Canada’s Spark Microsystems raises $12 million Series B April 23, 2026 This strategic investment will accelerate Spark’s expansion and commercialization momentum for LE-UWB technology as customer demand surges for wireless solutions capable of meeting the performance and power requirements of intelligent edge devices.
Lattice Semiconductor collaborates with TI to advance Edge AI April 22, 2026 The combination of TI’s sensing technologies and the Lattice Holoscan Sensor Bridge solution will provide developers with a flexible hardware foundation for synchronized, low latency sensor data pipelines in advanced robotics and industrial applications.
ASML reports €8.8 billion in Q1 sales, raises full-year outlook April 22, 2026 ASML reported total net sales of EUR 8.8 billion and net income of EUR 2.8 billion for the first quarter of 2026.
Onto expands partnership with Rigaku through 27% equity investment April 22, 2026 By combining Rigaku’s X-ray technologies with Onto Innovation’s complementary optical metrology and advanced analytics software, the companies aim to deliver next-generation hybrid metrology solutions for increasingly complex semiconductor devices.
Wooptix breaks ground on cleanroom facility in Spain April 22, 2026 Designed as a central hub for innovation, the semiconductor cleanroom facility will support the assembly of new equipment, along with testing, validation and customer demonstration activities.
Japan quake triggers alert; semiconductor operations unaffected April 21, 2026 A magnitude 7.7 earthquake struck off the coast of northern Japan on April 20, prompting a brief tsunami alert and a government advisory warning of an elevated risk of a potential megaquake, the Associated Press reports.
Advantest opens innovation centres in Silicon Valley April 21, 2026 Advantest Corporation has opened a new innovation center in San Jose and is preparing a second facility in Sunnyvale, as the company looks to strengthen collaboration across the semiconductor value chain.
Molex completes acquisition of Smiths Interconnect April 21, 2026 Molex has completed its acquisition of Smiths Interconnect, a subsidiary of Smiths Group plc, marking the largest acquisition in the company’s history.
3DGS breaks ground on chip packaging unit in India April 20, 2026 The US company is investing about USD 21 million in the Odisha project. The facility is expected to produce 70,000 glass panels annually, along with 50 million assembled units and 13,000 advanced 3DHI modules.
Air Liquide invests €200M in Japan to support chip manufacturer April 20, 2026 Set to begin operations by the end of 2028, Air Liquide’s production units will deliver large volumes of ultra-pure nitrogen, oxygen and argon to support the production of advanced chips.
Renesas expands auto MCU portfolio with 28nm RH850/U2C April 20, 2026 The MCU targets a range of automotive applications, including chassis and safety systems for passenger cars and motorcycles, battery management systems (BMS) and body control functions such as lighting and motor control, and other general-purpose ASIL D applications.
SCREEN’s semiconductor R&D hub opens in New York April 17, 2026 Through this initiative, NY Creates and SCREEN Advanced Technology Center of America (ATCA) intend to connect high-tech organizations in the US and Japan to leverage their networks and drive innovation in SCREEN’s semiconductor R&D focus areas.
ASE breaks ground on new Renwu facility to expand testing cluster in Kaohsiung April 16, 2026 Taiwan-based Advanced Semiconductor Engineering (ASE) has held a groundbreaking ceremony for a new facility in Renwu Industrial Park in Kaohsiung, Taiwan, aimed at establishing a semiconductor testing services cluster.
Extended lead times for key components weigh on server growth April 15, 2026 Extended lead times for key semiconductor and hardware components are increasingly shaping supply conditions in the server market, according to TrendForce.
First Evertiq Expo Zurich just around the corner – industry experts to take the stage April 15, 2026 On April 23, Zurich will host the inaugural edition of Evertiq Expo Zurich, bringing together industry professionals for a day that moves between technology, manufacturing and market realities — often without clear boundaries between them.
How chips competence centres could change semiconductor hiring in Europe April 15, 2026 Europe is investing heavily in semiconductors. New fabs are being planned, public funding is flowing, Chips Act 2.0 is on its way and long-term initiatives are taking shape. But there’s a more basic question that doesn’t seem to get asked enough: Even if all of this gets built, who is going to run it?
