Intel Foundry and ASML report High NA EUV production milestone September 08, 2026 Intel Foundry and ASML have reported continued progress in High NA EUV lithography production, including more than one million wafers processed to date across early tool certification and testing, research and development, and volume production on select layers of Intel's Panther Lake processors — part of the Core Ultra Series 3 family.
Kioxia and Sandisk bet $31 billion on NAND flash as AI demand surges August 31, 2026 Kioxia and Sandisk have announced anticipated investments in Japan totalling over USD 31 billion – approximately 5 trillion yen – contingent on government support. The investments, running through 2032, will support continued expansion of the companies' joint venture manufacturing operations at the Yokkaichi and Kitakami plants.
Doosan acquires 70.6% stake in SK Siltron August 26, 2026 South Korean conglomerate Doosan has signed a share purchase agreement to acquire a 70.6% stake in SK Siltron from SK Group for KRW 2.3 trillion, equivalent to approximately USD 1.7 billion. The deal was approved by Doosan's board on July 31.
Worldwide silicon wafer shipments increase 7.4% in Q2 2026 July 30, 2026 SEMI Silicon Manufacturers Group (SMG) has reported that worldwide silicon wafer shipments increased 7.4% year-on-year to 3,573 million square inches (MSI) from the 3,327 MSI recorded during the same quarter of 2025.
Bosch announces $225 million funding deal with US government July 14, 2026 Bosch is investing up to $2 billion to transform the Roseville, California site into a facility that produces and tests SiC semiconductors with state-of-the-art processes and equipment.
CCRAFT raises $7.8 million to scale photonic chip manufacturing July 06, 2026 The proceeds will support the Swiss company’s ambitious technical roadmap towards an industrialized production line, unlocking additional manufacturing capacity to serve key Tier-1 customers.
Infineon opens €5 billion Smart Power Fab in Dresden July 02, 2026 Infineon Technologies has opened its Smart Power Fab in Dresden, Germany – described as the world's largest fab for power semiconductors and analog/mixed-signal technologies.
Rohm partners with Aixtron to scale GaN power device production June 18, 2026 The installation of Aixtron’s G10-GaN system at the Hamamatsu plant supports Rohm’s transition toward increased vertical integration and strengthens its ability to scale production for next-generation power semiconductor applications.
The semiconductor industry as it is, not as it is told June 12, 2026 At Evertiq Expo Zürich, Claus Aasholm of Semiconductor Business Intelligence delivered a data-driven examination of a semiconductor industry in structural transition – and the picture looked considerably different from what most quarterly reports suggest.
Onsemi reportedly plans up to 300 job cuts at Czech facility June 09, 2026 US semiconductor manufacturer Onsemi is reportedly planning to cut between 200 and 300 jobs at its plant in Rožnov pod Radhoštěm in the Czech Republic, according to Czech media outlet e15. The cuts follow an earlier round of approximately 170 layoffs at the same facility in 2025.
IBM announces US quantum chip foundry with $1B CHIPS support May 27, 2026 The CHIPS incentive from the US Department of Commerce will support R&D efforts of a new IBM company, Anderon, which will operate as a 300-mm quantum wafer foundry. In addition to the USD 1 billion CHIPS incentive, IBM will contribute USD 1 billion of cash into Anderon.
Wingtech sues Nexperia leadership – invoking China's anti-sanctions law May 25, 2026 The Nexperia dispute has taken a significant new turn. Parent company Wingtech Technology has filed a lawsuit against Nexperia and three members of its leadership team in a Chinese court, demanding CNY 8 billion (EUR 1 billion) in damages and calling for the reversal of Dutch governance measures it characterises as discriminatory.
Inside Fab 21: TSMC reveals Arizona chip production site May 08, 2026 TSMC has released a video showcasing its semiconductor manufacturing operations in Arizona, offering a rare glimpse inside its expanding US production site, known as Fab 21.
India approves semiconductor projects worth $400 million May 07, 2026 Crystal Matrix will establish an integrated facility for compound semiconductor fabrication and ATMP while Suchi Semicon will set up an OSAT facility for manufacturing discrete semiconductors, in Gujarat.
Applied Materials acquires NEXX business from ASMPT May 06, 2026 US semiconductor equipment maker Applied Materials has entered into a definitive agreement to acquire the NEXX business from ASMPT, adding panel-level electrochemical deposition technology to its advanced packaging lineup.
