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August 21, 2026
EMS provider Flex and AI systems company Cerebras have expanded their manufacturing partnership to increase production of the Cerebras CS-3 AI accelerator system at Flex's Milpitas, California facility. Production capacity is expected to grow approximately seven times through 2026.

August 20, 2026
ASMPT announced in late July bulk orders for more than 50 of its Chip-to-Substrate Thermo-Compression Bonding tools from OSAT customers, for use in advanced AI computing chip packaging.

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August 04, 2026
AEMtec specializes in delivering end-to-end solutions across the entire packaging and integration value chain. The acquisition enhances Micross’ presence in continental Europe and broadens its portfolio of high-reliability microelectronic services and products.

fab-P12

July 30, 2026
Second quarter consolidated revenue was NT$68.73 billion, increasing 12.6% from NT$61.04 billion in 1Q26. UMC’s Board of Directors has approved a plan to expand cleanroom capacity at its Singapore P4 facility and to construct a new fab in Taiwan.

PCB-world_1

July 30, 2026
SEMI Silicon Manufacturers Group (SMG) has reported that worldwide silicon wafer shipments increased 7.4% year-on-year to 3,573 million square inches (MSI) from the 3,327 MSI recorded during the same quarter of 2025.

SLC_NAND

July 16, 2026
Meanwhile, demand for SLC NAND continues to grow in AI edge computing, data centers, and automotive electronics, causing the supply-demand gap to widen quickly, TrendForce notes.

July 15, 2026
Today, the esmo Group employs approximately 285 people and generates annual revenue of around EUR 60 million through its two business divisions: semiconductor test solutions and special-purpose machinery.

team

July 13, 2026
Founded in 2022 as a spin-out of the Technical University of Munich, QuantumDiamonds (QD) will use the funding to deliver lab systems to leading chipmakers and advance wafer-level capabilities for high-throughput fab inspection.

solar_mrganso

July 07, 2026
The first products manufactured at the Gangaikondan plant are Vikram Solar’s Hypersol N-Type TOPCon G12R modules. They deliver 615-640 Wp of rated power with module efficiencies of up to 23%.

groundbreaking-sherman-texas-2026

July 03, 2026
Coherent has signed a letter of intent to receive up to USD 50 million under the US CHIPS and Science Act to expand its indium phosphide semiconductor manufacturing facility in Sherman, Texas. The expansion will double manufacturing space and quadruple wafer production capacity, and is expected to create more than 1,000 jobs.

logos-on-buildings

July 02, 2026
ams OSRAM has completed the sale of its non-optical analog/mixed-signal sensor business to Infineon Technologies in a transaction valued at EUR 570 million.

production

June 30, 2026
Teledyne MEMS is expanding its manufacturing operations in Edmonton, Canada, backed by a CAD 620,000 grant from the Government of Alberta's Investment and Growth Fund. The expansion strengthens the province's role in the global semiconductor supply chain.

Supercenter_Factory_Malaysia

June 29, 2026
Located on a 17-acre site with approximately 350,000 square feet of built-up space, the facility in Penang, Malaysia, will support the growing global demand for wafer fabrication equipment.

axonite_chip

June 12, 2026
Forge Nano’s TEPHRA platform is designed for high-volume semiconductor manufacturing and delivers the film uniformity, process repeatability, throughput, and manufacturing scalability required for commercial production environments.

June 09, 2026
US semiconductor manufacturer Onsemi is reportedly planning to cut between 200 and 300 jobs at its plant in Rožnov pod Radhoštěm in the Czech Republic, according to Czech media outlet e15. The cuts follow an earlier round of approximately 170 layoffs at the same facility in 2025.

Tijuana-Mexico

June 08, 2026
Infineon Technologies says that it will gradually transfer production from its backend manufacturing site in Tijuana, Mexico, to other locations in its global network. The company says the move is aimed at improving scalability, productivity and long-term competitiveness.

