Infineon opens backend site in Bangkok with room for five modules October 01, 2026 Infineon Technologies has inaugurated a new backend manufacturing site in Samut Prakan, Bangkok. The site currently has one module but is designed to grow to five, which could make it one of Infineon's largest backend sites over time.
Tata Electronics, Kelington to advance development of Dholera Fab September 25, 2026 Kelington will support the delivery of critical infrastructure and systems required for semiconductor manufacturing. The partnership will enable Tata Electronics to accelerate the facility’s operational readiness for silicon wafer production.
Nexstrom raises $12M to commercialize wafer-scale 2D chip platform September 24, 2026 The funding will support ongoing platform development, collaborations with semiconductor foundries and expansion of Nexstrom’s engineering and leadership teams as the company advances high-performance, low-power chips for AI, data centers and computing applications.
Nexperia partners with Tata Electronics on semiconductor manufacturing in India September 23, 2026 Nexperia has announced a strategic partnership with Tata Electronics covering wafer fabrication, assembly and test, and technology development across two sites in India.
US firm Quantinuum finalizes $100 million CHIPS R&D award September 23, 2026 The federal funding deployed through the CHIPS and Science Act supports R&D and US quantum semiconductor manufacturing capabilities needed to deploy large-scale, fault-tolerant trapped-ion quantum computers.
China’s CXMT says 5th-gen DRAM platform enters mass production September 21, 2026 The new platform is designed to make more powerful memory chips at lower cost and using less power, Reuters reports. The potential breakthrough could make China compete for the memory market share with the likes of Samsung and SK hynix.
Anderon finalizes agreement for $1 billion CHIPS award September 21, 2026 Anderon, an IBM company, operates a state-of-the-art 300-millimeter pure-play quantum wafer foundry, backed by an additional USD 1 billion investment from IBM. Headquartered in New York, the new venture serves the quantum industry as a pure-play foundry.
Applied Materials to invest $5 billion in India by 2035 September 18, 2026 The investment will be deployed towards deepening R&D in India, expanding the domestic semiconductor supply chain and developing future talent. The US company also plans to establish a 140-acre advanced semiconductor research park in India.
SkyWater partners with Qolab to advance superconducting technology September 18, 2026 Under the agreement, Qolab will serve as a lead customer on SkyWater’s newly launched SC250 superconducting platform to advance its Quantum System-in-Package (QSiP). QSiP architecture is designed to address cost, complexity and form-factor challenges in scaling quantum systems.
Elmos and SK keyfoundry extend partnership to 130nm technology through 2037 September 10, 2026 German automotive semiconductor manufacturer Elmos Semiconductor and South Korean foundry SK keyfoundry have signed an agreement expanding their collaboration to include 130nm technology, securing long-term wafer capacity through 2037. The two companies have worked together on 350nm technology for 18 years.
Amkor expands Arizona campus to $12 billion investment September 09, 2026 Amkor Technology has announced a Phase 2 expansion of its Arizona advanced packaging and test campus, increasing the total planned investment to approximately USD 12 billion. The expansion adds 60,000 square metres of cleanroom space, bringing the campus to approximately 93,000 square metres in total.
Silicon Labs opens new R&D lab in Austin with Texas CHIPS Act support September 08, 2026 Silicon Labs has opened a new research and development laboratory at its headquarters in Austin, Texas, expanding its capabilities for advanced chip design, testing and validation.
Novo Nordisk Foundation to establish quantum chip fab in Copenhagen September 08, 2026 Quantum Foundry Copenhagen and the Novo Nordisk Foundation have announced plans to establish a 5,300 square metre quantum chip fabrication facility in Copenhagen, Denmark. The facility is expected to open in 2027 and will develop and scale manufacturing capabilities for next-generation quantum chips.
IBM completes acquisition of HRL to advance quantum ecosystem August 31, 2026 The combination brings together complementary expertise in quantum computing, sensing, materials science, and advanced technologies to accelerate future innovation
Doosan acquires 70.6% stake in SK Siltron August 26, 2026 South Korean conglomerate Doosan has signed a share purchase agreement to acquire a 70.6% stake in SK Siltron from SK Group for KRW 2.3 trillion, equivalent to approximately USD 1.7 billion. The deal was approved by Doosan's board on July 31.
Zeiss SMT expands capacity in Oberkochen and key semiconductor markets August 26, 2026 Zeiss Semiconductor Manufacturing Technology has reached a milestone in its Oberkochen site expansion with the move-in to a new office building in July 2026, roughly four years after the groundbreaking ceremony in May 2022. In total, the expansion adds approximately 25,000 square metres of space for production and production-related areas at the site.
