Infineon completes €570 million acquisition of ams OSRAM sensor business July 02, 2026 ams OSRAM has completed the sale of its non-optical analog/mixed-signal sensor business to Infineon Technologies in a transaction valued at EUR 570 million.
Teledyne MEMS expands Edmonton operations June 30, 2026 Teledyne MEMS is expanding its manufacturing operations in Edmonton, Canada, backed by a CAD 620,000 grant from the Government of Alberta's Investment and Growth Fund. The expansion strengthens the province's role in the global semiconductor supply chain.
MKS opens Supercenter Factory in Malaysia with $96M investment June 29, 2026 Located on a 17-acre site with approximately 350,000 square feet of built-up space, the facility in Penang, Malaysia, will support the growing global demand for wafer fabrication equipment.
Forge Nano secures wafer fab equipment order from photonics firm June 12, 2026 Forge Nano’s TEPHRA platform is designed for high-volume semiconductor manufacturing and delivers the film uniformity, process repeatability, throughput, and manufacturing scalability required for commercial production environments.
Onsemi reportedly plans up to 300 job cuts at Czech facility June 09, 2026 US semiconductor manufacturer Onsemi is reportedly planning to cut between 200 and 300 jobs at its plant in Rožnov pod Radhoštěm in the Czech Republic, according to Czech media outlet e15. The cuts follow an earlier round of approximately 170 layoffs at the same facility in 2025.
Infineon to transfer backend production out of Tijuana over coming years June 08, 2026 Infineon Technologies says that it will gradually transfer production from its backend manufacturing site in Tijuana, Mexico, to other locations in its global network. The company says the move is aimed at improving scalability, productivity and long-term competitiveness.
Why stockpiling doesn’t work anymore June 03, 2026 For years, memory sourcing followed a familiar logic. Buyers negotiated hard, and, when prices rose, trusted that the cycle would eventually rebalance. That approach worked – until it didn’t.
Nvidia, TSMC use AI to advance chip design and manufacturing June 03, 2026 Nvidia CUDA-X libraries and AI models are accelerating TSMC workloads across lithography, transistor and process simulation, advanced process control and fab operations optimization.
Nexperia secures US manufacturing partner for power MOSFETs May 28, 2026 Less than a week after parent company Wingtech filed a CNY 8 billion lawsuit against its interim leadership in a Chinese court, Nexperia has announced a manufacturing partnership with US-based foundry Polar Semiconductor for the production of next-generation power MOSFETs.
IBM announces US quantum chip foundry with $1B CHIPS support May 27, 2026 The CHIPS incentive from the US Department of Commerce will support R&D efforts of a new IBM company, Anderon, which will operate as a 300-mm quantum wafer foundry. In addition to the USD 1 billion CHIPS incentive, IBM will contribute USD 1 billion of cash into Anderon.
SK hynix unveils ‘iHBM’ thermal solution to boost AI performance May 27, 2026 This latest heat management solution helps reduce thermal resistance by 30% and enables chips to operate stably even in high-temperature and high-pressure conditions.
Micron starts 1α DRAM production at Virginia fab in $2 billion expansion May 26, 2026 US memory manufacturer Micron has begun 1-alpha DRAM manufacturing at its Manassas, Virginia facility — the most advanced memory technology ever produced in the United States, according to the company. The more than USD 2 billion investment will quadruple Micron's DDR4 wafer supply at the site.
Wingtech sues Nexperia leadership – invoking China's anti-sanctions law May 25, 2026 The Nexperia dispute has taken a significant new turn. Parent company Wingtech Technology has filed a lawsuit against Nexperia and three members of its leadership team in a Chinese court, demanding CNY 8 billion (EUR 1 billion) in damages and calling for the reversal of Dutch governance measures it characterises as discriminatory.
Forge Nano delivers wafer fab equipment to leading firm May 15, 2026 Forge Nano’s TEPHRA platform will support development and manufacturing activities related to next-generation optical and photonics technologies used in high-speed communications and data infrastructure applications.
Molex completes its acquisition of Teramount May 14, 2026 Connectivity specialist Molex has completed the acquisition of Teramount, an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimised for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.
Global semiconductor materials market reached a record $73.2B in 2025 May 13, 2026 Global semiconductor materials market revenue increased 6.8% year-over-year to USD 73.2 billion in 2025, SEMI reports
SkyWater shareholders approve IonQ deal May 12, 2026 Stockholders of US semiconductor foundry SkyWater Technology have approved the company's merger agreement with quantum computing company IonQ, clearing a key hurdle in a USD 1.8 billion acquisition announced in January.
