Semiconductor supply chain on the edge? September 24, 2026 The Q2-2026 semiconductor earnings rush is long gone, and even the laggards have now reported in their first Q3-2026 earnings calls. It is time to get a grip on what is going on in the semiconductor industry and its supply chain.
Will there be no tech under the Christmas tree this year? September 23, 2026 It is only September, yet Christmas has already arrived in the supermarkets. Gingerbread and holiday decorations are filling shelves, while retailers are preparing for the most important shopping season of the year.
DRAM module revenue surged 59% in 2025 as AI crowds out mainstream supply September 22, 2026 The global DRAM module market generated USD 21.2 billion in revenue in 2025, up 59% YoY, according to TrendForce — a sharp acceleration from the 7% growth recorded in 2024.
China’s CXMT says 5th-gen DRAM platform enters mass production September 21, 2026 The new platform is designed to make more powerful memory chips at lower cost and using less power, Reuters reports. The potential breakthrough could make China compete for the memory market share with the likes of Samsung and SK hynix.
Infineon to sell NOR Flash and F-RAM business to Winbond September 17, 2026 Germany's Infineon has entered into a definitive agreement under which Taiwanese Winbond Electronics will acquire Infineon’s NOR Flash and F-RAM business in an all-cash transaction valued at USD 1.12 billion.
Gradiant announces $300M in new water contracts this year September 17, 2026 Rather than serving a single point in the water cycle, Gradiant will deliver its full semiconductor portfolio across these sites — from ultrapure water production to high-recovery wastewater treatment, scrubber reclaim, treatment of complex streams and zero liquid discharge.
Report: SK hynix in talks with Intel about deal to make memory chips in US September 16, 2026 At least two potential scenarios are being discussed: SK hynix would lease part of Intel’s chipmaking facility in Ohio, or form a venture with Intel and cloud firms looking for a secure memory chip supply, according to Reuters.
Report: Kioxia considering $10 billion US listing in 2027 September 15, 2026 The Tokyo-based memory-storage maker has been speaking with lenders such as Bank of America, Goldman Sachs Group and JPMorgan Chase on an offering that could take place in 2027, Bloomberg reports.
Samsung partners with Mistral AI to advance chip infrastructure September 14, 2026 Under the agreement, Samsung will integrate Mistral’s AI services and solutions — including its flagship large language model, Mistral Large — across its semiconductor operations to develop customized on-premises AI models optimized for intelligence-driven infrastructure.
Positron raises $875M to advance next-gen inference silicon September 11, 2026 Positron AI’s next-gen systems realize more than 90% of their available memory bandwidth, are built on commodity LPDDR5X memory that sidesteps constrained HBM and CoWoS supply chains, and deliver leading tokens per dollar and tokens per watt.
SMIC narrows gap with Samsung as global foundry revenue hits record $53.49 billion September 10, 2026 SMIC posted the strongest growth among the top three foundries in Q2 2026, with revenue surging 20% QoQ to more than USD 3 billion and market share edging up to 5.4% – closing in on Samsung Foundry's 5.9%. Combined revenue for the world's top ten foundries rose 11.5% to nearly USD 53.49 billion, a new record, according to TrendForce.
Elmos and SK keyfoundry extend partnership to 130nm technology through 2037 September 10, 2026 German automotive semiconductor manufacturer Elmos Semiconductor and South Korean foundry SK keyfoundry have signed an agreement expanding their collaboration to include 130nm technology, securing long-term wafer capacity through 2037. The two companies have worked together on 350nm technology for 18 years.
Samsung, ASML to collaborate on next-gen chip manufacturing September 10, 2026 The two companies aim to deepen collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies. Samsung plans to introduce ASML’s High NA EUV lithography into future DRAM high-volume manufacturing by 2028.
Micron faces strike threat in Taiwan over bonus dispute September 09, 2026 Labour unions representing nearly two-thirds of Micron Technology's Taiwan workforce are threatening to strike unless the US memory chip maker changes how it distributes profits to employees, Reuters reports. More than 80% of union members who took part in an internal survey in August backed strike action.
Toshiba starts shipping engineering samples of new M4V products September 07, 2026 The TXZ+ Family Entry-Class M4V Group feature an Arm Cortex-M4 core with a floating-point unit to enhance security and data management in IoT devices and industrial equipment.
NanoBridge adopts Siemens’ Precision FPGA Synthesis September 04, 2026 NanoBridge Semiconductor will provide its customers with a version of Precision FPGA Synthesis tuned for its NBS6503H and NBS1201 FPGA device families, helping designers achieve high-quality synthesis results while supporting efficient implementation workflows.
