Evertiq - First In Electronics News & Expo

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AI_Asimov

September 11, 2026
Positron AI’s next-gen systems realize more than 90% of their available memory bandwidth, are built on commodity LPDDR5X memory that sidesteps constrained HBM and CoWoS supply chains, and deliver leading tokens per dollar and tokens per watt.

engineers-working

September 10, 2026
SMIC posted the strongest growth among the top three foundries in Q2 2026, with revenue surging 20% QoQ to more than USD 3 billion and market share edging up to 5.4% – closing in on Samsung Foundry's 5.9%. Combined revenue for the world's top ten foundries rose 11.5% to nearly USD 53.49 billion, a new record, according to TrendForce.

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September 10, 2026
German automotive semiconductor manufacturer Elmos Semiconductor and South Korean foundry SK keyfoundry have signed an agreement expanding their collaboration to include 130nm technology, securing long-term wafer capacity through 2037. The two companies have worked together on 350nm technology for 18 years.

building_logo

September 10, 2026
The two companies aim to deepen collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies. Samsung plans to introduce ASML’s High NA EUV lithography into future DRAM high-volume manufacturing by 2028.

Taichung-Taiwan

September 09, 2026
Labour unions representing nearly two-thirds of Micron Technology's Taiwan workforce are threatening to strike unless the US memory chip maker changes how it distributes profits to employees, Reuters reports. More than 80% of union members who took part in an internal survey in August backed strike action.

M4VGroup

September 07, 2026
The TXZ+ Family Entry-Class M4V Group feature an Arm Cortex-M4 core with a floating-point unit to enhance security and data management in IoT devices and industrial equipment.

Semiconductor

September 04, 2026
NanoBridge Semiconductor will provide its customers with a version of Precision FPGA Synthesis tuned for its NBS6503H and NBS1201 FPGA device families, helping designers achieve high-quality synthesis results while supporting efficient implementation workflows.

sign-on-building

September 01, 2026
Nvidia and MediaTek have announced an expanded collaboration spanning cloud AI infrastructure, local AI computing and automotive. As part of the deal, Nvidia has invested USD 3.5 billion in convertible bonds issued by MediaTek.

geralt-computer-chip

August 31, 2026
CXMT, the world’s fourth-largest DRAM maker, is seeking removal from the Pentagon’s Section 1260H list of Chinese companies with military ties to Beijing. It was first added to the list in January 2025, and kept on the list after a review in June.

New-Fabrication-Facility-at-Yokkaichi-Plant

August 31, 2026
Kioxia and Sandisk have announced anticipated investments in Japan totalling over USD 31 billion – approximately 5 trillion yen – contingent on government support. The investments, running through 2032, will support continued expansion of the companies' joint venture manufacturing operations at the Yokkaichi and Kitakami plants.

Indiana_groundbreaking

August 28, 2026
The Indiana fab is scheduled to open its cleanroom by October 2028 and initiate mass production of next-generation HBM in the second half of 2029. SK hynix also signed an MOU with Purdue University for research and development collaboration in advanced packaging.

total-capex-forecast-csp-2027

August 26, 2026
DRAM and NAND Flash combined will account for 47% of major cloud service providers' total capital expenditure in 2026, rising to 68% in 2027, according to TrendForce. The shift reflects both soaring memory contract prices and surging procurement demand for AI infrastructure.

August 24, 2026
Micron Technology has launched the Micron Ventures Paradigm Fund, a USD 250 million investment vehicle targeting startups across the AI technology stack. It is Micron Ventures' third and largest fund to date, bringing the unit's total capital commitment to USD 550 million.

August 21, 2026
Micron Research Labs will center on a flagship Boise campus designed to support advanced research across critical technology domains. Key research areas include critical memory technologies, advanced memory and compute architectures, packaging and future semiconductor manufacturing.

August 20, 2026
Marvell Technology has entered into an expanded commercial agreement with Google to develop custom semiconductor products across a range of programmes attached to Google's TPU ecosystem.

chip

August 14, 2026
The program targets high-power external laser sources for co-packaged optics (CPO), high-channel-count DFB arrays for wavelength-multiplexed links, and SOA gain stages that extend optical reach as channel counts scale.

