Vsun Solar starts silicon wafer production in Vietnam
April 26, 2024
Japanese solar tech specialist Vsun Solar has officially opened its 4-gigawatt silicon wafer plant in Vietnam's northern province of Phu Tho.
China beefs up its chip production – grew 40% in 1Q24
April 25, 2024
Backed by official support and continued industry investments, China's total chip production reportedly surged by 40% during the first quarter of 2024 – reaching 98.1 billion units.
Vishay selects Aixtron SiC multiwafer batch technology
April 23, 2024
Aixtron's G10-SiC epitaxy production platform has been chosen by Vishay Intertechnology, to empower the company’s in-house SiC epitaxy needs for power device manufacturing.
Silicon Creations hits milestone of 10 million wafers in production with TSMC
April 23, 2024
Silicon Creations, a supplier of high-performance analog and mixed-signal IP, has reached a significant milestone: surpassing 10 million wafers in production containing its IP in collaboration with semiconductor foundry TSMC.
AI demand drives growth in QLC enterprise SSD shipments
April 23, 2024
North American customers are increasing their orders for storage products as energy efficiency becomes a key priority for AI inference servers.
Unnamed firm buys world's second High-NA EUV machine
April 22, 2024
ASML has disclosed that it has shipped a second Extreme Ultraviolet Lithography (EUV) machine, but it hasn't named the customer.
State-backed fund takes over photoresist specialist JSR
April 22, 2024
The Japanese government and the state-backed Japan Investment Corp (JIC) have acquired a majority stake in JSR.
Wolfspeed selects Aixtron tools to support 200mm production
April 18, 2024
SiC specialist Wolfspeed has placed multiple-tool orders in Q3 and Q4 2023 to utilise Aixtron's G10-SiC to help further ramp production for 200mm (8-inch) SiC epitaxial wafers.
SweGaN confirms strategic partnership with RFHIC
April 15, 2024
Swedish semiconductor manufacturer SweGaN has announced a strategic equity investment and joint product development deal with Korea's RFHIC Corporation.
Gudeng to build EUV pod factory in Japan
April 15, 2024
Gudeng Precision Industrial Co will launch a new facility in Fukuoka Prefecture’s Kurume to reduce its reliance on Taiwanese and Chinese production.
SK siltron bags another huge US subsidy
April 15, 2024
South Korean semiconductor wafer manufacturer SK siltron has lined up $77m in government funding to support the expansion of its Michigan plant.
Shin-Etsu to build semiconductor materials plant in Japan
April 12, 2024
Industrial giant Shin-Etsu Chemical has confirmed it will invest $547 million in a new facility at Isesaki in Japan's Gunma Prefecture.
Huawei to develop lithography tech at new R&D centre
April 12, 2024
Chinese tech giant Huawei is reported to be building a new research unit in Shanghai. It wants to develop chipmaking tools that could eventually rival those of ASML, Canon, and Nikon.
Siltronic ends wafer production for "small diameters"
April 11, 2024
Siltronic plans to gradually cease production of polished and epitaxial small diameter wafers at its Burghausen site. The process, which excludes unpolished wafers, is set to be completed in 2025.
Taiwan DRAM manufacturers gradually resume production
April 10, 2024
DRAM manufacturers are gradually resuming production following the earthquake that struck Taiwan on April 3, 2024. Despite some damages and the necessity for inspections or disposal of wafers among suppliers, TredForce reports that the impact on the total DRAM output for Q2 is estimated to be less than 1%
Tata to take over Pegatron's iPhone assembly plant?
April 09, 2024
Speculation is rising that Taiwan's Pegatron is in talks to hand over control of its Indian iPhone manufacturing facility to the Tata Group.
Polymatech and Orbray sign MoU on sapphire ingots
April 09, 2024
Chennai-headquartered Polymatech Electronics has agreed a deal with Japanese precision manufacturing firm Orbray to work together on sapphire wafer fabrication.
TSMC names Kikuyo as the location of its second Japan fab
April 09, 2024
Taiwan Semiconductor Manufacturing Co has confirmed that it will build its second Japanse foundry in the same region as its first: at Kikuyo in the Kumamoto Prefecture.
Q2 NAND flash contract prices expected to rise by 13–18%
March 28, 2024
TrendForce projects a strong 13–18% increase in Q2 NAND Flash contract prices, with enterprise SSDs expected to rise highest. Despite Kioxia and WDC boosting their production capacity utilization rates from Q1 this year, other suppliers have kept their production strategies conservative.
Coherent expands capacity in US and Europe
March 27, 2024
Compound semiconductor specialist Coherent Corp. has established the world’s first capability for 6-inch indium phosphide (InP) wafer fabrication, at the company’s Sherman, Texas, and Järfälla, Sweden, wafer fabs.
Wolfspeed tops out world’s largest SiC facility
March 27, 2024
Wolfspeed has celebrated the topping out of construction at the USD 5 billion John Palmour Manufacturing Center for Silicon Carbide.
Has Huawei invented a tech to bypass EUV lithography?
March 25, 2024
Reports say Huawei Technologies has achieved a breakthrough that will enable it to design advanced chips without the need for extreme ultraviolet lithography (EUV) machines.
Singapore team develops revolutionary low power bit-switch
March 25, 2024
Academic researchers have created a microelectronic device that can potentially function as a high-performance “bit-switch”. It consumes 1,000 times less power than commercial memory technologies.
Imperial Star Solar preps silicon wafer plant in Laos
March 22, 2024
Cambodia-based solar manufacturer Imperial Star is building a silicon wafer manufacturing facility in Laos, which should be operational in May.
ASU and Deca team up to open research center
March 20, 2024
Arizona State University (ASU) and Deca Technologies (Deca), a provider of advanced wafer- and panel-level packaging technology, are teaming up to create North America’s first fan-out wafer-level packaging (FOWLP) research and development center.
TSMC to build CoWoS plants in Taiwan, and maybe Japan
March 18, 2024
Taiwan Semiconductor Manufacturing Company has announced plans to construct two new chip-on-wafer-on-substrate plants in Chiayi. But there's also speculation it will expand its capacity in Japan too.
NIST orders a scia Coat 200 system from scia Systems
March 07, 2024
scia Systems GmbH, an specialist in advanced ion beam and plasma process equipment for microelectronics, MEMS, and precision optics industries, has received an order for a scia Coat 200 system from US-based National Institute of Standards and Technology (NIST).
Vishay acquires Nexperia’s Newport Wafer Fab for $177m
March 06, 2024
Vishay Intertechnology has completed the acquisition of Nexperia’s wafer fabrication facility and operations located in Newport, South Wales, UK for approximately USD 177 million.
SMIC making progress towards 5nm chip tech
March 04, 2024
China's leading foundry Semiconductor Manufacturing International Corporation is reported to be closing in on 5-nanometer mode manufacturing in spite of US sanctions.
ASML reaches 'first light' on High NA EUV
March 01, 2024
Dutch lithography firm ASML has confirmed that its next-gen high-numerical aperture extreme ultraviolet tool is functional.
India approves first semiconductor fab
March 01, 2024
The Indian government has rubber stamped a $15.2 billion budget to build three new semiconductor plants, including the country's first 12-inch wafer fab.
What is the future for SiC in Europe?
February 29, 2024
To understand the – potential – future, we first must look at the present and the ongoing movement. Therefore, Evertiq invited Yole Group as a keynote speaker during its inaugural Expo in Sophia Antipolis, France dig deeper into the market, investments and competitive landscape of SiC.
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