Memory is no longer a commodity – The industry hasn't fully caught up May 08, 2026 Nikolaos Florous of Memphis Electronic delivered a data-heavy, at times bluntly honest overview of the global memory market at Evertiq Expo Zürich – and his central message was uncomfortable: the rules have changed, and most of the industry is still playing by the old ones.
Global silicon wafer shipments grew 13% YoY in 1Q26 April 30, 2026 Worldwide silicon wafer shipments increased 13.1% year-on-year to 3,275 million square inches (MSI) from the 2,896 MSI recorded during the same quarter of 2025, reports SEMI.
Growth surge masks structural strain in semiconductor market April 30, 2026 During Evertiq Expo Zurich on April 23, 2026, Claus Aasholm, founder of Semiconductor Business Intelligence, offered a pointed assessment of a semiconductor industry growing rapidly — but not evenly. In his keynote and a follow-up conversation, Aasholm argued that while headline figures suggest unprecedented expansion, underlying dynamics point to structural imbalances across the supply chain.
ASE breaks ground on new Renwu facility to expand testing cluster in Kaohsiung April 16, 2026 Taiwan-based Advanced Semiconductor Engineering (ASE) has held a groundbreaking ceremony for a new facility in Renwu Industrial Park in Kaohsiung, Taiwan, aimed at establishing a semiconductor testing services cluster.
Molex to acquire Teramount to accelerate Co-Packaged Optics push April 16, 2026 Molex has entered into an agreement to acquire Israel-based Teramount, a developer of fiber-to-chip connectivity solutions, in a move aimed at accelerating the adoption of scalable Co-Packaged Optics (CPO).
Extended lead times for key components weigh on server growth April 15, 2026 Extended lead times for key semiconductor and hardware components are increasingly shaping supply conditions in the server market, according to TrendForce.
Semiconductor equipment billings reached $135B in 2025 April 09, 2026 Worldwide sales of semiconductor manufacturing equipment increased 15% to USD 135.1 billion in 2025 from USD 117.1 billion in 2024, driven by continued investment in advanced logic, memory, and AI-related capacity expansion, according to SEMI.
SUMCO shifts strategy from new fab to equipment upgrades April 07, 2026 SUMCO Corporation has received approval from Japan’s Ministry of Economy, Trade and Industry (METI) for an amended version of its “Plan for Ensuring Stable Supply” under the Economic Security Promotion Act, the company announced on March 27, 2026.
Inside one of Taiwan's semiconductor factories March 27, 2026 Taiwan’s semiconductor industry is often discussed in terms of scale, complexity, and technological leadership. Less often, we get a closer look at how these facilities actually operate from the inside.
STMicro starts STM32 MCUs deliveries in China March 25, 2026 Through a collaboration with domestic producer Huahong, STMicroelectronics has a dual supply chain, with fully processed and manufactured 40nm MCU products in China that are exact same design and technology as those made outside China.
Soitec secures deal to supply POI wafers for Skyworks March 20, 2026 Under the agreement, Soitec will provide POI wafers for Skyworks’ Sky5 platform to address RF requirements of today’s 5G smartphones. Soitec POI provides the performance necessary for seamless advanced coexistence in dense signal environments.
Analog Devices opens new Thailand facility to boost capacity March 19, 2026 US semiconductor company Analog Devices has opened a new manufacturing facility in Thailand aimed at expanding its production and test capacity and strengthening supply chain resilience.
SK Group chairman: Wafer shortage could persist until 2030 March 17, 2026 SK Group Chairman Chey Tae-won said the global shortage of semiconductor wafers could last until 2030, as demand driven by artificial intelligence continues to outpace supply, according to Reuters.
Qnity opens new US facility to expand CMP materials production March 12, 2026 US semiconductor materials supplier Qnity Electronics has opened a new manufacturing facility in Newark, Delaware, aimed at expanding production capacity for chemical mechanical planarization (CMP) materials used in chip fabrication.
AI demand lifts top foundries' Q4 revenue, Samsung gains share March 12, 2026 Strong demand tied to AI infrastructure and new smartphone launches helped push revenue for the world’s ten largest semiconductor foundries up in the fourth quarter of 2025, according to new research from TrendForce.