One in a Million. People used to be our greatest strength
July 07, 2025
In this first article of Evertiq’s new expert column series, Claus Aasholm – seasoned technology executive and strategist – shares his perspective on the trends, challenges, and breakthroughs shaping the global electronics industry. Drawing on decades of hands-on experience, Claus offers sharp, thought-provoking insights that go beyond headlines and buzzwords. Expect analysis that connects the dots – and challenges the status quo.
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SkyWater Technology completes acquisition of Fab 25
July 04, 2025
By adding approximately 400,000 wafer starts per year in capacity, Fab 25 brings meaningful scale to SkyWater’s exclusively US-based, pure-play foundry operation and enables SkyWater to enhance its advanced technology services (ATS) offering by incorporating the site’s current capabilities.
Claus Aasholm: “The semiconductor cycle is broken”
July 02, 2025
During Evertiq Expo Malmö 2025, Claus Aasholm, founder of Semiconductor Business Intelligence, offered a sobering reassessment of the global semiconductor market. In his keynote and follow-up interview, Aasholm argued that the industry’s historical four-year cycle has broken down – replaced by a fragmented, profit-driven upswing felt by only a select few.
Oracle, AMD partner to enhance performance for AI and agentic workloads
July 01, 2025
Oracle will offer zettascale AI clusters accelerated by the latest AMD Instinct processors with up to 131,072 MI355X GPUs to enable customers to build, train, and inference AI at scale.
Micron reports record 3Q revenue, projects continued growth in Q4
June 26, 2025
Micron Technology reported record revenue of USD 9.30 billion for the third quarter of its fiscal 2025, marking a significant sequential and year-over-year increase as demand for AI-related memory solutions continues to accelerate.
Report: Crusoe to buy $400M worth of AMD chips for AI data centers
June 13, 2025
The 13,000 AMD MI355X chips Crusoe plans to purchase include high-bandwidth memory, making them suitable for running AI applications.
Trump's first onshoring win isn’t the iPhone – it's the AI server
June 12, 2025
As Nikkei Asia reports in a new investigation, the US is quietly assembling a domestic supply chain for one of the most complex machines in the world: the AI server. And while Apple has resisted political pressure to move iPhone production onshore, a host of data centre suppliers – including Foxconn, Wistron, TSMC and SK Hynix – are rapidly expanding their US footprint to serve customers like Nvidia, Microsoft and Amazon.
Micron commits $200B to US DRAM and AI memory manufacturing
June 12, 2025
Micron Technology will expand its US investment to approximately USD 150 billion in memory manufacturing and USD 50 billion in R&D, marking one of the largest semiconductor initiatives since the CHIPS Act.
India approves Micron’s $1.5 billion Gujarat SEZ proposal
June 10, 2025
US semiconductor company Micron Technology will set up its SEZ facility in Sanand, Gujarat, while Indian diversified contract manufacturer Aequs will set up its SEZ in Dharwad, Karnataka.
China’s GigaDevice opens global headquarters in Singapore
June 05, 2025
This strategic move marks a major milestone in GigaDevice’s international growth journey, underscoring its commitment to closer customer engagement, building a resilient and agile supply chain, and strengthening its ecosystem and brand presence across key global markets.
AT&S opens Europe’s first IC substrate plant facility in Leoben
June 04, 2025
Austrian microelectronics and PCB manufacturer AT&S has officially inaugurated Europe's first local research and production centre for IC substrates.
IIT Kharagpur, A*STAR team up to advance semiconductor innovation
June 02, 2025
The MoU opens new avenues for joint research in advanced CMOS and post-CMOS technologies; heterogeneous integration and packaging; AI hardware accelerators; next-generation memory systems; photonics and quantum devices; and chip reliability, thermal management and failure analysis.
SCI raises $3.3M to develop security-enhanced microcontroller
May 30, 2025
CHERI, which stands for ‘capability hardware enhanced RISC instructions,’ aims to protect against cyber attacks that use software memory misallocation, buffer over flows and other memory hacks.
Report: Nvidia to launch cheaper Blackwell AI chip for China
May 26, 2025
The GPU, which will feature Nvidia’s new generation Blackwell-architecture AI processors, may be priced between USD 6,500 and USD 8,000, significantly below the USD 10,000-USD 12,000 the H20 sold for, Reuters reports.
RIT, University of Rochester develop experimental quantum communications network
May 23, 2025
In a new paper published in Optica Quantum, scientists described the Rochester Quantum Network (RoQNET), which uses single photons to transmit information about 11 miles along fiber-optic lines at room temperature using optical wavelengths.
