Evertiq - First In Electronics News & Expo

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Semiconductor_Founders

October 17, 2025
Built on a decade of research at MIT’s Palacios Group, Vertical’s breakthrough transistors use GaN. Vertical has demonstrated the technology on 8-inch wafers using standard silicon CMOS semiconductor manufacturing methods.

FAB300-Novara-Italy

October 16, 2025
Taiwanese semiconductor company, GlobalWafers, has officially inaugurated FAB300, a new 300mm semiconductor wafer manufacturing facility at MEMC Electronic Materials in Novara, Italy. The company describes the site as one of Europe’s most advanced and fully integrated silicon wafer fabs.

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Simon-Stacey

October 14, 2025
Fabless semiconductor company Cambridge GaN Devices (CGD) has partnered with GlobalFoundries to manufacture its single-chip ICeGaN power devices. The agreement supports CGD’s fabless strategy and expands the company’s supply chain to meet increasing demand for energy-efficient GaN-based components.

launch_vehicle

October 10, 2025
The new capital will expand production capacity for the Nova vehicle and complete activation of Launch Complex 14 at Cape Canaveral. The US company will also invest in supply chain, its Boltline product, and infrastructure to prepare for high-cadence launch operations.

athos-silicon

October 09, 2025
Mercedes-Benz has announced a collaboration with semiconductor company Athos Silicon to accelerate the development of advanced chiplet architectures for autonomous computing.

building-2023

October 09, 2025
Imec has launched a new 300mm gallium nitride (GaN) program aimed at advancing power electronics technology and reducing manufacturing costs.

handshake-l

October 07, 2025
ShunYun Technology Ltd (SYT), a manufacturer of optical transceivers, and NewPhotonics, a designer of photonic integrated circuit (PIC) chips for data centre optical interconnect, have entered into a strategic OSAT partnership for volume manufacturing of the NewPhotonics NPG product line.

25-years-012

October 02, 2025
The city of ideas, where it all started, will once again host Evertiq’s southernmost Expo. The first Evertiq Expo, then called TEC, was held in Lund in 2011 – and now, fifteen years later, the event returns to its birthplace.

Muse-semiconductor-acqusition

October 02, 2025
GS Microelectronics US, Inc. (GSME), a supplier of IC design and manufacturing solutions, has acquired Muse Semiconductor, a provider of multi-project wafer (MPW) services, enabling chip designs built on TSMC technology.

Robert-Feurle-CEO-2025

September 30, 2025
SiC specialist Wolfspeed has successfully completed its financial restructuring process and emerged from Chapter 11 protection. The plan going forward is to leverage its installed 200mm capacity to drive sustainable growth.

quantum_computer_NQCC

September 29, 2025
Aegiq’s on-premises system at NQCC enables exploration and validation of photonic quantum computing use cases through co-development with UK partners, de-risking key technical milestones, and reducing time to commercial impact.

Project

September 29, 2025
The STARLight project brings together a consortium of leading industrial and academic partners with the aim of establishing a high-volume manufacturing line, developing leading-edge optical modules, and fostering a complete value chain.

peter-wawer-infineon-kazuhide-ino-rhom

September 25, 2025
Rohm and Infineon Technologies have signed a Memorandum of Understanding to collaborate on packages for silicon carbide (SiC) power semiconductors used in applications such as on-board chargers, photovoltaics, energy storage systems, and AI data centres.

Sila-Moses-Lake-facility

September 24, 2025
Battery materials company Sila has started operations at Sila Moses Lake, its new automotive-scale silicon anode plant in Moses Lake, Washington, USA.

g10-sic

September 23, 2025
Aixtron SE has shipped its 100th G10-SiC epitaxy system, highlighting growing global demand for its SiC deposition technology over the past three years.

NTT_wireless

September 22, 2025
By irradiating a laser beam with an optical power of 1 kW, the two Japanese companies succeeded in receiving 152 W of electric power 1 kilometer away.