Marco-Mezger-2026

June 03, 2026
For years, memory sourcing followed a familiar logic. Buyers negotiated hard, and, when prices rose, trusted that the cycle would eventually rebalance. That approach worked – until it didn’t.

tsmc_chip_design

June 03, 2026
Nvidia CUDA-X libraries and AI models are accelerating TSMC workloads across lithography, transistor and process simulation, advanced process control and fab operations optimization.

Bloomington-Minnesota-manufacturing-facility

May 28, 2026
Less than a week after parent company Wingtech filed a CNY 8 billion lawsuit against its interim leadership in a Chinese court, Nexperia has announced a manufacturing partnership with US-based foundry Polar Semiconductor for the production of next-generation power MOSFETs.

Quantum_Wafer

May 27, 2026
The CHIPS incentive from the US Department of Commerce will support R&D efforts of a new IBM company, Anderon, which will operate as a 300-mm quantum wafer foundry. In addition to the USD 1 billion CHIPS incentive, IBM will contribute USD 1 billion of cash into Anderon.

May 27, 2026
This latest heat management solution helps reduce thermal resistance by 30% and enables chips to operate stably even in high-temperature and high-pressure conditions.

May 26, 2026
US memory manufacturer Micron has begun 1-alpha DRAM manufacturing at its Manassas, Virginia facility — the most advanced memory technology ever produced in the United States, according to the company. The more than USD 2 billion investment will quadruple Micron's DDR4 wafer supply at the site.

nexperia-4

May 25, 2026
The Nexperia dispute has taken a significant new turn. Parent company Wingtech Technology has filed a lawsuit against Nexperia and three members of its leadership team in a Chinese court, demanding CNY 8 billion (EUR 1 ‌billion) in damages and calling for the reversal of Dutch governance measures it characterises as discriminatory.

Nano

May 15, 2026
Forge Nano’s TEPHRA platform will support development and manufacturing activities related to next-generation optical and photonics technologies used in high-speed communications and data infrastructure applications.

Guadalajara-mexico-plant

May 14, 2026
Connectivity specialist Molex has completed the acquisition of Teramount, an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimised for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.

ww-materials-market

May 13, 2026
Global semiconductor materials market revenue increased 6.8% year-over-year to USD 73.2 billion in 2025, SEMI reports

Minnesota-facility

May 12, 2026
Stockholders of US semiconductor foundry SkyWater Technology have approved the company's merger agreement with quantum computing company IonQ, clearing a key hurdle in a USD 1.8 billion acquisition announced in January.

Zurich-2026-Nick-presentation

May 08, 2026
Nikolaos Florous of Memphis Electronic delivered a data-heavy, at times bluntly honest overview of the global memory market at Evertiq Expo Zürich – and his central message was uncomfortable: the rules have changed, and most of the industry is still playing by the old ones.

30-04-2026

April 30, 2026
Worldwide silicon wafer shipments increased 13.1% year-on-year to 3,275 million square inches (MSI) from the 2,896 MSI recorded during the same quarter of 2025, reports SEMI.

Expo-ZRH26-claus-speaking

April 30, 2026
During Evertiq Expo Zurich on April 23, 2026, Claus Aasholm, founder of Semiconductor Business Intelligence, offered a pointed assessment of a semiconductor industry growing rapidly — but not evenly. In his keynote and a follow-up conversation, Aasholm argued that while headline figures suggest unprecedented expansion, underlying dynamics point to structural imbalances across the supply chain.

groundbreaking-10-04-2026

April 16, 2026
Taiwan-based Advanced Semiconductor Engineering (ASE) has held a groundbreaking ceremony for a new facility in Renwu Industrial Park in Kaohsiung, Taiwan, aimed at establishing a semiconductor testing services cluster.

April 16, 2026
Molex has entered into an agreement to acquire Israel-based Teramount, a developer of fiber-to-chip connectivity solutions, in a move aimed at accelerating the adoption of scalable Co-Packaged Optics (CPO).

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