LTSCT, IISc to develop centre for semiconductor research in India September 05, 2025 The national 2D innovation hub, said to be the first of its kind in India, will focus on next-generation semiconductor innovation, beyond silicon chip technologies.
Automated Industrial Robotics acquires Owens Design August 29, 2025 Owens partners with OEMs and manufacturers from startups to scaled public companies on complex design-build and manufacturing automation projects across semiconductor, renewable energy, data storage, medical product and other emerging technology end markets.
Cirrus Logic partners with GF to advance mixed-signal chipmaking August 25, 2025 Together, the companies are advancing the development and commercialization of next-generation BCD (Bipolar-CMOS-DMOS) process technology, which allows different functions to be combined on a single chip, making devices more power efficient and compact.
izmomicro ‘achieves breakthrough’ in silicon photonics packaging August 25, 2025 The Bengaluru-based company has developed a high-density silicon photonics packaging platform capable of supporting 32-channel fiber input and output with an insertion loss of less than 2 dB.
OKI develops Tiling crystal film bonding technology August 22, 2025 The Tiling crystal film bonding (CFB) tech developed by Japanese firm OKI allows for 52 repeated tiling operations over the entire surface of a 300 mm silicon wafer using a single 2-inch InP wafer, enabling efficient use of InP-based materials.
India approves 4 projects in $530 million boost to chip making August 20, 2025 The four new proposals approved are from SiCSem, CDIL, 3D Glass Solutions and ASIP Technologies. The SiCSem and 3D Glass units will be set up in Odisha, CDIL will expand its facility in Punjab, and ASIP will establish a plant in Andhra Pradesh.
SuperSiC breaks ground on new manufacturing facility in Penang August 13, 2025 SuperSiC, a subsidiary of Zhejiang Jingsheng Mechanical & Electrical (JSG), has broken ground on its new manufacturing facility in Penang, Malaysia. The facility is part of JSG’s global expansion plans and reflects the growing role of Chinese semiconductor companies in the international supply chain.
FuriosaAI closes $125M round to scale production of AI inference chip August 11, 2025 The new funding will be used to accelerate mass production of Furiosa’s RNGD chip to support global enterprise customers and lay the groundwork for development of Furiosa’s next-generation chip.
onsemi to set up research centre for wide bandgap materials August 07, 2025 onsemi plans to invest USD 8 million with Stony Brook University to establish a wide band gap research centre that will advance innovation in power semiconductors and foster the next generation of professionals in this field.
Apple commits $100B to US manufacturing and expansion August 07, 2025 Apple has announced a new USD 100 billion investment as part of a broader initiative to expand its operations and manufacturing footprint in the United States. The move raises the company’s total planned U.S. investment to USD 600 billion over the next four years.
Global silicon wafer shipments increase 10% YoY in 2Q25 August 06, 2025 SEMI reports that worldwide silicon wafer shipments increased 9.6% year-on-year to 3,327 million square inches (MSI) from the 3,035 MSI recorded during the same quarter of 2024.
Coherent opens first datacom R&D centre in Penang August 06, 2025 US-based photonics manufacturer Coherent has opened its first Datacom R&D centre in Malaysia, expanding its global footprint to advance optical transceiver technologies for AI and cloud computing.
SkyWater Technology announces IP license agreement with Infineon August 04, 2025 This new IP enables customers to design and build high-reliability mixed-signal SoCs entirely within a secure US supply chain. It will be released through SkyWater’s S130 platform.
Teramount raises $50M to advance optical connectivity solutions for AI July 31, 2025 Israeli company Teramount’s TeraVerse solution is a detachable, serviceable connector that links optical fibers coming from outside the rack to the silicon photonics chips inside Co-Packaged Optics (CPO) systems.
xLight raises $40 million to build powerful chip-making laser July 28, 2025 This funding further enables Silicon Valley startup xLight to develop the world’s most powerful EUV free electron lasers (FEL), which has the potential to revolutionize advanced semiconductor manufacturing and unlock other critical economic and national security applications.
$20M semiconductor research facility coming to Stony Brook University July 28, 2025 As a result of the partnership, onsemi will invest USD 8 million to support the center’s operations, while Stony Brook University will invest USD 10 million in renovations and equipment. Empire State Development will support the new facility through a capital grant of up to USD 2 million.