RAFI ELTEC supplies key technology for TU Dresden’s new supercomputer
May 23, 2025
RAFI ELTEC GmbH, based in Überlingen, has played a crucial role in the development of one of Europe’s most advanced neuromorphic computing systems. The “SpiNNcloud” supercomputer, developed at TU Dresden under the direction of Professor Christian Mayr, is now officially operational. As a key industrial partner, RAFI ELTEC was responsible for producing highly complex, customized circuit boards based on the innovative SpiNNaker2 chip.
Semiconductor outlook: typical Q1, but atypical shifts ahead
May 21, 2025
The global semiconductor manufacturing industry entered 2025 with typical seasonal patterns. However, looming tariff threats and evolving supply chain strategies are expected to create atypical seasonality for several industry segments as the year progresses, reports SEMI.
NY Creates and Fraunhofer team up on 300mm memory R&D
May 20, 2025
NY Creates and the Fraunhofer Institute for Photonic Microsystems (Fraunhofer IPMS) have signed a Joint Development Agreement (JDA) aimed at advancing research and development of next-generation memory devices at the 300mm wafer scale.
HANMI Semiconductor launches TC BONDER 4 for HBM4
May 19, 2025
TC BONDER 4 is dedicated equipment capable of HBM4 production, featuring significantly improved productivity and precision compared to competitors, tailored to the characteristics of HBM4 which requires even higher precision.
Tough Times for Hackers – Part 2: Applying the EN 18031 standard
May 14, 2025
Cybersecurity is shifting into the focus of European regulation. According to the EU Radio Equipment Directive, by August 2025, products with radio technology and internet access must protect networks and personal data and prevent fraud. The EN18031 standard is designed to assist manufacturers in implementation. Part 2 looks into its application.
NEO unveils 1T1C and 3T0C IGZO-based 3D X-DRAM tech
May 09, 2025
Built on a 3D NAND-like architecture and with proof-of-concept test chips expected in 2026, the new 1T1C and 3T0C designs combine the performance of DRAM with the manufacturability of NAND.
Siemens and Intel expand collaboration on IC and packaging solutions
May 07, 2025
Siemens Digital Industries Software says its continued collaboration with Intel Foundry, has resulted in new product certifications, updated foundry reference flows, and new technology enablements for Intel’s advanced process nodes and packaging technologies.
NVIDIA brings cybersecurity to every AI factory
May 02, 2025
The NVIDIA DOCA Argus framework provides runtime threat detection by using advanced memory forensics to monitor threats in real time, delivering detection speeds up to 1,000x faster than existing agentless solutions — without impacting system performance.
OKI develops 124-layer PCB tech for AI chip testing tools
May 02, 2025
This is a 15% increase in the number of layers over conventional 108-layer designs. Japan’s OKI Circuit Technology is seeking to establish mass production technology by October 2025 at its Joetsu plant.
Global semiconductor materials market posts $67.5B in 2024 revenue
April 29, 2025
Global semiconductor materials market revenue increased 3.8% to USD 67.5 billion in 2024, reports SEMI.
Micron restructures business units to target AI-driven demand
April 23, 2025
Micron Technology has announced a significant reorganisation of its business units, making a strategic pivot to better align with the growing influence of AI across all sectors.
Cadence advances Cloud AI with DDR5 12.8Gbps MRDIMM Gen2 IP
April 22, 2025
The Cadence DDR5 MRDIMM IP boasts a new high-performance, scalable and adaptable architecture based on Cadence’s proven and highly successful DDR5 and GDDR6 product lines.
Lightmatter’s photonic superchip advances interconnect innovation
April 18, 2025
With fully integrated fiber attachment supporting 256 fibers, Passage M1000 delivers an order of magnitude higher bandwidth in a smaller package size compared to existing CPO solutions.
US tariffs spurs surge in stockpiling, memory contract prices set to rise
April 17, 2025
TrendForce’s latest investigations reveal that the implementation of the US “reciprocal tariffs” on April 9th — followed by a 90-day grace period for most regions — has prompted buyers and suppliers to adjust their strategies in response to policy uncertainty.
Applied Materials acquires 9% stake in BE Semiconductor Industries
April 15, 2025
Applied Materials has purchased 9% of the outstanding shares of the common stock of BE Semiconductor Industries N.V. (Besi), a Netherlands-based manufacturer of semiconductor assembly equipment.
Global semiconductor equipment billings surged to $117B in 2024
April 10, 2025
Worldwide sales of semiconductor manufacturing equipment increased 10% to USD 117.1 billion in 2024 from USD 106.3 billion in 2023, SEMI reports reported today.
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