Program-Evertiq-Expo-1

August 11, 2026
Earlier this year, several discussions at Evertiq Expo pointed to the same conclusion: while the semiconductor industry continues to grow, that growth is far from evenly distributed. AI, memory and data centres have driven record revenues, while other parts of the electronics industry continue to face a very different reality.

axonite_chip

August 10, 2026
Through its investment, Ardian Semiconductor will support VSORA in accelerating its go‑to‑market strategy to strengthen the company’s recognition across the value chain and reinforce VSORA’s access to senior semiconductor industry expertise.

terafab

August 07, 2026
Terafab, a vertically integrated semiconductor fabrication plant in Grimes County, Texas, with over 100 million square feet of manufacturing space, will employ at least 3,000 people.

August 07, 2026
Taalas’ technology optimizes inference dataflows, reducing compute and memory bottlenecks associated with general-purpose architectures and enabling highly optimized AI inference capabilities.

Infineon-1

August 06, 2026
MediaTek has now qualified the Infineon 512 Mb Quad SPI NOR Flash, an automotive-grade NOR Flash memory solution, for use in its Dimensity Auto Cockpit platform C-X1.

August 06, 2026
Under the agreements, Samsung will receive access to US firm Netlist’s complete patent portfolio, including its server DIMM and High Bandwidth Memory technologies. Samsung will supply Netlist DRAM and NAND products, and the parties agree to settle and mutually release all pending legal actions.

Liquide_gas_plant

August 06, 2026
Scheduled to begin operations in 2028, Air Liquide’s production unit will deliver large volumes of ultra-pure nitrogen, oxygen and argon, essential for manufacturing advanced memory chips.

geralt_AI

August 05, 2026
TrendForce estimates that the combined 2026 CapEx of Google, Amazon, Meta, Microsoft, Oracle, ByteDance, Tencent, Alibaba, and Baidu will exceed USD 886.7 billion, with the five North American hyperscalers accounting for nearly 90%.

Gen3_MRDIMM

August 05, 2026
Renesas’ Gen 3 MRDIMM solutions deliver 25 percent higher memory bandwidth than its second-generation solutions, while continuing to use existing DDR5 infrastructure. As a result, server platforms can extract more performance without disruptive architectural changes.

sign

August 03, 2026
The planned USD 500 billion comprehensive partnership aims to accelerate large-scale AI infrastructure development, including sovereign, physical, agentic and enterprise AI services and jointly address the increasing AI demand across Asia-Pacific.

PCB-world_1

July 30, 2026
SEMI Silicon Manufacturers Group (SMG) has reported that worldwide silicon wafer shipments increased 7.4% year-on-year to 3,573 million square inches (MSI) from the 3,327 MSI recorded during the same quarter of 2025.

Systems_Openchip_partnership

July 30, 2026
Spanish company Openchip will use US-based chiplet startup Baya Systems’ WeaveIP unified fabric to develop specialized intelligent compute systems for next-generation AI workloads.

Didrik-PCB

July 28, 2026
In an interview with Evertiq, Didrik Bech, board member of PCB supplier Confidee, described how the AI infrastructure boom is creating an unprecedented demand for materials, resulting in supply shortages that could reshape market conditions across several European industries.

building_logo

July 28, 2026
On the memory front, Samsung and Broadcom plan to pursue a strategic collaboration for the supply of industry-leading memory solutions, including HBM, supporting Broadcom’s next-generation AI accelerators.

Best-Supply-Jacek-Malecki-Krakow-2026

July 20, 2026
Artificial intelligence, geopolitical tensions, rising raw material prices, and increasingly longer delivery times create a combination of factors that could make life much more difficult for electronics manufacturers.

SLC_NAND

July 16, 2026
Meanwhile, demand for SLC NAND continues to grow in AI edge computing, data centers, and automotive electronics, causing the supply-demand gap to widen quickly, TrendForce notes.

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