventures, Volkswagen, LG Technology Ventures, Hanwha, Mitsui Kinzoku, Sumitomo Corporation of Americas, Air Liquide, Catalus Capital and SBI Investment
UK scientists secure $8 million for 2D chip research
This will help develop energy efficient, atomically-thin semiconductors to dramatically reduce the electricity demand from AI data centres and high-performance computing.
Zoho suspends $700 million India chipmaking plan
In June 2024, the Indian company had applied for government incentives under the India Semiconductor Mission (ISM) to build a compound semiconductor chip fabrication unit in Karnataka.
NVIDIA brings cybersecurity to every AI factory
The NVIDIA DOCA Argus framework provides runtime threat detection by using advanced memory forensics to monitor threats in real time, delivering detection speeds up to 1,000x faster than existing agentless solutions — without impacting system performance.
OKI develops 124-layer PCB tech for AI chip testing tools
This is a 15% increase in the number of layers over conventional 108-layer designs. Japan’s OKI Circuit Technology is seeking to establish mass production technology by October 2025 at its Joetsu plant.
Report: TikTok plans to build €1 billion data centre in Finland
TikTok has over 175 million users in Europe. In 2023, it launched a new data security regime called “Project Clover,” with plans to invest €12 billion over 10 years, to address concerns over data security.
Teledyne names George Bobb as CEO
Teledyne Technologies Incorporated has named George C. Bobb III as its President and Chief Executive Officer, effective immediately.
IBM to invest $150 billion in the US over 5 years
This includes an investment of over USD 30 billion in R&D and manufacturing of mainframe and quantum computers. IBM said it will continue to design, build and assemble quantum computers in the US.
Havells invests $70 million in Goldi Solar in renewable push
Havells India hopes to leverage Goldi’s rapid capacity expansion to 10.7 GW, with another 4 GW expected by July. Goldi also plans to set up domestic cell manufacturing capacity within 18 months.
FedEx announces investment in AI robotics company Nimble
One of the world’s biggest logistics companies has announced a strategic alliance with the fast-growing AI robotics company Nimble.
Report: Huawei develops new AI chip to compete with Nvidia
China’s Huawei Technologies hopes that its new chip, Ascend 910D, will prove to be more powerful than Nvidia’s AI chip H100, according to a report by The Wall Street Journal.
Hindalco delivers 10,000 aluminium battery enclosures for Mahindra e-SUVS
Indian aluminium company Hindalco also unveiled its EV component manufacturing facility in Maharashtra, built with a capital investment of USD 57 million and spread across 5 acres.
NEC achieves Japan’s longest free-space optical communication
NEC achieved Japan’s longest terrestrial wireless optical communication over a distance of over 10 km. It also conducted FSO communications between an observation deck at the tallest structure in Japan and a location on the ground 3 km away.
Siemens acquires DownStream to expand PCB design-to-manufacturing flow
Founded in 2002 and based in Marlborough, Massachusetts, DownStream Technologies is a leading provider of manufacturing solutions for manufacturing data analysis and processing, and documenting PCB designs.
ChEmpower secures $18.7M to advance chip planarization tech
US semiconductor materials startup ChEmpower provides polishing pads and solutions designed to create defect-free surfaces with superior planarity, enabling higher chip yield and performance.
Spirit acquires SMART Microsystems, expands US chip capacity
SMART Microsystems will serve as a hub for advanced research and education in materials, MEMS and advanced packaging technologies, including 2.5D and 3D integration.
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