LeydenJar

September 19, 2025
By enabling +50% higher energy density, charging times under 12 minutes, and 85% lower CO2 emissions, the Dutch company’s anodes allow for lighter, more powerful batteries.

logos-on-signs

September 18, 2025
Nvidia and Intel are teaming up to jointly develop multiple generations of custom data centre and PC products that aim to accelerate applications and workloads across hyperscale, enterprise and consumer markets.

sign-contract

September 18, 2025
NEO Battery Materials, a silicon-enhanced battery materials and components developer, has received its first, multi-year purchase order valued at CAD 4.5 million and secured a Joint Development Agreement for high-performance battery products with an Asian manufacturer specialising in AI-powered mission flight control systems for drones and unmanned aerial vehicles (UAV).

PCB-India_3

September 18, 2025
As part of the collaboration, the companies will establish a state-of-the-art semiconductor validation and production test floor in Bangalore. The facility features clean room capabilities and equipment to productize silicon to volume production.

University

September 10, 2025
A team of materials scientists at Rice University in Houston, Texas, optimized the precursor materials to lower the synthesis temperature of the 2D semiconductor and showed that it grows in a controlled, directional manner.

Photonics_LEAFLight

September 10, 2025
The funding enables France’s Scintil Photonics to expand hiring, accelerate production and deepen its international presence as it delivers the industry’s first single-chip DWDM light engine, integrating multi-wavelength lasers with silicon photonics, aligned with next-generation CPO.

Headquarters-Durham

September 09, 2025
Wolfspeed says it has received court approval of its Plan of Reorganisation, a move that clears the way for the company to emerge from Chapter 11 protection in the coming weeks.

SiC

September 09, 2025
SiC and GaN semiconductors are becoming increasingly critical for the development of modern power electronics systems. As Marcin Mierzejewski (KERAFOL Keramische Folien GmbH & Co. KG) points out in an interview with Evertiq, leveraging these technologies gives engineers new opportunities – enabling component miniaturization, meeting growing demands for higher computing power, and addressing the challenges associated with rising power densities.

PCB-India_2

September 05, 2025
The national 2D innovation hub, said to be the first of its kind in India, will focus on next-generation semiconductor innovation, beyond silicon chip technologies.

Design_logo

August 29, 2025
Owens partners with OEMs and manufacturers from startups to scaled public companies on complex design-build and manufacturing automation projects across semiconductor, renewable energy, data storage, medical product and other emerging technology end markets.

August 25, 2025
Together, the companies are advancing the development and commercialization of next-generation BCD (Bipolar-CMOS-DMOS) process technology, which allows different functions to be combined on a single chip, making devices more power efficient and compact.

izmomicro

August 25, 2025
The Bengaluru-based company has developed a high-density silicon photonics packaging platform capable of supporting 32-channel fiber input and output with an insertion loss of less than 2 dB.

chip

August 22, 2025
The Tiling crystal film bonding (CFB) tech developed by Japanese firm OKI allows for 52 repeated tiling operations over the entire surface of a 300 mm silicon wafer using a single 2-inch InP wafer, enabling efficient use of InP-based materials.

PCB-India_2

August 20, 2025
The four new proposals approved are from SiCSem, CDIL, 3D Glass Solutions and ASIP Technologies. The SiCSem and 3D Glass units will be set up in Odisha, CDIL will expand its facility in Punjab, and ASIP will establish a plant in Andhra Pradesh.

supersic-groundbreaking

August 13, 2025
SuperSiC, a subsidiary of Zhejiang Jingsheng Mechanical & Electrical (JSG), has broken ground on its new manufacturing facility in Penang, Malaysia. The facility is part of JSG’s global expansion plans and reflects the growing role of Chinese semiconductor companies in the international supply chain.

CEO_June_Paik

August 11, 2025
The new funding will be used to accelerate mass production of Furiosa’s RNGD chip to support global enterprise customers and lay the groundwork for development of Furiosa’s next-generation chip.

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