Nvidia selects Navitas to collaborate on 800 V HVDC architecture
June 04, 2025
Navitas’ high-power GaNSafe power ICs integrate control, drive, sensing and critical protection features, enabling reliability and robustness.
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Air Liquide’s gas supply deal with VSMC to boost Singapore’s chip industry
June 03, 2025
Strategically located within the Tampines Wafer Fab Park, one of Singapore’s four key wafer fabrication hubs, the new facility will bolster Singapore’s position as a global semiconductor powerhouse.
IIT Kharagpur, A*STAR team up to advance semiconductor innovation
June 02, 2025
The MoU opens new avenues for joint research in advanced CMOS and post-CMOS technologies; heterogeneous integration and packaging; AI hardware accelerators; next-generation memory systems; photonics and quantum devices; and chip reliability, thermal management and failure analysis.
EdgeCortix secures $21M to develop energy-efficient AI chiplet
June 02, 2025
This funding will drive the development of NovaEdge — a next-generation, energy-efficient edge AI chiplet designed for high-performance generative AI inference and on-device learning.
Celtonn bags ESA contract to develop chip hardware for satellites
June 02, 2025
As the project lead, Celtonn will develop a high-linearity, low-noise amplifier (LNA) for V-band feeder uplink — a key enabler for next-generation satellite communication payloads.
Materion expands its semiconductor footprint and capabilities
June 02, 2025
Materion is expanding its presence in Asia’s semiconductor market through the acquisition of a newmanufacturing facility in South Korea.
SCI raises $3.3M to develop security-enhanced microcontroller
May 30, 2025
CHERI, which stands for ‘capability hardware enhanced RISC instructions,’ aims to protect against cyber attacks that use software memory misallocation, buffer over flows and other memory hacks.
U.S. imposes new export restrictions on chip design software to China
May 30, 2025
The United States has instructed a wide range of companies to halt shipments of various products to China without a license, and has revoked previously issued licenses for certain vendors, according to a report from Reuters.
Horiba to set up new production base in Malaysia
May 29, 2025
The Horiba Group is set to significantly expand its operations in Malaysia with plans to establish its first manufacturing facility in the state of Kedah.
Trumpf Electronics opens technical centre in Malaysia
May 28, 2025
German plasma power specialist Trumpf Electronics has opened a new technical centre in Malaysia, marking its first facility in Southeast Asia
AT&S to open Europe's first advanced IC substrate facility in June
May 28, 2025
AT&S is preparing to open a new high-tech production facility for advanced IC substrates and packaging technologies in Leoben, Austria. Set to officially launch in June 2025, the site will be the first of its kind in Europe and is expected to play a key role in strengthening Europe's microelectronics supply chain.
TSMC to launch European chip design centre in Munich
May 27, 2025
Taiwanese semiconductor giant TSMC is preparing to strengthen its European presence with the opening of a new design centre in Munich, Germany.
ST expands "Lab-in-Fab" initiative in Singapore
May 27, 2025
STMicroelectronics says that it is partnering with the A*STAR Institute of Microelectronics (A*STAR IME) and ULVAC, to expand its “Lab-in-Fab” (LiF) in Singapore. The focus of the collaboration is to advance piezoelectric MEMS for applications in personal electronics, medical devices, and other applications.
UK space tech startup Space Forge raises $30 million
May 27, 2025
This investment will accelerate the development of ForgeStar-2, Space Forge’s next-gen returnable manufacturing satellite, while supporting the company’s first in-orbit demonstration mission, ForgeStar-1, set to launch in 2025.
ClassOne, IBM Research team up to develop non-NMP solvent processing
May 26, 2025
The focus of the joint project will be to develop best known methods (BKMs) for non-NMP solvent processing in manufacturing IBM semiconductor devices.
KLA opens $138M R&D and manufacturing facility in Wales
May 26, 2025
KLA Corporation has inaugurated a new USD 138 million R&D and manufacturing facility in Newport, Wales, expanding its footprint in the UK. It will serve as the new home for KLA's SPTS division, which specialises in advanced wafer processing technologies.
Lightshift to build Vermont’s largest energy storage project
May 26, 2025
Chip manufacturer GlobalFoundries will use Lightshift Energy’s 16MW/52MWh system for peak shaving by storing electricity during periods of low demand and discharging it during peak times to alleviate grid stress.
