STMicroelectronics to launch $60M pilot line in France September 17, 2025 Semiconductor manufacturer STMicroelectronics plans to establish a new pilot line for Panel-Level Packaging (PLP) technology at its Tours facility in France, backed by a USD 60 million investment. The pilot line is expected to be operational in the third quarter of 2026.
Gautam Solar to invest $450M to set up solar plant in India September 12, 2025 The project, to be developed on 54 acres of land in central India, will produce TOPCon cells with a planned capacity of 5 GW. Implementation of Phase 1, which includes setting up a solar cell manufacturing capacity of 2 GW, has started.
Toshiba and SICC team up on SiC power semiconductor wafers August 28, 2025 Toshiba Electronic Devices & Storage Corporation and SICC have signed a memorandum of understanding (MOU) to explore collaboration on SiC power semiconductor wafers, the companies announced.
Rocket Lab boosts US semiconductor and space investments August 26, 2025 US-based Rocket Lab Corporation plans to expand its domestic investments to increase semiconductor manufacturing capacity and secure the supply chain for space-grade solar cells and electro-optical sensors used in national security space missions.
OKI develops Tiling crystal film bonding technology August 22, 2025 The Tiling crystal film bonding (CFB) tech developed by Japanese firm OKI allows for 52 repeated tiling operations over the entire surface of a 300 mm silicon wafer using a single 2-inch InP wafer, enabling efficient use of InP-based materials.
India approves 4 projects in $530 million boost to chip making August 20, 2025 The four new proposals approved are from SiCSem, CDIL, 3D Glass Solutions and ASIP Technologies. The SiCSem and 3D Glass units will be set up in Odisha, CDIL will expand its facility in Punjab, and ASIP will establish a plant in Andhra Pradesh.
SuperSiC breaks ground on new manufacturing facility in Penang August 13, 2025 SuperSiC, a subsidiary of Zhejiang Jingsheng Mechanical & Electrical (JSG), has broken ground on its new manufacturing facility in Penang, Malaysia. The facility is part of JSG’s global expansion plans and reflects the growing role of Chinese semiconductor companies in the international supply chain.
Rigaku launches XTRAIA XD-3300 mass production for chip market August 01, 2025 XTRAIA XD-3300 is capable of performing of direct, non-destructive diffraction measurements of superlattice structures with the highest resolution on microscopic pads on wafers.
SK keyfoundry, LB Semicon co-develop Direct RDL for chip packaging July 15, 2025 RDL refers to metal wiring and insulating layers on top of semiconductor chips to enable electrical connections. The newly co-developed Direct RDL by Korean companies SK keyfoundry and LB Semicon supports power semiconductors with high current capacity.
Okmetic produces first wafers from expanded Vantaa fab June 30, 2025 Okmetic has produced the first silicon wafers from its newly expanded fabrication facility in Vantaa, Finland. The milestone marks the completion of the initial phase of what will ultimately be a EUR 400 million expansion.
Advanced chip capacity to surge 69% by 2028 on AI demand June 26, 2025 The global semiconductor industry is expected to significantly expand its advanced manufacturing capacity through 2028, driven by accelerating demand for artificial intelligence applications, according to SEMI’s latest 300mm Fab Outlook report.
Sparc Foundry secures €17.2M public funding for photonic chip plant June 18, 2025 Sparc Foundry, a Spanish startup focused on photonic semiconductors, has received a EUR 17.2 million capital injection from the Spanish Society for Technological Transformation (SETT). The funding has been approved by the Council of Ministers under the national PERTE Chip initiative and represents 43.9% of the company's capital expansion.
RIR expands manufacturing of 1200V SiC diodes in collaboration with PASC June 11, 2025 Besides serving existing domestic Indian and US customers, shipping from Taiwan also provides improved access to strategic high-growth markets for SiC devices in the South East Asian region.
NXP reportedly to close four 8-inch fabs in shift toward 12-inch production June 11, 2025 NXP Semiconductors is reportedly planning to shut down four of its 8-inch (200mm) wafer fabrication plants – one in the Netherlands and three in the United States — as part of a strategic transition to 12-inch (300mm) wafer production.
Semiconductor outlook: typical Q1, but atypical shifts ahead May 21, 2025 The global semiconductor manufacturing industry entered 2025 with typical seasonal patterns. However, looming tariff threats and evolving supply chain strategies are expected to create atypical seasonality for several industry segments as the year progresses, reports SEMI.
