AT&S opens Europe’s first IC substrate plant facility in Leoben
June 04, 2025
Austrian microelectronics and PCB manufacturer AT&S has officially inaugurated Europe's first local research and production centre for IC substrates.
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IIT Kharagpur, A*STAR team up to advance semiconductor innovation
June 02, 2025
The MoU opens new avenues for joint research in advanced CMOS and post-CMOS technologies; heterogeneous integration and packaging; AI hardware accelerators; next-generation memory systems; photonics and quantum devices; and chip reliability, thermal management and failure analysis.
SCI raises $3.3M to develop security-enhanced microcontroller
May 30, 2025
CHERI, which stands for ‘capability hardware enhanced RISC instructions,’ aims to protect against cyber attacks that use software memory misallocation, buffer over flows and other memory hacks.
Report: Nvidia to launch cheaper Blackwell AI chip for China
May 26, 2025
The GPU, which will feature Nvidia’s new generation Blackwell-architecture AI processors, may be priced between USD 6,500 and USD 8,000, significantly below the USD 10,000-USD 12,000 the H20 sold for, Reuters reports.
RIT, University of Rochester develop experimental quantum communications network
May 23, 2025
In a new paper published in Optica Quantum, scientists described the Rochester Quantum Network (RoQNET), which uses single photons to transmit information about 11 miles along fiber-optic lines at room temperature using optical wavelengths.
RAFI ELTEC supplies key technology for TU Dresden’s new supercomputer
May 23, 2025
RAFI ELTEC GmbH, based in Überlingen, has played a crucial role in the development of one of Europe’s most advanced neuromorphic computing systems. The “SpiNNcloud” supercomputer, developed at TU Dresden under the direction of Professor Christian Mayr, is now officially operational. As a key industrial partner, RAFI ELTEC was responsible for producing highly complex, customized circuit boards based on the innovative SpiNNaker2 chip.
Semiconductor outlook: typical Q1, but atypical shifts ahead
May 21, 2025
The global semiconductor manufacturing industry entered 2025 with typical seasonal patterns. However, looming tariff threats and evolving supply chain strategies are expected to create atypical seasonality for several industry segments as the year progresses, reports SEMI.
NY Creates and Fraunhofer team up on 300mm memory R&D
May 20, 2025
NY Creates and the Fraunhofer Institute for Photonic Microsystems (Fraunhofer IPMS) have signed a Joint Development Agreement (JDA) aimed at advancing research and development of next-generation memory devices at the 300mm wafer scale.
HANMI Semiconductor launches TC BONDER 4 for HBM4
May 19, 2025
TC BONDER 4 is dedicated equipment capable of HBM4 production, featuring significantly improved productivity and precision compared to competitors, tailored to the characteristics of HBM4 which requires even higher precision.
Tough Times for Hackers – Part 2: Applying the EN 18031 standard
May 14, 2025
Cybersecurity is shifting into the focus of European regulation. According to the EU Radio Equipment Directive, by August 2025, products with radio technology and internet access must protect networks and personal data and prevent fraud. The EN18031 standard is designed to assist manufacturers in implementation. Part 2 looks into its application.
NEO unveils 1T1C and 3T0C IGZO-based 3D X-DRAM tech
May 09, 2025
Built on a 3D NAND-like architecture and with proof-of-concept test chips expected in 2026, the new 1T1C and 3T0C designs combine the performance of DRAM with the manufacturability of NAND.
Siemens and Intel expand collaboration on IC and packaging solutions
May 07, 2025
Siemens Digital Industries Software says its continued collaboration with Intel Foundry, has resulted in new product certifications, updated foundry reference flows, and new technology enablements for Intel’s advanced process nodes and packaging technologies.
NVIDIA brings cybersecurity to every AI factory
May 02, 2025
The NVIDIA DOCA Argus framework provides runtime threat detection by using advanced memory forensics to monitor threats in real time, delivering detection speeds up to 1,000x faster than existing agentless solutions — without impacting system performance.
OKI develops 124-layer PCB tech for AI chip testing tools
May 02, 2025
This is a 15% increase in the number of layers over conventional 108-layer designs. Japan’s OKI Circuit Technology is seeking to establish mass production technology by October 2025 at its Joetsu plant.
Global semiconductor materials market posts $67.5B in 2024 revenue
April 29, 2025
Global semiconductor materials market revenue increased 3.8% to USD 67.5 billion in 2024, reports SEMI.