Flex and Cerebras scale AI supercomputer production in California August 21, 2026 EMS provider Flex and AI systems company Cerebras have expanded their manufacturing partnership to increase production of the Cerebras CS-3 AI accelerator system at Flex's Milpitas, California facility. Production capacity is expected to grow approximately seven times through 2026.
ASMPT secures orders for more than 50 chip-to-substrate bonding tools August 20, 2026 ASMPT announced in late July bulk orders for more than 50 of its Chip-to-Substrate Thermo-Compression Bonding tools from OSAT customers, for use in advanced AI computing chip packaging.
Micross to acquire AEMtec, expanding European footprint August 04, 2026 AEMtec specializes in delivering end-to-end solutions across the entire packaging and integration value chain. The acquisition enhances Micross’ presence in continental Europe and broadens its portfolio of high-reliability microelectronic services and products.
UMC reports 17% increase in YoY second quarter revenue July 30, 2026 Second quarter consolidated revenue was NT$68.73 billion, increasing 12.6% from NT$61.04 billion in 1Q26. UMC’s Board of Directors has approved a plan to expand cleanroom capacity at its Singapore P4 facility and to construct a new fab in Taiwan.
Worldwide silicon wafer shipments increase 7.4% in Q2 2026 July 30, 2026 SEMI Silicon Manufacturers Group (SMG) has reported that worldwide silicon wafer shipments increased 7.4% year-on-year to 3,573 million square inches (MSI) from the 3,327 MSI recorded during the same quarter of 2025.
Niche demand, MLC migration to drive SLC NAND prices up to 170% July 16, 2026 Meanwhile, demand for SLC NAND continues to grow in AI edge computing, data centers, and automotive electronics, causing the supply-demand gap to widen quickly, TrendForce notes.
esmo marks 25 years, expands in Germany, China and Taiwan July 15, 2026 Today, the esmo Group employs approximately 285 people and generates annual revenue of around EUR 60 million through its two business divisions: semiconductor test solutions and special-purpose machinery.
QD raises €91 million to scale next-generation chip inspection July 13, 2026 Founded in 2022 as a spin-out of the Technical University of Munich, QuantumDiamonds (QD) will use the funding to deliver lab systems to leading chipmakers and advance wafer-level capabilities for high-throughput fab inspection.
Vikram Solar rolls out first module from Tamil Nadu facility July 07, 2026 The first products manufactured at the Gangaikondan plant are Vikram Solar’s Hypersol N-Type TOPCon G12R modules. They deliver 615-640 Wp of rated power with module efficiencies of up to 23%.
Coherent receives $50 million CHIPS funding to expand InP fab in Texas July 03, 2026 Coherent has signed a letter of intent to receive up to USD 50 million under the US CHIPS and Science Act to expand its indium phosphide semiconductor manufacturing facility in Sherman, Texas. The expansion will double manufacturing space and quadruple wafer production capacity, and is expected to create more than 1,000 jobs.
Infineon completes €570 million acquisition of ams OSRAM sensor business July 02, 2026 ams OSRAM has completed the sale of its non-optical analog/mixed-signal sensor business to Infineon Technologies in a transaction valued at EUR 570 million.
Teledyne MEMS expands Edmonton operations June 30, 2026 Teledyne MEMS is expanding its manufacturing operations in Edmonton, Canada, backed by a CAD 620,000 grant from the Government of Alberta's Investment and Growth Fund. The expansion strengthens the province's role in the global semiconductor supply chain.
MKS opens Supercenter Factory in Malaysia with $96M investment June 29, 2026 Located on a 17-acre site with approximately 350,000 square feet of built-up space, the facility in Penang, Malaysia, will support the growing global demand for wafer fabrication equipment.
Forge Nano secures wafer fab equipment order from photonics firm June 12, 2026 Forge Nano’s TEPHRA platform is designed for high-volume semiconductor manufacturing and delivers the film uniformity, process repeatability, throughput, and manufacturing scalability required for commercial production environments.
Onsemi reportedly plans up to 300 job cuts at Czech facility June 09, 2026 US semiconductor manufacturer Onsemi is reportedly planning to cut between 200 and 300 jobs at its plant in Rožnov pod Radhoštěm in the Czech Republic, according to Czech media outlet e15. The cuts follow an earlier round of approximately 170 layoffs at the same facility in 2025.
Infineon to transfer backend production out of Tijuana over coming years June 08, 2026 Infineon Technologies says that it will gradually transfer production from its backend manufacturing site in Tijuana, Mexico, to other locations in its global network. The company says the move is aimed at improving scalability, productivity and long-term competitiveness.