Renesas expects significant loss following Wolfspeed restructuring deal
June 25, 2025
As previously reported by Evertiq, Wolfspeed has entered into a restructuring agreement with key creditors aimed at reducing its debt load and cash interest expenses. Renesas Electronics is among the parties that have signed the Restructuring Support Agreement, a move expected to result in a substantial financial loss for the Japanese semiconductor company.
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HCLTech partners with AMD to develop solutions across AI, digital and cloud
June 25, 2025
By co-investing in innovation labs and training programs, HCLTech and AMD aim to provide enterprises with innovative tools that unlock new business opportunities and enhance operational efficiency.
Plug and Play partners with Synopsys to expand chip ecosystem program
June 23, 2025
By providing startups with access to professional-grade EDA tools, which often represent a significant investment at the early stage, Plug and Play and Synopsys aim to help lower the barrier to chip innovation, accelerate time to market, and reduce development costs across the chip design space.
Claus Aasholm on the ripples and tsunamis in the chip supply chain
June 23, 2025
“This tide does not lift all boats” – Aasholm warns of structural industry shifts driven by AI, geopolitics and China’s quiet semiconductor conquest.
Wolfspeed moves to slash debt through bankruptcy plan
June 23, 2025
US-based semiconductor manufacturer Wolfspeed has entered into a restructuring agreement with key creditors that will significantly reduce its debt load and cash interest expenses. The company plans to implement a pre-packaged Chapter 11 bankruptcy filing in the near future.
Report: Apple considers using AI to design its chips
June 20, 2025
Johny Srouji, Apple’s senior vice president of hardware technologies, said one of the key lessons the tech giant learned was that it needed to use the most cutting-edge tools available to design its chips.
Tata Elxsi, Infineon partner to accelerate EV innovation in India
June 20, 2025
Tata Elxsi brings its design, system integration and validation capabilities, while Infineon will provide early access to its latest semiconductor technologies—such as SiC-based components, microcontrollers and ICs.
LG Chem, Noritake co-develop paste for automotive power semiconductors
June 19, 2025
The silver paste co-developed by LG Chem and Noritake is a high-performance paste containing nano-sized silver (Ag) particles, combining LG Chem’s particle engineering technology with Noritake’s particle dispersion expertise.
Hanwha Qcells launches solar recycling business in US
June 18, 2025
At full capacity, Qcells’ new vertical EcoRecycle’s facility in Georgia will have the ability to recycle 250 MW of solar panels annually, repurposing materials like aluminum, glass, silver and copper.
InCore unveils SoC generator: from idea to FPGA validation in minutes
June 17, 2025
At the heart of this innovation is Indian fabless semiconductor startup InCore’s SoC Generator, a powerful automation platform built to radically simplify and accelerate SoC development.
MIPS partners with Cyient to enhance RISC-V-based intelligent power solutions
June 13, 2025
The partnership will focus on enabling real-time, safety-critical applications, power delivery, and compute efficiency in demanding platforms for automotive, industrial and data center markets.
RIR expands manufacturing of 1200V SiC diodes in collaboration with PASC
June 11, 2025
Besides serving existing domestic Indian and US customers, shipping from Taiwan also provides improved access to strategic high-growth markets for SiC devices in the South East Asian region.
OKI establishes R&D center in Berlin to advance photonics technology
June 10, 2025
OKI has established the OKI Berlin Lab, a new R&D centre focused on photonics technology, in Berlin, Germany. The centre opened on June 1, 2025, to strengthen core capabilities and promote global deployment through open innovation.
Qualcomm to acquire Alphawave Semi in $2.4 billion deal
June 10, 2025
Qualcomm Incorporated has signed a definitive agreement to acquire UK-based Alphawave IP Group plc (Alphawave Semi) in a transaction valued at approximately USD 2.4 billion. The acquisition, executed through Qualcomm’s indirect subsidiary Aqua Acquisition Sub LLC, marks a strategic move aimed at accelerating Qualcomm’s expansion into data centre markets.
WIN announces linearity optimized 0.12µm GaN power process
June 06, 2025
Engineered for demanding high-power applications across K-Band to V-Band frequencies, NP12-1B delivers industry leading high power front end solutions with exceptional linearity, ruggedness, and reliability for next-generation RF and microwave systems.
Siemens expands OSAT Alliance to boost US chip supply chains
June 06, 2025
Mosaic Microsystems will use Siemens‘ EDA technologies to develop ADKs for its thin glass substrate technology, while NHanced Semiconductors will employ Siemens EDA tech to develop ADKs for their silicon interposer-based tech.
