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Plessey partners with Axus Technology
February 21, 2020
Plessey, an embedded technologies developer, is partnering with Axus Technology (Axus), a provider of CMP, wafer thinning and wafer polishing surface-processing solutions for semiconductor applications, to bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.
5 semiconductor companies hold 53% of global wafer capacity
February 18, 2020
The world’s top-five wafer capacity leaders each had capacity of more than 1,000,000 wafer starts per month, says IC Insights.
TI to shutter two plants, expand in Richardson
January 28, 2020
In an earnings call to shareholders last week, Texas Instruments disclosed that it will close two wafer plants in the next three to five years, with the construction of the company’s Richardson plant continuing.
Ampleon, Rochester Electronics ink deal
January 22, 2020
RF power products supplier Ampleon and semiconductor manufacturer Rochester Electronics have forged a strategic partnership to extend the global supply of Ampleon’s VDMOS portfolio of high-performance RF transistors.
U.S. polysilicon makers laud Phase 1 of China deal
January 18, 2020
The United States’ three remaining manufacturers of polysilicon expressed appreciation to President Trump and praised U.S. negotiators for securing the Chinese commitment to purchase U.S. polysilicon in the first phase of the U.S.-China trade deal.
China only region to register pure-play foundry market growth
January 16, 2020
Rise of China-based fabless IC suppliers offers increased opportunities for foundries, IC Insights states in a recent report.
LPKF delivers laser system to semiconductor industry customer
January 15, 2020
In December, LPKF delivered – for the first time – a highly automated version of its LIDE system for integration into a semiconductor fab to an unnamed semiconductor manufacturers.
ROHM company SiCrystal & STMicro ink wafer supply deal
January 15, 2020
ROHM and STMicroelectronics have signed a multi-year silicon carbide (SiC) wafers supply agreement with SiCrystal, a ROHM group company having a top share of SiC wafers in Europe.
imec spin-off raises €4,5 million in funding
January 14, 2020
MICLEDI Microdisplays, the latest spin-off of imec, has raised EUR 4,5 million seed capital from imec.xpand, with participation of PMV and FIDIMEC.
Knowles acquires Microphone Design assets from ams AG
December 23, 2019
Knowles has acquired the MEMS microphone ASIC design business from ams AG. The transaction includes intellectual property, rights to source ASIC wafers from multiple foundry partners, and the transfer of the ASIC design team, which will continue to be based in Switzerland.
memsstar ships MEMS production system to University of Freiburg
December 11, 2019
memsstar Ltd., a provider of etch and deposition equipment to manufacturers of semiconductors and MEMS,has shipped its three-chamber ORBIS 3000 system for MEMS research and manufacturing to the Department of Microsystems Engineering (IMTEK) of the University of Freiburg, Germany.
Sumitomo launches 150mm GaN-on-SiC production with Aixtron system
December 04, 2019
Japanese group Sumitomo Electric Device Innovations, Inc. (SEDI) has ordered an AIX G5+ tool from Aixtron, with 8x6-inch wafer configuration in order to expand the production capacity of GaN-on-SiC (gallium nitride-on-silicon carbide) radio frequency (RF) devices for wireless applications.
STMicro completes acquisition of SiC wafer specialist Norstel
December 02, 2019
STMicroelectronics has completed the full acquisition of Swedish silicon carbide (SiC) wafer manufacturer Norstel AB.
Cree, STMicroelectronics fortify SiC agreement
November 19, 2019
Cree Inc. and STMicroelectronics have expanded their existing multi-year, long-term silicon carbide wafer supply agreement to more than USD 500 million.
Si wafer shipments recede for fourth straight quarter
November 12, 2019
Worldwide silicon wafer area shipments slid for the fourth consecutive quarter of 2019, according to the SEMI Silicon Manufacturers Group (SMG) in its most recent quarterly analysis of the industry.
EpiWorld speeds up commercialisation of SiC devices with AIXTRON
November 08, 2019
AIXTRON SE has provided an AIX G5 WW C system to EpiWorld International Co., Ltd for the further development of next generation silicon carbide (SiC) epitaxial wafers mainly used for the manufacturing of power devices for automotive applications.
Covalent Metrology, Rigaku extend partnership with new line
November 06, 2019
Rigaku, a producer of X-ray metrology technology, has installed two of its analytical instruments at the Sunnyvale, California service lab of Covalent Metrology, a provider of analytical services to advanced materials innovation companies.
Odyssey Semiconductor picks up wafer fab
October 31, 2019
Ithaca, New York’s Odyssey Semiconductor Technologies, specializing in high-voltage power switching components and systems based on proprietary gallium nitride (GaN) processing technology, has acquired an integrated semiconductor design, fabrication, test, and packaging facility.
MEMS and sensors fab capacity to grow 25% through 2023
October 29, 2019
Total worldwide installed capacity for MEMS and sensors fabs is forecast to grow 25% to 4.7 million wafers per month from 2018 to 2023, driven by explosive demand across communications, transportation, medical, mobile, industrial and other Internet of Things (IoT) applications, says SEMI.
Cree, NY CREATES announce first SiC wafer demo
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October 24, 2019
Cree and New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES), marked the start of their partnership with the completion of their first silicon carbide test wafers last week.
