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Hamburg-waferfab

November 03, 2025
The latest development in ongoing tensions between Nexperia’s Netherlands headquarters and its Chinese subsidiary has led the company to suspend wafer shipments to its assembly plant in Dongguan, Guangdong province, according to a letter reviewed by Reuters – potentially worsening global chip shortages in the automotive sector.

PCB-India_2

November 03, 2025
Chennai-based SicSem is partnering with British firm Clas-SiC Wafer Fab Ltd to set up the silicon carbide (SiC) facility in Odisha. The plant is expected to create 5,000 direct and indirect jobs in the region.

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pile-of-wafers

October 29, 2025
Global shipments of silicon wafers are projected to increase 5.4% in 2025 to 12,824 million square inches (MSI) followed by steady growth through 2028 when the market is expected to reach a new industry record of 15,485 MSI, SEMI reports.

chip_wafer_v2killer7603

October 27, 2025
India’s L&T Semiconductor Technologies Ltd (LTSCT) will utilize HYS’s facilities in Taiwan to engineer and produce wafers to meet specifications tailored for automotive and industrial applications.

FAB300-Novara-Italy

October 16, 2025
Taiwanese semiconductor company, GlobalWafers, has officially inaugurated FAB300, a new 300mm semiconductor wafer manufacturing facility at MEMC Electronic Materials in Novara, Italy. The company describes the site as one of Europe’s most advanced and fully integrated silicon wafer fabs.

pile-of-wafers

October 16, 2025
According to TrendForce, wafer foundry utilisation during the second half of 2025 has remained more resilient than anticipated. Several factors are contributing to this, including the postponed US semiconductor tariffs, low inventory at IC vendors, the peak smartphone season, and ongoing high demand for AI.

Kyushu

October 15, 2025
Tokyo Electron has completed a new development building for its subsidiary Tokyo Electron Kyushu in Koshi-shi, Kumamoto.

HDD

October 14, 2025
TrendForce’s latest investigations reveal that the surge in AI inference applications is creating a strong need for real-time data access and rapid processing of large data sets. As such, both HDD and SSD suppliers are expanding their high-capacity storage options.

topping-off-ceremony

October 08, 2025
VisionPower Semiconductor Manufacturing Company (VSMC) has reached a key milestone in the construction of its new 300-millimeter wafer fabrication facility in Singapore.

handshake-l

October 07, 2025
ShunYun Technology Ltd (SYT), a manufacturer of optical transceivers, and NewPhotonics, a designer of photonic integrated circuit (PIC) chips for data centre optical interconnect, have entered into a strategic OSAT partnership for volume manufacturing of the NewPhotonics NPG product line.

Arizona-render

October 07, 2025
Amkor Technology has broken ground on its new advanced semiconductor packaging and test campus in Arizona, expanding its planned investment to USD 7 billion.

Forge_chip

October 03, 2025
The partnership establishes a collaborative foundation for developing commercially viable in-space semiconductor manufacturing capabilities, combining Space Forge Inc.’s microgravity-enabled materials deposition processes with United Semiconductors’ expertise in ternary III-V semiconductor crystal growth and wafer processing.

Muse-semiconductor-acqusition

October 02, 2025
GS Microelectronics US, Inc. (GSME), a supplier of IC design and manufacturing solutions, has acquired Muse Semiconductor, a provider of multi-project wafer (MPW) services, enabling chip designs built on TSMC technology.

equipment

October 02, 2025
Axcelis Technologies and Veeco Instruments have entered into a definitive agreement to merge in an all-stock transaction that values the combined company at approximately USD 4.4 billion. The deal will create one of the largest US suppliers of semiconductor manufacturing equipment.

PCB-India_2

October 01, 2025
SEALSQ Corp and Kaynes SemiCon have signed a term sheet to form a joint venture, SEALKAYNESQ Ltd, which will establish India’s first Outsourced Semiconductor Test and Personalisation (OSTP) facility.

