Evertiq - First In Electronics News & Expo

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September 04, 2025
The TWINSCAN EXE:5200B, the first model for volume production of ASML’s High NA EUV product line, enables printing of transistors 1.7 times smaller and achievement of transistor densities 2.9 times higher, compared with the existing EUV system, with a 40% improvement in the NA to 0.55 from 0.33.

September 01, 2025
Samsung manufactures about 35-40% of its total NAND flash memory chips at its plant in Shaanxi, while SK Hynix produces about 40% of its DRAM in Jiangsu and 20% of NAND flash chips in Liaoning.

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hynix_NAND

August 27, 2025
To maximize the cost competitiveness of its new product, SK Hynix developed a 2Tb device with double the capacity of existing solutions. To address potential performance degradation in large-capacity NAND, the number of planes was increased from 4 to 6.

global-wafer-shipments

August 06, 2025
SEMI reports that worldwide silicon wafer shipments increased 9.6% year-on-year to 3,327 million square inches (MSI) from the 3,035 MSI recorded during the same quarter of 2024.

production-2020

August 04, 2025
This new IP enables customers to design and build high-reliability mixed-signal SoCs entirely within a secure US supply chain. It will be released through SkyWater’s S130 platform.

PCB-EU_2

July 31, 2025
Semiconductor distribution sales in Europe experienced a significant decline of 14%, amounting to €2.20 billion. Among the major countries, Austria faced again the steepest drop with a decrease of almost 37%, followed by France with a reduction of 20%.

begins-mass-production-of-industrys-highest-238-layer-4d-nand

July 24, 2025
SK Hynix reported a bigger-than-expected 68% jump in operating income in the June quarter. The South Korean chipmaker, a key supplier to AI giant Nvidia, said new model launches by customers would drive high-end AI chip demand growth, and that it was on track to double HBM chip sales for the full year.

Evertiq-IM-Alistair-Jones

July 10, 2025
We are all aware that the semiconductor industry is highly volatile. But that’s not just because of the market itself; in fact, a substantial part is self-inflicted. Because, in times of shortages, companies panic and place inflated orders with multiple manufacturers or suppliers. We see the same thing happening again now with DDR4. Samsung, which captures about half of the DRAM market, has announced that it will wind down its DDR4 production by the end of 2025. This is causing a ripple effect that we have seen time and again.

Claus-Aasholm

July 07, 2025
In this first article of Evertiq’s new expert column series, Claus Aasholm – seasoned technology executive and strategist – shares his perspective on the trends, challenges, and breakthroughs shaping the global electronics industry. Drawing on decades of hands-on experience, Claus offers sharp, thought-provoking insights that go beyond headlines and buzzwords. Expect analysis that connects the dots – and challenges the status quo.

fab-25

July 04, 2025
By adding approximately 400,000 wafer starts per year in capacity, Fab 25 brings meaningful scale to SkyWater’s exclusively US-based, pure-play foundry operation and enables SkyWater to enhance its advanced technology services (ATS) offering by incorporating the site’s current capabilities.

expo-mmo25-claus-aasholm-interview

July 02, 2025
During Evertiq Expo Malmö 2025, Claus Aasholm, founder of Semiconductor Business Intelligence, offered a sobering reassessment of the global semiconductor market. In his keynote and follow-up interview, Aasholm argued that the industry’s historical four-year cycle has broken down – replaced by a fragmented, profit-driven upswing felt by only a select few.

Instinct_MI355X

July 01, 2025
Oracle will offer zettascale AI clusters accelerated by the latest AMD Instinct processors with up to 131,072 MI355X GPUs to enable customers to build, train, and inference AI at scale.

Boise-Idaho-CEO-Sanjay-Mehrotra

June 26, 2025
Micron Technology reported record revenue of USD 9.30 billion for the third quarter of its fiscal 2025, marking a significant sequential and year-over-year increase as demand for AI-related memory solutions continues to accelerate.

MI355X

June 13, 2025
The 13,000 AMD MI355X chips Crusoe plans to purchase include high-bandwidth memory, making them suitable for running AI applications.

gb200-server-system

June 12, 2025
As Nikkei Asia reports in a new investigation, the US is quietly assembling a domestic supply chain for one of the most complex machines in the world: the AI server. And while Apple has resisted political pressure to move iPhone production onshore, a host of data centre suppliers – including Foxconn, Wistron, TSMC and SK Hynix – are rapidly expanding their US footprint to serve customers like Nvidia, Microsoft and Amazon.