HyperLight, UMC, Wavetek to bolster TFLN production May 04, 2026 Building on HyperLight’s collaboration with Wavetek, which brought TFLN photonics from laboratory innovation to a HVM line within a 6-inch CMOS foundry, Taiwan’s UMC is bringing to the partnership its 8-inch production capability and expertise.
YMTC plans new fabs to boost capacity amid rising US-China tensions April 14, 2026 Chinese memory chipmaker Yangtze Memory Technologies (YMTC) is planning to build two additional plants alongside a facility nearing completion, in a move that would more than double its production capacity, according to a Reuters report citing sources familiar with the matter.
SUMCO shifts strategy from new fab to equipment upgrades April 07, 2026 SUMCO Corporation has received approval from Japan’s Ministry of Economy, Trade and Industry (METI) for an amended version of its “Plan for Ensuring Stable Supply” under the Economic Security Promotion Act, the company announced on March 27, 2026.
Lumentum expands with new US manufacturing facility April 01, 2026 Optical and photonic solutions provider Lumentum plans to establish a new US manufacturing facility in Greensboro, North Carolina.
TSMC targets 3nm production at second Japan fab by 2028 April 01, 2026 TSMC is planning to begin equipment installation and launch mass production of advanced 3-nanometre chips at its second fabrication plant in Japan in 2028, according to a Taiwanese government filing.
Inside one of Taiwan's semiconductor factories March 27, 2026 Taiwan’s semiconductor industry is often discussed in terms of scale, complexity, and technological leadership. Less often, we get a closer look at how these facilities actually operate from the inside.
Foundry set to grow 24.8%, but not all of the market is keeping pace March 27, 2026 In December, Claus Aasholm, an analyst at Semiconductor Business Intelligence, raised an uncomfortable question in Evertiq: does the traditional semiconductor cycle still exist? His argument was straightforward — AI-driven growth is pulling the market into parallel trajectories that are increasingly difficult to reconcile within a single top-line number.
STMicro starts STM32 MCUs deliveries in China March 25, 2026 Through a collaboration with domestic producer Huahong, STMicroelectronics has a dual supply chain, with fully processed and manufactured 40nm MCU products in China that are exact same design and technology as those made outside China.
Soitec secures deal to supply POI wafers for Skyworks March 20, 2026 Under the agreement, Soitec will provide POI wafers for Skyworks’ Sky5 platform to address RF requirements of today’s 5G smartphones. Soitec POI provides the performance necessary for seamless advanced coexistence in dense signal environments.
From global dependence to local ambition – Apple’s supply chain shift March 20, 2026 With advanced semiconductor manufacturing still heavily concentrated in Taiwan, geopolitical tensions are forcing companies like Apple to reassess their supply chain strategies. The question is no longer if diversification is needed, but how quickly it can be achieved.
GlobalFoundries breaks ground on €1.1bn Dresden expansion March 18, 2026 GlobalFoundries has started construction of its planned semiconductor fab expansion in Dresden, Germany, marking the next phase of its EUR 1.1 billion investment under Project SPRINT, according to a company update on LinkedIn.
SK Group chairman: Wafer shortage could persist until 2030 March 17, 2026 SK Group Chairman Chey Tae-won said the global shortage of semiconductor wafers could last until 2030, as demand driven by artificial intelligence continues to outpace supply, according to Reuters.
Nexperia dispute deepens as China unit launches independent chip production March 10, 2026 A long-running dispute between Dutch semiconductor company Nexperia and its China-based subsidiary has intensified, with the Chinese entity announcing it has begun producing its own chips while tensions over operations and governance continue to escalate.
DNP invests in Rapidus to advance mass production of 2nm chips March 02, 2026 Through this initiative, DNP will advance the development and mass production of EUV lithography photomasks and support Rapidus as it establishes a mass production system for 2nm & next-generation semiconductors.
Micron opens semiconductor assembly and test facility in India March 01, 2026 US memory manufacturer Micron Technology has officially opened its semiconductor assembly and test facility in Sanand, Gujarat, India.
ASML unveils EUV light source upgrade to boost chip output by 50% by 2030 February 24, 2026 ASML has developed an upgraded extreme ultraviolet (EUV) light source for its lithography machines, which the company says could increase chip production by up to 50% by the end of the decade, Reuters reports.
Intel backs away from manufacturing deal with Tower Semiconductor February 16, 2026 Tower Semiconductor has disclosed that Intel does not intend to proceed with a previously signed agreement to manufacture 300mm wafers for Tower’s customers at Intel’s facility in New Mexico.