Siemens enhances EDA design portfolio with Excellicon acquisition
May 23, 2025
This will bring Excellicon’s best-in-class software for the development, verification and management of timing constraints to Siemens’ EDA portfolio of software for IC design.
Chinese firms gain ground in 2024 top 10 OSAT ranking
May 23, 2025
The combined revenue of the world’s top 10 outsourced semiconductor assembly and test (OSAT) companies reached USD 41.56 billion in 2024, a 3% YoY increase, according to a new report from TrendForce. While established players ASE Holdings and Amkor retained their top positions, Chinese firms including JCET and HT-Tech posted double-digit growth, reshaping the competitive landscape.
GCT, G+D partner to launch eSIM solution for IoT devices
May 23, 2025
This collaboration for eSIMs, or SIM cards directly embedded into a device, brings intelligent, location-aware connectivity to headless 4G and 5G IoT devices.
Visual highlights from Evertiq Expo Malmö 2025
May 22, 2025
On May 15, 2025, Malmö Arena once again became the epicentre of Sweden's electronics industry as Evertiq Expo returned for its fourth edition.
IBM and Deca to launch advanced chip packaging in Quebec
May 22, 2025
Deca Technologies has signed an agreement with IBM to implement Deca’s M-Series and Adaptive Patterning technologies in IBM’s advanced packaging facility in Bromont, Quebec. Under the agreement, IBM will implement a high-volume manufacturing line with a focus on Deca’s M-Series Fan-out Interposer Technology (MFIT).
Neways opens new manufacturing facility in Malaysia
May 22, 2025
Dutch EMS provider Neways Electronics has inaugurated a new manufacturing facility in Selangor, Malaysia, marking the company’s first production site in Southeast Asia.
Ukrainian drone strike targets Russian semiconductor plant
May 22, 2025
Ukraine’s military claims it successfully struck a Russian semiconductor facility in the Oryol region during a drone operation.
UST partners with T-Works to advance automotive, chip product development
May 22, 2025
UST will serve as the systems integrator, offering end-to-end solutions and providing a launch pad for T-Works startups to scale up, specifically in areas such as Automotive AI platforms, Semiconductor ATE frameworks, and Smart Factory integration, in India.
GlobalWafers opens Texas wafer plant, announces major expansion
May 21, 2025
Taiwanese semiconductor company GlobalWafers has officially inaugurated its new, USD 3.5 billion, silicon wafer facility in Sherman, Texas, marking a significant step in efforts to boost US semiconductor manufacturing capacity. The company also announced plans to further expand the site, increasing its total investment in the region to USD 7.5 billion.
Semiconductor outlook: typical Q1, but atypical shifts ahead
May 21, 2025
The global semiconductor manufacturing industry entered 2025 with typical seasonal patterns. However, looming tariff threats and evolving supply chain strategies are expected to create atypical seasonality for several industry segments as the year progresses, reports SEMI.
Nearfield, A*STAR IME to partner on chip metrology tech research
May 21, 2025
By leveraging Nearfield’s expertise in high-precision metrology and A*STAR’s cutting-edge semiconductor research, the partnership will accelerate the development of advanced metrology solutions that enable efficient AI chip production.
NY Creates and Fraunhofer team up on 300mm memory R&D
May 20, 2025
NY Creates and the Fraunhofer Institute for Photonic Microsystems (Fraunhofer IPMS) have signed a Joint Development Agreement (JDA) aimed at advancing research and development of next-generation memory devices at the 300mm wafer scale.
Foxconn and Thales eye semiconductor, satellite projects in France
May 20, 2025
Taiwanese electronics manufacturer Foxconn and French defence and aerospace group Thales have entered a strategic partnership aimed at advancing semiconductor and space manufacturing in Europe.
Joonas Mikkilä predicts strong growth for Finland’s tech sector
May 20, 2025
At this year’s Evertiq Expo Tampere 2025, Joonas Mikkilä, Senior Advisor at Technology Industries of Finland, shared insights on the country's semiconductor sector and the national strategy known as “Chips from the North,” which aims to accelerate growth in the years ahead.
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