QuiX secures €15M to deliver universal photonic quantum computer July 24, 2025 Dutch company QuiX Quantum’s universal photonic quantum computer leverages the principles of superposition, entanglement and interference to process information in fundamentally different ways from classical computers.
Wacker commissions €300M production line for chip-grade polysilicon July 22, 2025 By virtue of the new production line, the German chemical company is increasing its production capacity for products that comply with the highest semiconductor-grade standards by more than 50 percent. This expansion in capacity will also create around 150 new jobs.
Synopsys completes $35 billion acquisition of Ansys July 18, 2025 The deal was 18 months in the making. United with Ansys, Synopsys can now deliver holistic system design solutions for customers in industries spanning semiconductors, high-tech, automotive, aerospace, industrial, and more.
Cambridge chooses Aixtron tool for next-gen 2D-based photonic devices July 16, 2025 Aixtron’s Close Coupled Showerhead (CCS) system is set in a 200mm configuration and is currently being installed at the Cambridge Graphene Centre to be used for the UK’s Layered Materials Research Foundry (LMRF).
Arago raises $26M to slash AI energy consumption with new photonic chip July 09, 2025 The heart of Arago's processor, codenamed “JEF,” is a proprietary photonic technology: instead of transistors, it uses lasers to process data with photons. The chip is designed to deliver 10× lower energy consumption than today’s leading GPUs at equivalent performance and cost.
iPronics partners with Ansys to bring reliability to AI workloads July 08, 2025 iPronics integrates Ansys solutions across its core development workflow — from optical layout to packaging and thermal simulations — enabling robust, full-stack design and validation of photonic integrated circuits (PICs) that perform reliably despite fabrication variability.
Singapore launches innovation hub for gallium nitride semiconductors July 08, 2025 The centre brings advanced GaN manufacturing capabilities to Singapore, positioning local innovators to compete in high-growth global markets such as advanced 5G and 6G communication systems, radars and satellite communications.
Toshiba develops tech to reduce losses in SiC trench MOSFETs, SiC SBDs July 07, 2025 These advances are expected to greatly improve the reliability and efficiency of devices used in power conversion applications, such as electric vehicles and renewable energy systems.
Ericsson expands R&D team in Bengaluru, increases focus on ASIC July 02, 2025 This strategic move underscores Ericsson’s commitment to enable India to be at the forefront of future communication technology. The decision also demonstrates Ericsson’s dedication to fostering innovation in the highly competitive field of ASIC development.
Navitas partners with Powerchip for 200mm GaN production in Taiwan July 02, 2025 Navitas Semiconductor has announced plans to start 200mm GaN-on-silicon production in collaboration with Powerchip Semiconductor Manufacturing Corporation (PSMC), marking a new phase in the company's supply chain and technology strategy.
Struggling US chipmaker Wolfspeed files for bankruptcy July 01, 2025 Upon emergence from the process, it expects to have reduced its overall debt by about 70%, representing a reduction of USD 4.6 billion and a reduction of its annual total cash interest payments by approximately 60%.
Lyten acquires Northvolt's Polish manufacturing operation July 01, 2025 Lyten, a US-based manufacturer of lithium-sulfur batteries, will acquire Northvolt’s Dwa ESS operations in Gdansk, Poland, a 25,000 square metre battery energy storage systems (BESS) manufacturing and R&D facility.
Okmetic produces first wafers from expanded Vantaa fab June 30, 2025 Okmetic has produced the first silicon wafers from its newly expanded fabrication facility in Vantaa, Finland. The milestone marks the completion of the initial phase of what will ultimately be a EUR 400 million expansion.
ROHM launches isolated gate driver IC optimized for high-voltage GaN devices June 27, 2025 When combined with GaN devices, this driver, BM6GD11BFJ-LB, enables stable operation under high-frequency, high-speed switching conditions, contributing to greater miniaturization and efficiency in high-current applications.
Mindgrove partners with Bosch to enhance chip design solutions June 26, 2025 Indian fabless firm Mindgrove will provide Bosch with chips and boards for field deployment and testing, supported with engineering and logistics assistance. Data generated from these deployments will be used for improvements.
Renesas expects significant loss following Wolfspeed restructuring deal June 25, 2025 As previously reported by Evertiq, Wolfspeed has entered into a restructuring agreement with key creditors aimed at reducing its debt load and cash interest expenses. Renesas Electronics is among the parties that have signed the Restructuring Support Agreement, a move expected to result in a substantial financial loss for the Japanese semiconductor company.