Mycronic expands with acquisition in France
March 13, 2025
Swedish high-technology company Mycronic says that it's Global Technologies division has acquired Hprobe, a France-based developer of technology for high-speed magnetic testing of Magnetoresistive Random Access Memories (MRAMs) and magnetic sensors.
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Teradyne to acquire Quantifi Photonics
March 12, 2025
Teradyne has entered into a definitive agreement to acquire Quantifi Photonics, a privately held company specialising in photonic integrated circuit (PIC) testing. The acquisition is expected to be finalised in the second quarter of 2025.
Foundry market hits $38.5B as top 10 dominate with 96% share
March 11, 2025
The global foundry industry reached a new revenue record of USD 38.48 billion in Q4 2024, driven by strong demand for advanced process nodes in AI servers, flagship smartphone application processors, and new PC platforms, reports TrendForce. The top 10 foundries achieved nearly 10% QoQ revenue growth, despite weakening demand for mature process technologies.
CDIL teams up with Infineon to make power chips
March 07, 2025
Under the agreement, German firm Infineon will supply bare semiconductor wafers to CDIL, which the Indian company will process and use for assembly and packaging to make power chipsets.
Jabil expands with new factory in India
March 05, 2025
EMS provider Jabil says that it will open a new factory in Gujarat, its second factory in India.
Benchmark breaks ground on its fifth facility in Penang
March 04, 2025
EMS provider Benchmark has officially broken ground on its new PT4 facility – which is also the company's fifth facility in Penang, Malaysia.
RRP Electronics partners with Deca to boost wafer packaging
March 04, 2025
India’s RRP Electronics will integrate Deca’s Wafer-Level Chip Scale Packaging (WLCSP) and M-Series Fan-Out Wafer-Level Packaging (FOWLP) technologies into its state-of-the-art processes.
Microchip to cut 2,000 jobs in manufacturing footprint restructure
March 03, 2025
Microchip Technology has unveiled a significant restructuring plan aimed at streamlining costs and optimizing its manufacturing operations. This initiative expands on the company’s earlier decision to shut down its Fab 2 wafer fabrication facility in Tempe, Arizona, ahead of schedule.
Penn State to set up advanced semiconductor lab
February 28, 2025
The USD 4.3 million funding will help the University establish an advanced lab for semiconductor thin films and device research in the Materials Research Institute’s (MRI) facilities.
Server DRAM and HBM continue to drive growth
February 27, 2025
TrendForce’s latest research reveals that global DRAM industry revenue surpassed USD 28 billion in 4Q24, marking a 9.9% QoQ increase. This growth was primarily driven by rising contract prices for server DDR5 and concentrated shipments of HBM, leading to continued revenue expansion for the top three DRAM suppliers.
U-M awarded up to $7.5M to develop heat-tolerant chips
February 21, 2025
Funded by the Silicon Crossroads Microelectronics Commons Hub, University of Michigan researchers are leading a collaborative effort to bring more such semiconductors to the market.
Global semiconductor manufacturing industry reports solid 4Q24 results
February 20, 2025
The global semiconductor manufacturing industry closed 2024 with strong fourth-quarter results and solid YoY growth across most of the key industry segments, SEMI reports.
SUMCO to end wafer production at Miyazaki plant amid market shifts
February 20, 2025
Japanese silicon wafer manufacturer SUMCO says it will stop 200mm wafer production at the Miyazaki plant by 2026
Global silicon wafers shipments and revenue start recovery
February 18, 2025
In the second half of 2024, worldwide silicon wafer demand started to recover from the industry downcycle seen in 2023, the SEMI Silicon Manufacturers Group (SMG) reports.
HUHUTECH launches warehousing center to support chip industry
February 17, 2025
The Kumamoto Center is designed to provide efficient and reliable supply chain support to facilitate the rapid construction and expansion of regional semiconductor manufacturing clusters in Japan.
IIT Madras, ISRO develop aerospace quality chip
February 17, 2025
The IRIS (Indigenous RISCV Controller for Space Applications) chip was developed from the SHAKTI processor baseline. It can be used in diverse domains from IoT to computer systems.
Lam Research to invest $1.2 billion in Karnataka
February 14, 2025
US chip toolmaker Lam Research has signed a memorandum of understanding (MoU) with the Karnataka Industrial Area Development Board (KIADB) for the investment.
Infineon reaches next milestone on 200 mm SiC roadmap
February 13, 2025
Germany's Infineon Technologies says that it has made significant progress on its 200 mm silicon carbide (SiC) roadmap. The company plans to launch its first products based on the advanced 200 mm SiC technology in the first quarter of 2025.
Black Semiconductor launches new HQ – FabONE
February 12, 2025
Black Semiconductor GmbH has officially opened its new headquarters and production facility, FabONE, in Aachen, Germany, marking a major step toward developing graphene-based optical chip technology.
ERS electronic opens production and R&D facility in Germany
February 11, 2025
ERS electronic, a specialist in thermal management solutions for semiconductor manufacturing, has officially opened ERS Barbing, its new production and R&D facility, coupled with a cutting-edge Competence Center for Advanced Packaging and Advanced Backend technologies.
ALTER | HTV puts new chip and wafer test tech into operation
February 05, 2025
ALTER | HTV is enhancing its testing capabilities with new technology investments.
ST eyes workforce reduction of up to 3,000 jobs
February 04, 2025
STMicroelectronics is reportedly considering a significant workforce reduction, potentially affecting up to 6% of its employees, reports Bloomberg citing sources with insight.
SEALSQ unveils new U.S manufacturing facility plans
January 31, 2025
Semiconductor maker’s plan aligns with U.S. aims to onshore production and reduce reliance on foreign supply chains
Fab delays and cancellations start to pile up
January 30, 2025
The semiconductor industry is grappling with uncertainty as several high-profile semiconductor fab projects are struggling with delays, suspensions, or outright cancellations.
Ortel transfer wafer fabrication to CPFC
January 29, 2025
Ortel, a Photonics Foundries company, has transferred wafer fabrication for its C-Band, High-Power, Continuous Wave Laser Module platform to the Canadian Photonics Fabrication Centre (CPFC), a pure-play III-V semiconductor wafer foundry.
Minimal impact on wafer fabs following Taiwanese earthquake
January 23, 2025
A magnitude 6.4 earthquake struck southern Taiwan near Chiayi in the early hours of January 21, 2025. According to TrendForce, preliminary assessments indicate minimal damage to nearby wafer fabs.
Chipmetrics set up Dresden-based subsidiary
January 23, 2025
Chipmetrics has officially launched its new Dresden-based German subsidiary, Chipmetrics GmbH. Originally hailing from Joensuu in Finland, 2025 is set to be an important year for the company as it aims to aggressively scale both sales and marketing of its 3D semiconductor metrology products.
SIA backs CHIPS and Science Act agreements to bolster U.S semiconductor sector
January 20, 2025
The Semiconductor Industry Association (SIA) has praised the U.S. Department of Commerce for a series ofagreements aimed at enhancing the U.S. semiconductor supply chain
MACOM invests $345 to upgrade fabs
January 14, 2025
Updated:
MACOM's Massachusetts and North Carolina fabs are set for modernisation and expansion with federal and state backing.
David Heinzmann retires as CEO of Littelfuse
January 14, 2025
After a 40-year career, David Heinzmann will retire and step down as president and CEO of Littelfuse, Inc.
Nova Metrion selected by unnamed memory manufacturer
January 14, 2025
Nova’s Metrion platform has been selected by an unnamed memory manufacturer for its most advanced DRAM R&D as well as DRAM and NAND high-volume manufacturing lines.
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