Evertiq - First In Electronics News & Expo

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geralt-computer-chip

August 12, 2026
Stathera will use the proceeds to fund mass production of its GEN2 silicon timing portfolio while accelerating development of its next-generation platform for AI data centers and growing the company’s engineering and commercial teams.

EDA

August 07, 2026
Acquisition expands Siemens’ electronic design automation (EDA) portfolio with AI-powered, shift-left chip planning capabilities to support faster design exploration for advanced system-on-a-chip (SoC) architectures.

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July 31, 2026
The expanded footprint is expected to strengthen the US company’s global innovation network, supporting the design and development of advanced semiconductor solutions for AI, cloud and data infrastructure applications

PCB-world_1

July 30, 2026
SEMI Silicon Manufacturers Group (SMG) has reported that worldwide silicon wafer shipments increased 7.4% year-on-year to 3,573 million square inches (MSI) from the 3,327 MSI recorded during the same quarter of 2025.

Systems_Openchip_partnership

July 30, 2026
Spanish company Openchip will use US-based chiplet startup Baya Systems’ WeaveIP unified fabric to develop specialized intelligent compute systems for next-generation AI workloads.

building_logo

July 28, 2026
On the memory front, Samsung and Broadcom plan to pursue a strategic collaboration for the supply of industry-leading memory solutions, including HBM, supporting Broadcom’s next-generation AI accelerators.

Playground_Global_MOU

July 28, 2026
The collaboration aims to strengthen the pathway from laboratory innovation to global commercial impact by combining Playground’s expertise in building and scaling frontier technology companies with the CEA’s scientific research and technology-transfer capabilities.

geralt_AI

July 21, 2026
Joining the AWS Partner Network will help ChipAgents continue scaling its platform as it supports semiconductor companies looking to improve engineering productivity and accelerate development cycles.

Semiconductor_building

July 20, 2026
Track one adds new 300mm Silicon Photonics capacity, with full production readiness expected during the fourth quarter of 2027. It consists of repurposing the Arai facility for 300mm Silicon Photonics capacity and advanced packaging capabilities.

PCB-India_2

July 16, 2026
Companies involved in the manufacturing and R&D of the machines and manufacturing of materials, chemicals and gases that are essential for manufacturing semiconductors will be incentivized.

investment_Roseville

July 14, 2026
Bosch is investing up to $2 billion to transform the Roseville, California site into a facility that produces and tests SiC semiconductors with state-of-the-art processes and equipment.

Azuremoto_MOU

July 10, 2026
The MoU establishes a structured framework for cross-border business cooperation across SiC power semiconductor products for the AI data centre market, and rectifiers and MOS-based power semiconductor products targeting LTSCT’s key business verticals.

PCB-USA_1

July 09, 2026
The new agreement will lead to the production of more than 15 billion US-made chips and enable Broadcom to expand and modernize its manufacturing facilities in Fort Collins, Colorado, with a USD 1.5 billion capital expenditure investment.

Nikolaos-Florou-presentation-Berlin

July 09, 2026
Two months ago, at Evertiq Expo Zürich, Nikolaos Florous left little room for optimism. Tight memory market conditions would persist, he said — and things would likely get worse before they got better.

geralt-computer-chip

July 08, 2026
The two companies had earlier announced that they had entered into a definitive agreement under which Analog Devices would acquire Empower in an all-cash transaction for USD 1.5 billion.

Aeponyx_PIC_Centre

July 06, 2026
Supported by the Canadian government, the initiative brings together Aeponyx, HOP Technologies and Phantom Photonics to strengthen Canada’s domestic capabilities in advanced photonics and quantum technologies.

Battery_Technologies_team

July 03, 2026
The ARENA grant will be delivered under the Australian government’s Battery Breakthrough Initiative, which supports the growth of domestic battery manufacturing capability and strengthens Australia’s position in the global battery supply chain.

axonite_chip

June 29, 2026
While conventional ESD protection devices were primarily limited to controlling momentary discharges during chip manufacturing or assembly processes, the new technology enables complete on-chip control of harsh system-level EMC environments.

Kinisi_Robotics

June 26, 2026
Bristol-based Kinisi Robotics has been building on Bear’s production navigation stack since the company was founded — the same technology that powers Bear’s commercial fleet.

June 26, 2026
At full deployment, 30 MW of dedicated AMD compute across Rackspace’s footprint will represent meaningful capacity to serve regulated enterprise workloads, including healthcare providers who have expressed early interest in accelerated compute.

June 25, 2026
Qualcomm has agreed to acquire Modular Inc, an AI software infrastructure company whose platform allows developers to build and deploy AI across different hardware architectures without rewriting code for each one. The deal is expected to close in the second half of 2026.

quantum-technologies-1

June 24, 2026
By adding semiconductor and nanophotonics fabrication capabilities, advanced packaging expertise and specialized engineering talent, QCi is strengthening its operational capabilities and manufacturing readiness.

sign

June 24, 2026
The agreement establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services. By working together as partners to expand capacity, the companies aim to enable a more efficient, mutually beneficial operating model.

MIMCAP_silicon_interposer

June 18, 2026
By combining high-density embedded capacitors, a scalable modeling framework for passive components, and laser-assisted bonding for III-V chiplet assembly, the platform lays the foundation for next-generation wireless (mmWave and sub-THz) systems.

Headquarters-Durham

June 17, 2026
The companies plan to develop standards for high-voltage silicon carbide power modules, supporting solid-state transformers, industrial electrification and next-generation aerospace & defense platforms while strengthening supply chain resilience.

geralt-computer-chip

June 15, 2026
Built on Cadence’s AI-driven electronic design automation (EDA) portfolio with Nvidia Nemotron models, and secured by Nvidia OpenShell runtime, the new agentic capabilities enable customers to run dynamic simulations in automated workflows.

quantum-computer_geralt

June 15, 2026
The French company, bringing semiconductor-grade manufacturing and industrialization to quantum computing, plans to deploy its first commercial quantum computer through the cloud by the end of 2026 under its Alloy product line.

sign-building

June 12, 2026
The companies plan to combine Hitachi’s IT expertise, operational technology and product manufacturing knowledge with Intel’s computing capabilities and silicon-based platforms to develop next-gen compute capabilities and industry solutions.

Expo-ZRH26-claus-speaking

June 12, 2026
At Evertiq Expo Zürich, Claus Aasholm of Semiconductor Business Intelligence delivered a data-driven examination of a semiconductor industry in structural transition – and the picture looked considerably different from what most quarterly reports suggest.

Singapore-facility

June 11, 2026
Applied Materials has expanded its manufacturing and R&D operations in Singapore with the opening of the Tampines Campus, a USD 500 million facility that more than doubles the company's cleanroom capacity in the country. The campus is already operating at volume production.

SiC-Wafer

June 11, 2026
Infineon Technologies and Siemens have announced a collaboration to advance electrical protection in data centres, production facilities and battery storage systems. Infineon will supply silicon carbide power modules to Siemens for use in its SENTRON 3QD2 semiconductor circuit breakers.

Samsung_chip_design

June 09, 2026
Through close engineering alignment, Siemens continues to qualify and deploy its electronic design automation (EDA) software — including design, verification, simulation and silicon manufacturing enablement — with Samsung Foundry’s latest process technologies.

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