Rapidus opens new Analysis Centre and Rapidus Chiplet Solutions April 14, 2026 Japanese semiconductor manufacturer Rapidus has opened a new Analysis Centre and launched its Rapidus Chiplet Solutions (RCS), expanding its development infrastructure ahead of planned advanced semiconductor production in fiscal 2027.
YMTC plans new fabs to boost capacity amid rising US-China tensions April 14, 2026 Chinese memory chipmaker Yangtze Memory Technologies (YMTC) is planning to build two additional plants alongside a facility nearing completion, in a move that would more than double its production capacity, according to a Reuters report citing sources familiar with the matter.
Gartner: Semiconductor revenue to exceed $1.3 trillion in 2026 April 13, 2026 Market research firm Gartner forecasts that global semiconductor revenue will exceed USD 1.3 trillion in 2026, representing 64% growth – the strongest growth in more than two decades – driven by continued strong demand related to AI, data centers and rising memory prices.
SiFive raises $400M to accelerate RISC-V data center solutions April 13, 2026 This financing will enable the California-based semiconductor company to accelerate the development of its next generation data center solutions and expand its global engineering teams to meet the needs of agentic AI workloads.
Samsung weighs semiconductor packaging investment in Vietnam April 10, 2026 Samsung Electronics is considering an investment in chip testing and packaging operations in Vietnam, Reuters reports, citing a source familiar with the matter.
Kinetic finalizes majority stake agreement with Cyient Semiconductors April 10, 2026 Cyient Semiconductors’ global reach enables Kinetic Technologies to tap into India’s semiconductor ecosystem, gaining access to engineering talent, OSAT and manufacturing partners, and stronger design capabilities.
Siemens joins ESA’s EPIC program to empower European startups April 10, 2026 Siemens will provide industrial-grade, comprehensive digital twin capabilities and a fully digital engineering and simulation backbone for the European space industry along with access to mentors and experts in the field.
Semiconductor equipment billings reached $135B in 2025 April 09, 2026 Worldwide sales of semiconductor manufacturing equipment increased 15% to USD 135.1 billion in 2025 from USD 117.1 billion in 2024, driven by continued investment in advanced logic, memory, and AI-related capacity expansion, according to SEMI.
Global semiconductor sales increase substantially in February April 09, 2026 Global semiconductor sales were $88.8 billion during the month of February 2026, an increase of 7.6% compared to the January 2026 total of $82.5 billion and 61.8% more than the February 2025 total of $54.9 billion, reports the Semiconductor Industry Association (SIA).
OKI launches EMS offering for AI server equipment April 08, 2026 OKI has introduced a new electronics manufacturing services (EMS) offering targeting AI server equipment.
Quest Global acquires Indian semiconductor firm BITSILICA April 08, 2026 BITSILICA’s diverse service portfolio will complement Quest Global’s existing strengths as an engineering solutions provider by expanding its capabilities in semiconductors and embedded systems.
Intel joins Musk-led Terafab project April 07, 2026 Intel has announced it will join the Terafab project, spearheaded by Elon Musk, alongside SpaceX, Tesla and xAI.
Spain allocates €19 million to semiconductor research and quantum chip development April 07, 2026 The Spanish government has approved the allocation of €19 million to support research in semiconductors and the development of quantum chips, according to a statement from the Ministry for Digital Transformation and Public Service.
Double-digit growth in global 300mm fab equipment spending for 2026 and 2027 April 07, 2026 Worldwide 300mm fab equipment spending is expected to increase 18% to USD 133 billion in 2026 and 14% to USD 151 billion in 2027, SEMI reports.
SUMCO shifts strategy from new fab to equipment upgrades April 07, 2026 SUMCO Corporation has received approval from Japan’s Ministry of Economy, Trade and Industry (METI) for an amended version of its “Plan for Ensuring Stable Supply” under the Economic Security Promotion Act, the company announced on March 27, 2026.
Ann Fairchild named President and CEO of Siemens USA April 03, 2026 Fairchild has been with Siemens for more than 25 years, most recently serving as general counsel for Siemens USA, overseeing legal, compliance, regulatory and intellectual property functions.