Micron restructures business units to target AI-driven demand
April 23, 2025
Micron Technology has announced a significant reorganisation of its business units, making a strategic pivot to better align with the growing influence of AI across all sectors.
Cadence advances Cloud AI with DDR5 12.8Gbps MRDIMM Gen2 IP
April 22, 2025
The Cadence DDR5 MRDIMM IP boasts a new high-performance, scalable and adaptable architecture based on Cadence’s proven and highly successful DDR5 and GDDR6 product lines.
Lightmatter’s photonic superchip advances interconnect innovation
April 18, 2025
With fully integrated fiber attachment supporting 256 fibers, Passage M1000 delivers an order of magnitude higher bandwidth in a smaller package size compared to existing CPO solutions.
US tariffs spurs surge in stockpiling, memory contract prices set to rise
April 17, 2025
TrendForce’s latest investigations reveal that the implementation of the US “reciprocal tariffs” on April 9th — followed by a 90-day grace period for most regions — has prompted buyers and suppliers to adjust their strategies in response to policy uncertainty.
Applied Materials acquires 9% stake in BE Semiconductor Industries
April 15, 2025
Applied Materials has purchased 9% of the outstanding shares of the common stock of BE Semiconductor Industries N.V. (Besi), a Netherlands-based manufacturer of semiconductor assembly equipment.
Global semiconductor equipment billings surged to $117B in 2024
April 10, 2025
Worldwide sales of semiconductor manufacturing equipment increased 10% to USD 117.1 billion in 2024 from USD 106.3 billion in 2023, SEMI reports reported today.
Semiconductor industry grows 21% in 2024; Nvidia takes lead
April 10, 2025
The global semiconductor industry saw substantial growth in 2024, with worldwide revenue rising 21% year-over-year to reach USD 655.9 billion, according to final figures from Gartner. For the first time, Nvidia claimed the top spot in the global rankings, capturing 11.7% market share, followed by Samsung Electronics and Intel.
Intelligent Memory eyes growth despite harket headwinds
April 08, 2025
The memory market has faced significant headwinds over the past two years, according to Nicolas Rossetto of Intelligent Memory. Speaking to Evertiq during the Evertiq Expo in Sophia Antipolis, Rossetto acknowledged the ongoing difficulties in the industry, noting that both large and small memory makers have been impacted by declining prices and weak consumer demand.
German memory innovators aim to revive domestic memory chip manufacturing
April 03, 2025
Neumonda and Ferroelectric Memory Company (FMC) are joining forces to advance the development and commercialisation of FMC’s nonvolatile DRAM+ technology. This collaboration aims nothing less than to bring semiconductor DRAM memory design and manufacturing back to Germany.
Global fab equipment investment expected to reach $110B in 2025
April 03, 2025
Global fab equipment spending for front-end facilities in 2025 is anticipated to increase by 2% YoY to USD 110 billion, marking the sixth consecutive year of growth since 2020, SEMI reports.
UMC opens new fab expansion in Singapore
April 01, 2025
Semiconductor foundry United Microelectronics Corporation (UMC) has officially opened its new fab facility in Singapore. The first phase of the new facility will start volume production in 2026, bringing UMC’s total production capacity in Singapore to more than 1 million wafers annually.
SK hynix completes its acquisition of Intel's NAND business
April 01, 2025
South Korean memory giant SK hynix has officially completed its acquisition of Intel’s NAND flash memory business, a deal initially announced in October 2020.
Global OSAT market to touch $94 billion by 2031
March 28, 2025
Increasing circuit complexity spurs OSAT market growth, as integrating various functionalities into a single device demands specialized assembly and test capabilities.
YES ships first VeroTherm Formic Acid Reflow tool to chipmaker
March 27, 2025
This represents the first equipment produced in India for advanced semiconductor applications like High Bandwidth Memory (HBM), which is critical for AI and High-Performance Computing applications.
ASML and imec team up to advance European research and sustainability
March 11, 2025
ASML and imec have entered into a new five-year strategic partnership aimed at advancing semiconductor research and sustainability in Europe. The agreement will leverage both companies' expertise to drive technological innovation and sustainable initiatives in the semiconductor industry.
indie partners with GF to boost automotive radar tech
March 07, 2025
These high-performance radar systems-on-chip (SoC), manufactured on GlobalFoundries’ 22FDX platform, will target 77 GHz and 120 GHz radar applications for advanced driver assistance systems.
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