GF looks to reshore chipmaking in $16B US investment
June 04, 2025
Working with the Trump administration and supported by tech companies seeking to onshore critical supply chain components, GlobalFoundries plans to invest USD 16 billion to expand its manufacturing and advanced packaging capabilities in New York and Vermont.
SCI raises $3.3M to develop security-enhanced microcontroller
May 30, 2025
CHERI, which stands for ‘capability hardware enhanced RISC instructions,’ aims to protect against cyber attacks that use software memory misallocation, buffer over flows and other memory hacks.
AT&S to open Europe's first advanced IC substrate facility in June
May 28, 2025
AT&S is preparing to open a new high-tech production facility for advanced IC substrates and packaging technologies in Leoben, Austria. Set to officially launch in June 2025, the site will be the first of its kind in Europe and is expected to play a key role in strengthening Europe's microelectronics supply chain.
When chip repair means microsurgery inside the IC
May 23, 2025
While replacing a faulty component is usually the go-to solution in electronics repair, things get more complex when the integrated circuit in question stores critical data – for example, encryption keys. In such cases, replacement is not an option, and the only viable path may be physical repair inside the chip itself.
IBM and Deca to launch advanced chip packaging in Quebec
May 22, 2025
Deca Technologies has signed an agreement with IBM to implement Deca’s M-Series and Adaptive Patterning technologies in IBM’s advanced packaging facility in Bromont, Quebec. Under the agreement, IBM will implement a high-volume manufacturing line with a focus on Deca’s M-Series Fan-out Interposer Technology (MFIT).
GlobalWafers opens Texas wafer plant, announces major expansion
May 21, 2025
Taiwanese semiconductor company GlobalWafers has officially inaugurated its new, USD 3.5 billion, silicon wafer facility in Sherman, Texas, marking a significant step in efforts to boost US semiconductor manufacturing capacity. The company also announced plans to further expand the site, increasing its total investment in the region to USD 7.5 billion.
Zeon partners with SiAT to advance next-gen battery manufacturing
May 20, 2025
Zeon will lead SiAT's USD 20 million USD Series C fundraising round to support the expansion of its production capacity for single-walled carbon nanotube (SWCNT) conductive paste, a critical nanomaterial for next-generation battery technologies.
HANMI Semiconductor launches TC BONDER 4 for HBM4
May 19, 2025
TC BONDER 4 is dedicated equipment capable of HBM4 production, featuring significantly improved productivity and precision compared to competitors, tailored to the characteristics of HBM4 which requires even higher precision.
Arteris joins Intel Foundry Accelerator Ecosystem Alliance
May 15, 2025
This collaboration will help mutual customers design electronics using Intel Foundry’s advanced process technologies. It will also support increased interoperability and the advancements beyond traditional node scaling by growing the chiplet ecosystem.
Report: Apple is developing specialized chips for smart glasses
May 13, 2025
The effort is being spearheaded by Apple’s silicon design team. Other chips are also being developed to enable future Macs and AI servers to power the Apple Intelligence platform, Bloomberg reports.
Germany greenlights €1B in support for Infineon's massive Dresden fab
May 08, 2025
Infineon Technologies has secured final approval from the German Federal Ministry for Economic Affairs for public funding to support its EUR 5 billion investment in a new semiconductor manufacturing fab in Dresden (Smart Power Fab).
Siemens and Intel expand collaboration on IC and packaging solutions
May 07, 2025
Siemens Digital Industries Software says its continued collaboration with Intel Foundry, has resulted in new product certifications, updated foundry reference flows, and new technology enablements for Intel’s advanced process nodes and packaging technologies.
Sustio completes €68.5M expansion, doubling HDI capacity in Penang
May 06, 2025
Sustio Sdn. Bhd., a subsidiary of South Korea's Simmtech Group, has completed its second manufacturing facility in Batu Kawan, Penang, following an investment of MYR 326 million (EUR 68.5 million). The expansion effectively doubles Sustio’s high-density interconnect (HDI) manufacturing capacity.
IIT Madras launches two silicon photonics products
May 05, 2025
An R&D centre at IIT Madras has developed a fibre array attachment tool in partnership with izmo Microsystems, which will be integrated with izmo’s packaging facility for photonics chip packaging. The centre also launched a high-speed silicon photonics QRNG.
VSORA raises $46M to bring powerful AI inference chip to market
May 05, 2025
The investment was led by Otium and a French family office with additional participation from Omnes Capital, Adélie Capital and co-financing from the European Innovation Council (EIC) Fund.
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