Nvidia and MediaTek deepen partnership across AI infrastructure, PCs and automotive September 01, 2026 Nvidia and MediaTek have announced an expanded collaboration spanning cloud AI infrastructure, local AI computing and automotive. As part of the deal, Nvidia has invested USD 3.5 billion in convertible bonds issued by MediaTek.
CXMT sues Pentagon over ‘Chinese military company’ designation August 31, 2026 CXMT, the world’s fourth-largest DRAM maker, is seeking removal from the Pentagon’s Section 1260H list of Chinese companies with military ties to Beijing. It was first added to the list in January 2025, and kept on the list after a review in June.
Kioxia and Sandisk bet $31 billion on NAND flash as AI demand surges August 31, 2026 Kioxia and Sandisk have announced anticipated investments in Japan totalling over USD 31 billion – approximately 5 trillion yen – contingent on government support. The investments, running through 2032, will support continued expansion of the companies' joint venture manufacturing operations at the Yokkaichi and Kitakami plants.
SK hynix breaks ground on $4 billion packaging facility in Indiana August 28, 2026 The Indiana fab is scheduled to open its cleanroom by October 2028 and initiate mass production of next-generation HBM in the second half of 2029. SK hynix also signed an MOU with Purdue University for research and development collaboration in advanced packaging.
Memory to account for 68% of cloud giant CapEx by 2027 August 26, 2026 DRAM and NAND Flash combined will account for 47% of major cloud service providers' total capital expenditure in 2026, rising to 68% in 2027, according to TrendForce. The shift reflects both soaring memory contract prices and surging procurement demand for AI infrastructure.
Micron launches $250 million AI investment fund August 24, 2026 Micron Technology has launched the Micron Ventures Paradigm Fund, a USD 250 million investment vehicle targeting startups across the AI technology stack. It is Micron Ventures' third and largest fund to date, bringing the unit's total capital commitment to USD 550 million.
Micron unveils $10 billion AI memory research lab in Boise August 21, 2026 Micron Research Labs will center on a flagship Boise campus designed to support advanced research across critical technology domains. Key research areas include critical memory technologies, advanced memory and compute architectures, packaging and future semiconductor manufacturing.
Marvell and Google expand custom silicon partnership August 20, 2026 Marvell Technology has entered into an expanded commercial agreement with Google to develop custom semiconductor products across a range of programmes attached to Google's TPU ecosystem.
Sivers announces $3.4M program with SemiNex for InP light sources August 14, 2026 The program targets high-power external laser sources for co-packaged optics (CPO), high-channel-count DFB arrays for wavelength-multiplexed links, and SOA gain stages that extend optical reach as channel counts scale.
Has the semiconductor market changed since spring? August 11, 2026 Earlier this year, several discussions at Evertiq Expo pointed to the same conclusion: while the semiconductor industry continues to grow, that growth is far from evenly distributed. AI, memory and data centres have driven record revenues, while other parts of the electronics industry continue to face a very different reality.
Ardian Semiconductor invests in French fabless firm VSORA August 10, 2026 Through its investment, Ardian Semiconductor will support VSORA in accelerating its go‑to‑market strategy to strengthen the company’s recognition across the value chain and reinforce VSORA’s access to senior semiconductor industry expertise.
SpaceX, Tesla to initially spend $16.8 billion on Texas chip plant August 07, 2026 Terafab, a vertically integrated semiconductor fabrication plant in Grimes County, Texas, with over 100 million square feet of manufacturing space, will employ at least 3,000 people.
AMD acquires Canadian AI chip startup Taalas August 07, 2026 Taalas’ technology optimizes inference dataflows, reducing compute and memory bottlenecks associated with general-purpose architectures and enabling highly optimized AI inference capabilities.
Infineon, MediaTek to advance AI-driven in-cabin solutions August 06, 2026 MediaTek has now qualified the Infineon 512 Mb Quad SPI NOR Flash, an automotive-grade NOR Flash memory solution, for use in its Dimensity Auto Cockpit platform C-X1.
Netlist, Samsung settle patent disputes, sign new memory deal August 06, 2026 Under the agreements, Samsung will receive access to US firm Netlist’s complete patent portfolio, including its server DIMM and High Bandwidth Memory technologies. Samsung will supply Netlist DRAM and NAND products, and the parties agree to settle and mutually release all pending legal actions.
Air Liquide invests $150M in Idaho semiconductor gas plant August 06, 2026 Scheduled to begin operations in 2028, Air Liquide’s production unit will deliver large volumes of ultra-pure nitrogen, oxygen and argon, essential for manufacturing advanced memory chips.