Thomas-Muhleck-Alexander-Tschernev

September 26, 2025
The Kreuzwertheim-based mechanical engineering group Kurtz Ersa has taken over the business operations of the insolvent equipment manufacturer ATV Technologie GmbH, based in Vaterstetten near Munich.

hynix_NAND

September 25, 2025
TrendForce’s recent research shows that strong consumer demand in the first half of the year caused the usual peak season in the second half to fall short.

engineer-holding-wafer

September 25, 2025
Infineon Technologies has signed a definitive agreement to transfer its backend manufacturing site in Bangkok/Nonthaburi, Thailand, to Malaysian Pacific Industries Berhad (MPI).

Opens-Access-to-US-Semiconductor-Facilities

September 23, 2025
Northrop Grumman says that its Microelectronics Center will now provide external access to the company’s three US government-accredited semiconductor manufacturing facilities. The move is intended to expand secure domestic production of defense-grade microelectronics and strengthen US supply chain.

Pocatello-fab

September 18, 2025
US-based LA Semiconductor has launched the sale process for its wafer fabrication facility in Pocatello, Idaho, engaging Macquarie Group to oversee the transaction.

axonite_chip

September 17, 2025
The total phased investment for the fully integrated SiC power semiconductor project in Dholera, Gujarat, is estimated to be over USD 1 billion. Work on the project is expected to start by April 2026.

Solar_factory

September 12, 2025
The project, to be developed on 54 acres of land in central India, will produce TOPCon cells with a planned capacity of 5 GW. Implementation of Phase 1, which includes setting up a solar cell manufacturing capacity of 2 GW, has started.

New-Cleanroom-Malaysian-Site

September 12, 2025
X-FAB has officially opened a new manufacturing line at its Sarawak facility. This expansion – representing a USD 600 million investment – has added 6,000 square meters of cleanroom space and was completed in just two years, from groundbreaking to the first production lots.

sign

September 04, 2025
The TWINSCAN EXE:5200B, the first model for volume production of ASML’s High NA EUV product line, enables printing of transistors 1.7 times smaller and achievement of transistor densities 2.9 times higher, compared with the existing EUV system, with a 40% improvement in the NA to 0.55 from 0.33.

George-Hsu

September 02, 2025
Koh Young Technology has appointed George Hsu as Managing Director of its newly opened Taiwan office, the company announced.

office_logo

August 28, 2025
Toshiba Electronic Devices & Storage Corporation and SICC have signed a memorandum of understanding (MOU) to explore collaboration on SiC power semiconductor wafers, the companies announced.

August 27, 2025
Japanese foundry Rapidus has entered into a strategic collaboration with Keysight Technologies Japan K.K. The companies have signed a Memorandum of Cooperation to develop a high-precision Process Design Kit (PDK) for Rapidus’ 2nm gate-all-around (GAA) semiconductors

axonite_chip

August 25, 2025
The China-based semiconductor equipment firm claims that US firm Applied Materials had illegally obtained and used Beijing E-Town’s core technology secrets related to plasma sources and wafer surface treatment.

chip

August 22, 2025
The Tiling crystal film bonding (CFB) tech developed by Japanese firm OKI allows for 52 repeated tiling operations over the entire surface of a 300 mm silicon wafer using a single 2-inch InP wafer, enabling efficient use of InP-based materials.

PCB-India_2

August 20, 2025
The four new proposals approved are from SiCSem, CDIL, 3D Glass Solutions and ASIP Technologies. The SiCSem and 3D Glass units will be set up in Odisha, CDIL will expand its facility in Punjab, and ASIP will establish a plant in Andhra Pradesh.

thin-wafer-dicing

August 15, 2025
This partnership focuses on enhancing wafer dicing processes, specialized wafer preparation for heterogeneous integration and assembly, as well as achieving ultra-smooth surfaces through polishing optimization.

August 13, 2025
TMSC is planning to gradually phase out its 6-inch wafer production over the next two years, while consolidating its 8-inch wafer operations to enhance efficiency, Reuters reports.

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