Evertiq - First In Electronics News & Expo

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Solar_factory

September 12, 2025
The project, to be developed on 54 acres of land in central India, will produce TOPCon cells with a planned capacity of 5 GW. Implementation of Phase 1, which includes setting up a solar cell manufacturing capacity of 2 GW, has started.

New-Cleanroom-Malaysian-Site

September 12, 2025
X-FAB has officially opened a new manufacturing line at its Sarawak facility. This expansion – representing a USD 600 million investment – has added 6,000 square meters of cleanroom space and was completed in just two years, from groundbreaking to the first production lots.

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sign

September 04, 2025
The TWINSCAN EXE:5200B, the first model for volume production of ASML’s High NA EUV product line, enables printing of transistors 1.7 times smaller and achievement of transistor densities 2.9 times higher, compared with the existing EUV system, with a 40% improvement in the NA to 0.55 from 0.33.

George-Hsu

September 02, 2025
Koh Young Technology has appointed George Hsu as Managing Director of its newly opened Taiwan office, the company announced.

office_logo

August 28, 2025
Toshiba Electronic Devices & Storage Corporation and SICC have signed a memorandum of understanding (MOU) to explore collaboration on SiC power semiconductor wafers, the companies announced.

August 27, 2025
Japanese foundry Rapidus has entered into a strategic collaboration with Keysight Technologies Japan K.K. The companies have signed a Memorandum of Cooperation to develop a high-precision Process Design Kit (PDK) for Rapidus’ 2nm gate-all-around (GAA) semiconductors

axonite_chip

August 25, 2025
The China-based semiconductor equipment firm claims that US firm Applied Materials had illegally obtained and used Beijing E-Town’s core technology secrets related to plasma sources and wafer surface treatment.

chip

August 22, 2025
The Tiling crystal film bonding (CFB) tech developed by Japanese firm OKI allows for 52 repeated tiling operations over the entire surface of a 300 mm silicon wafer using a single 2-inch InP wafer, enabling efficient use of InP-based materials.

PCB-India_2

August 20, 2025
The four new proposals approved are from SiCSem, CDIL, 3D Glass Solutions and ASIP Technologies. The SiCSem and 3D Glass units will be set up in Odisha, CDIL will expand its facility in Punjab, and ASIP will establish a plant in Andhra Pradesh.

thin-wafer-dicing

August 15, 2025
This partnership focuses on enhancing wafer dicing processes, specialized wafer preparation for heterogeneous integration and assembly, as well as achieving ultra-smooth surfaces through polishing optimization.

August 13, 2025
TMSC is planning to gradually phase out its 6-inch wafer production over the next two years, while consolidating its 8-inch wafer operations to enhance efficiency, Reuters reports.

global-wafer-shipments

August 06, 2025
SEMI reports that worldwide silicon wafer shipments increased 9.6% year-on-year to 3,327 million square inches (MSI) from the 3,035 MSI recorded during the same quarter of 2024.

Kaga-wafer-fab

August 05, 2025
Farnell has strengthened its long-standing partnership with Toshiba by introducing a range of new Toshiba products now available through Farnell Japan.

cooperation-3

July 17, 2025
When finalized, the Joint Development Agreement (JDA) will focus on the co-development of next-generation dielectric ink solutions for advanced packaging manufacturing, particularly tailored for AI chip packaging applications.

Herzogenrath-2

July 16, 2025
Aixtron’s Close Coupled Showerhead (CCS) system is set in a 200mm configuration and is currently being installed at the Cambridge Graphene Centre to be used for the UK’s Layered Materials Research Foundry (LMRF).

keyfoundry

July 15, 2025
RDL refers to metal wiring and insulating layers on top of semiconductor chips to enable electrical connections. The newly co-developed Direct RDL by Korean companies SK keyfoundry and LB Semicon supports power semiconductors with high current capacity.

PCB-Taiwan_2

July 11, 2025
PMTC is recognized for its high-reliability solder alloys that offer excellent ductility, thermal fatigue resistance and drop performance. The company brings in-house alloy development, application expertise and a strong R&D foundation, positioning SHENMAO to accelerate innovation in semiconductor solder materials.

