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Kyushu

October 15, 2025
Tokyo Electron has completed a new development building for its subsidiary Tokyo Electron Kyushu in Koshi-shi, Kumamoto.

HDD

October 14, 2025
TrendForce’s latest investigations reveal that the surge in AI inference applications is creating a strong need for real-time data access and rapid processing of large data sets. As such, both HDD and SSD suppliers are expanding their high-capacity storage options.

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topping-off-ceremony

October 08, 2025
VisionPower Semiconductor Manufacturing Company (VSMC) has reached a key milestone in the construction of its new 300-millimeter wafer fabrication facility in Singapore.

handshake-l

October 07, 2025
ShunYun Technology Ltd (SYT), a manufacturer of optical transceivers, and NewPhotonics, a designer of photonic integrated circuit (PIC) chips for data centre optical interconnect, have entered into a strategic OSAT partnership for volume manufacturing of the NewPhotonics NPG product line.

Arizona-render

October 07, 2025
Amkor Technology has broken ground on its new advanced semiconductor packaging and test campus in Arizona, expanding its planned investment to USD 7 billion.

Forge_chip

October 03, 2025
The partnership establishes a collaborative foundation for developing commercially viable in-space semiconductor manufacturing capabilities, combining Space Forge Inc.’s microgravity-enabled materials deposition processes with United Semiconductors’ expertise in ternary III-V semiconductor crystal growth and wafer processing.

Muse-semiconductor-acqusition

October 02, 2025
GS Microelectronics US, Inc. (GSME), a supplier of IC design and manufacturing solutions, has acquired Muse Semiconductor, a provider of multi-project wafer (MPW) services, enabling chip designs built on TSMC technology.

equipment

October 02, 2025
Axcelis Technologies and Veeco Instruments have entered into a definitive agreement to merge in an all-stock transaction that values the combined company at approximately USD 4.4 billion. The deal will create one of the largest US suppliers of semiconductor manufacturing equipment.

PCB-India_2

October 01, 2025
SEALSQ Corp and Kaynes SemiCon have signed a term sheet to form a joint venture, SEALKAYNESQ Ltd, which will establish India’s first Outsourced Semiconductor Test and Personalisation (OSTP) facility.

Thomas-Muhleck-Alexander-Tschernev

September 26, 2025
The Kreuzwertheim-based mechanical engineering group Kurtz Ersa has taken over the business operations of the insolvent equipment manufacturer ATV Technologie GmbH, based in Vaterstetten near Munich.

hynix_NAND

September 25, 2025
TrendForce’s recent research shows that strong consumer demand in the first half of the year caused the usual peak season in the second half to fall short.

engineer-holding-wafer

September 25, 2025
Infineon Technologies has signed a definitive agreement to transfer its backend manufacturing site in Bangkok/Nonthaburi, Thailand, to Malaysian Pacific Industries Berhad (MPI).

Opens-Access-to-US-Semiconductor-Facilities

September 23, 2025
Northrop Grumman says that its Microelectronics Center will now provide external access to the company’s three US government-accredited semiconductor manufacturing facilities. The move is intended to expand secure domestic production of defense-grade microelectronics and strengthen US supply chain.

Pocatello-fab

September 18, 2025
US-based LA Semiconductor has launched the sale process for its wafer fabrication facility in Pocatello, Idaho, engaging Macquarie Group to oversee the transaction.

axonite_chip

September 17, 2025
The total phased investment for the fully integrated SiC power semiconductor project in Dholera, Gujarat, is estimated to be over USD 1 billion. Work on the project is expected to start by April 2026.

Solar_factory

September 12, 2025
The project, to be developed on 54 acres of land in central India, will produce TOPCon cells with a planned capacity of 5 GW. Implementation of Phase 1, which includes setting up a solar cell manufacturing capacity of 2 GW, has started.

New-Cleanroom-Malaysian-Site

September 12, 2025
X-FAB has officially opened a new manufacturing line at its Sarawak facility. This expansion – representing a USD 600 million investment – has added 6,000 square meters of cleanroom space and was completed in just two years, from groundbreaking to the first production lots.

sign

September 04, 2025
The TWINSCAN EXE:5200B, the first model for volume production of ASML’s High NA EUV product line, enables printing of transistors 1.7 times smaller and achievement of transistor densities 2.9 times higher, compared with the existing EUV system, with a 40% improvement in the NA to 0.55 from 0.33.

George-Hsu

September 02, 2025
Koh Young Technology has appointed George Hsu as Managing Director of its newly opened Taiwan office, the company announced.

office_logo

August 28, 2025
Toshiba Electronic Devices & Storage Corporation and SICC have signed a memorandum of understanding (MOU) to explore collaboration on SiC power semiconductor wafers, the companies announced.

August 27, 2025
Japanese foundry Rapidus has entered into a strategic collaboration with Keysight Technologies Japan K.K. The companies have signed a Memorandum of Cooperation to develop a high-precision Process Design Kit (PDK) for Rapidus’ 2nm gate-all-around (GAA) semiconductors

axonite_chip

August 25, 2025
The China-based semiconductor equipment firm claims that US firm Applied Materials had illegally obtained and used Beijing E-Town’s core technology secrets related to plasma sources and wafer surface treatment.

chip

August 22, 2025
The Tiling crystal film bonding (CFB) tech developed by Japanese firm OKI allows for 52 repeated tiling operations over the entire surface of a 300 mm silicon wafer using a single 2-inch InP wafer, enabling efficient use of InP-based materials.

PCB-India_2

August 20, 2025
The four new proposals approved are from SiCSem, CDIL, 3D Glass Solutions and ASIP Technologies. The SiCSem and 3D Glass units will be set up in Odisha, CDIL will expand its facility in Punjab, and ASIP will establish a plant in Andhra Pradesh.

thin-wafer-dicing

August 15, 2025
This partnership focuses on enhancing wafer dicing processes, specialized wafer preparation for heterogeneous integration and assembly, as well as achieving ultra-smooth surfaces through polishing optimization.

August 13, 2025
TMSC is planning to gradually phase out its 6-inch wafer production over the next two years, while consolidating its 8-inch wafer operations to enhance efficiency, Reuters reports.

global-wafer-shipments

August 06, 2025
SEMI reports that worldwide silicon wafer shipments increased 9.6% year-on-year to 3,327 million square inches (MSI) from the 3,035 MSI recorded during the same quarter of 2024.

Kaga-wafer-fab

August 05, 2025
Farnell has strengthened its long-standing partnership with Toshiba by introducing a range of new Toshiba products now available through Farnell Japan.

cooperation-3

July 17, 2025
When finalized, the Joint Development Agreement (JDA) will focus on the co-development of next-generation dielectric ink solutions for advanced packaging manufacturing, particularly tailored for AI chip packaging applications.

Herzogenrath-2

July 16, 2025
Aixtron’s Close Coupled Showerhead (CCS) system is set in a 200mm configuration and is currently being installed at the Cambridge Graphene Centre to be used for the UK’s Layered Materials Research Foundry (LMRF).

keyfoundry

July 15, 2025
RDL refers to metal wiring and insulating layers on top of semiconductor chips to enable electrical connections. The newly co-developed Direct RDL by Korean companies SK keyfoundry and LB Semicon supports power semiconductors with high current capacity.

PCB-Taiwan_2

July 11, 2025
PMTC is recognized for its high-reliability solder alloys that offer excellent ductility, thermal fatigue resistance and drop performance. The company brings in-house alloy development, application expertise and a strong R&D foundation, positioning SHENMAO to accelerate innovation in semiconductor solder materials.

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