Boise-Idaho-CEO-Sanjay-Mehrotra

June 12, 2025
Micron Technology will expand its US investment to approximately USD 150 billion in memory manufacturing and USD 50 billion in R&D, marking one of the largest semiconductor initiatives since the CHIPS Act.

June 10, 2025
US semiconductor company Micron Technology will set up its SEZ facility in Sanand, Gujarat, while Indian diversified contract manufacturer Aequs will set up its SEZ in Dharwad, Karnataka.

Singapore_headquarters

June 05, 2025
This strategic move marks a major milestone in GigaDevice’s international growth journey, underscoring its commitment to closer customer engagement, building a resilient and agile supply chain, and strengthening its ecosystem and brand presence across key global markets.

IC-substrate-Leoben-ics

June 04, 2025
Austrian microelectronics and PCB manufacturer AT&S has officially inaugurated Europe's first local research and production centre for IC substrates.

AStar_MOU

June 02, 2025
The MoU opens new avenues for joint research in advanced CMOS and post-CMOS technologies; heterogeneous integration and packaging; AI hardware accelerators; next-generation memory systems; photonics and quantum devices; and chip reliability, thermal management and failure analysis.

Semiconductor

May 30, 2025
CHERI, which stands for ‘capability hardware enhanced RISC instructions,’ aims to protect against cyber attacks that use software memory misallocation, buffer over flows and other memory hacks.

Blackwell

May 26, 2025
The GPU, which will feature Nvidia’s new generation Blackwell-architecture AI processors, may be priced between USD 6,500 and USD 8,000, significantly below the USD 10,000-USD 12,000 the H20 sold for, Reuters reports.

WEN-RoQNET

May 23, 2025
In a new paper published in Optica Quantum, scientists described the Rochester Quantum Network (RoQNET), which uses single photons to transmit information about 11 miles along fiber-optic lines at room temperature using optical wavelengths.

Dresden-Super-Computer

May 23, 2025
RAFI ELTEC GmbH, based in Überlingen, has played a crucial role in the development of one of Europe’s most advanced neuromorphic computing systems. The “SpiNNcloud” supercomputer, developed at TU Dresden under the direction of Professor Christian Mayr, is now officially operational. As a key industrial partner, RAFI ELTEC was responsible for producing highly complex, customized circuit boards based on the innovative SpiNNaker2 chip.

IC-sales-1Q25

May 21, 2025
The global semiconductor manufacturing industry entered 2025 with typical seasonal patterns. However, looming tariff threats and evolving supply chain strategies are expected to create atypical seasonality for several industry segments as the year progresses, reports SEMI.

Fraunhofer-partnership-agreement

May 20, 2025
NY Creates and the Fraunhofer Institute for Photonic Microsystems (Fraunhofer IPMS) have signed a Joint Development Agreement (JDA) aimed at advancing research and development of next-generation memory devices at the 300mm wafer scale.

TC_BONDER4

May 19, 2025
TC BONDER 4 is dedicated equipment capable of HBM4 production, featuring significantly improved productivity and precision compared to competitors, tailored to the characteristics of HBM4 which requires even higher precision.

Gerhard-Stelzer

May 14, 2025
Cybersecurity is shifting into the focus of European regulation. According to the EU Radio Equipment Directive, by August 2025, products with radio technology and internet access must protect networks and personal data and prevent fraud. The EN18031 standard is designed to assist manufacturers in implementation. Part 2 looks into its application.

Semiconductor_3D_X-DRAM

May 09, 2025
Built on a 3D NAND-like architecture and with proof-of-concept test chips expected in 2026, the new 1T1C and 3T0C designs combine the performance of DRAM with the manufacturability of NAND.

pile-of-wafers

May 07, 2025
Siemens Digital Industries Software says its continued collaboration with Intel Foundry, has resulted in new product certifications, updated foundry reference flows, and new technology enablements for Intel’s advanced process nodes and packaging technologies.

cybersecurity

May 02, 2025
The NVIDIA DOCA Argus framework provides runtime threat detection by using advanced memory forensics to monitor threats in real time, delivering detection speeds up to 1,000x faster than existing agentless solutions — without impacting system performance.

testing

May 02, 2025
This is a 15% increase in the number of layers over conventional 108-layer designs. Japan’s OKI Circuit Technology is seeking to establish mass production technology by October 2025 at its Joetsu plant.

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