Evertiq-IM-Alistair-Jones

July 10, 2025
We are all aware that the semiconductor industry is highly volatile. But that’s not just because of the market itself; in fact, a substantial part is self-inflicted. Because, in times of shortages, companies panic and place inflated orders with multiple manufacturers or suppliers. We see the same thing happening again now with DDR4. Samsung, which captures about half of the DRAM market, has announced that it will wind down its DDR4 production by the end of 2025. This is causing a ripple effect that we have seen time and again.

GaN_Singapore

July 08, 2025
The centre brings advanced GaN manufacturing capabilities to Singapore, positioning local innovators to compete in high-growth global markets such as advanced 5G and 6G communication systems, radars and satellite communications.

quantum-technologies-2

July 07, 2025
In this partnership, researchers from Mitsubishi Chemical's Materials Design Laboratory will provide deep expertise on EUV photoresist materials, including their molecular structures, compositions, and reactivity.

July 04, 2025
Toshiba Devices & Storage Group is promoting measures to advance the achievement of carbon neutrality. It aims to achieve net-zero greenhouse gas emissions from all its manufacturing sites by fiscal year 2030.

fab-25

July 04, 2025
By adding approximately 400,000 wafer starts per year in capacity, Fab 25 brings meaningful scale to SkyWater’s exclusively US-based, pure-play foundry operation and enables SkyWater to enhance its advanced technology services (ATS) offering by incorporating the site’s current capabilities.

expo-mmo25-claus-aasholm-interview

July 02, 2025
During Evertiq Expo Malmö 2025, Claus Aasholm, founder of Semiconductor Business Intelligence, offered a sobering reassessment of the global semiconductor market. In his keynote and follow-up interview, Aasholm argued that the industry’s historical four-year cycle has broken down – replaced by a fragmented, profit-driven upswing felt by only a select few.

Vantaa-fab-expansion-production-start

June 30, 2025
Okmetic has produced the first silicon wafers from its newly expanded fabrication facility in Vantaa, Finland. The milestone marks the completion of the initial phase of what will ultimately be a EUR 400 million expansion.

product

June 30, 2025
The solution aims to significantly improve wafer yield for advanced semiconductor designs at nodes below 7nm by addressing IR Drop issues. It features an advanced mathematical modeling of IR Drop and leverages quantum computing’s ability to solve the resulting complex Partial Differential Equations.

handshake-l

June 26, 2025
Radiant Opto-Electronics is acquiring Finnish advanced optical materials company Inkron Oy from Japan’s Nagase Group for JPY 1.035 billion (EUR 6.12 million).

300mm-Fab-Outlook-2Q25-Update

June 26, 2025
The global semiconductor industry is expected to significantly expand its advanced manufacturing capacity through 2028, driven by accelerating demand for artificial intelligence applications, according to SEMI’s latest 300mm Fab Outlook report.

June 25, 2025
As previously reported by Evertiq, Wolfspeed has entered into a restructuring agreement with key creditors aimed at reducing its debt load and cash interest expenses. Renesas Electronics is among the parties that have signed the Restructuring Support Agreement, a move expected to result in a substantial financial loss for the Japanese semiconductor company.

foundry-landscape-capacity-share

June 25, 2025
Market intelligence and analyst firm Yole Group explores the status of the semiconductor foundry in its latest report – digging deep into the geopolitical, economic, and capacity realignments setting the stage for the foundry industry.

engineer-300mm-semiconductor-fabs-Sherman

June 18, 2025
Texas Instruments plans to invest more than USD 60 billion in US-based semiconductor manufacturing, marking what the company describes as the largest investment in foundational chip production in US history. The investment spans seven fabs across three major sites in Texas and Utah and is expected to support more than 60,000 new jobs.

products

June 17, 2025
Trymax Semiconductor Equipment has reached a key milestone with the installation of its 500th process chamber in Asia. The Dutch company, known for its plasma- and UV-based solutions for semiconductor manufacturing, reported continued demand from regional markets including China, Taiwan, South Korea, Malaysia, and the Philippines.

lab

June 17, 2025
Applied Materials and CEA-Leti have entered what they call the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors. Under a memorandum of understanding (MOU), the companies plan to expand their joint lab and develop materials engineering solutions to address emerging infrastructure challenges in AI data centres.

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