India approves $434 million HCL-Foxconn semiconductor plant May 15, 2025 The new unit, to be located near the upcoming Jewar airport in Uttar Pradesh, will produce display driver chips for mobile phones, laptops, automobiles, PCs and other devices.
Chemical mechanical planarization market to reach $10.5B by 2035 May 13, 2025 This upward trajectory is driven by the increased complexity in semiconductor architectures, growing demand for miniaturized electronic components, and the expanding integration of advanced node technology across the microelectronics industry.
Partstat, WIN team up to enhance chip storage solutions May 12, 2025 The partnership between US-based Partstat and Taiwan’s WIN Semiconductors combines Partstat’s expertise in inventory management and storage with WIN’s advanced semiconductor manufacturing capabilities.
Forge Nano’s battery and chip ambitions get $40M boost May 02, 2025 Forge Nano’s total capital investment now exceeds USD 140 million, adding RockCreek to a shareholder roster that includes GM Ventures, Volkswagen, LG Technology Ventures, Hanwha, Mitsui Kinzoku, Sumitomo Corporation of Americas, Air Liquide, Catalus Capital and SBI Investment
Global silicon wafer shipments rise 2.2% YoY in Q1 2025 April 30, 2025 Global silicon wafer shipments grew modestly in the first quarter of 2025, rising 2.2% year-on-year to 2,896 million square inches (MSI), up from 2,834 MSI in Q1 2024, according to the latest quarterly report from the SEMI. The report highlights ongoing demand for advanced semiconductor manufacturing, though short-term pressures continue to weigh on the industry.
Polar to onshore fabrication of advanced devices on 200mm wafers April 23, 2025 Polar Semiconductor, a US-owned merchant foundry specialising in sensor, power, and high-voltage semiconductors, has signed a strategic agreement with Renesas to license their Gallium Nitride on Silicon D-Mode (GaN-on-Si) technology.
AI, embargoes, and the end of the chip cycle April 16, 2025 The well-known four-year ebb and flow of the semiconductor industry is over. Political decisions and ambitions challenge the economic logic of supply and demand. Subsidies, embargoes and the AI revolution are now dictating the investment decisions while China plays the long game.
Polymatech to set up $130M GaN chip plant in Chhattisgarh April 11, 2025 In September 2024, Indian chipmaker Polymatech Electronics announced an investment of USD 16 million in Bahrain to establish a semiconductor manufacturing plant in the gulf country.
ST to cut up to 2,800 jobs in major manufacturing overhaul April 10, 2025 Semiconductor manufacturer STMicroelectronics will see up to 2,800 employees leave the company globally over the next three years as part of an overhaul of its manufacturing operations and cost structure.
Horiba acquires EtaMaX in South Korea April 10, 2025 Japanese semiconductor metrology company Horiba has acquired EtaMax, a South Korean developer and manufacturer of wafer inspection systems, in a move aimed at expanding its capabilities in the compound semiconductor market.
Tokyo Electron, IBM renew partnership for advanced chip tech April 03, 2025 The two companies will explore technology for smaller nodes and chiplet architectures to achieve the performance and energy efficiency requirements for the future of generative AI.
Aixtron delivers G10-AsP system to Nokia April 01, 2025 Aixtron will supply its G10-AsP system to Nokia, facilitating the production of 6-inch Indium Phosphide (InP) wafers for Photonic Integrated Circuits (PICs).
UMC opens new fab expansion in Singapore April 01, 2025 Semiconductor foundry United Microelectronics Corporation (UMC) has officially opened its new fab facility in Singapore. The first phase of the new facility will start volume production in 2026, bringing UMC’s total production capacity in Singapore to more than 1 million wafers annually.
SK hynix completes its acquisition of Intel's NAND business April 01, 2025 South Korean memory giant SK hynix has officially completed its acquisition of Intel’s NAND flash memory business, a deal initially announced in October 2020.
EnSilica secures key contract, opens second design centre in Brazil March 27, 2025 The new design centre is in Campinas, São Paulo State, and complements the company’s Porto Alegre facility in Rio Grande do Sul, in southeastern Brazil.
FAMES Pilot Line launches open-access call for EU chip industry March 25, 2025 Participants whose requests are selected will have access to FAMES technologies as they become available. Open-Access Calls will take place each spring through 2028.
Scotland’s chip packaging R&D centre receives $12 million March 21, 2025 Hosted by the National Manufacturing Institute Scotland (NMIS), the new facility will form part of the University of Strathclyde’s Advanced Net Zero Innovation Centre (ANZIC).