Evertiq - First In Electronics News & Expo

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June 19, 2026
With the acquisition of Pictorus, Renesas gains a cloud‑based behavioral modeling platform that accelerates embedded system development, moving the engineering experience beyond point tools by providing a connected platform for model-based system design.

Science_logo

June 19, 2026
The acquisition expands Brewer Science’s advanced materials portfolio and strengthens its ability to support semiconductor customers with highly specialized, ultrapure chemical solutions critical to advanced lithography and microdevice fabrication.

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June 18, 2026
The installation of Aixtron’s G10-GaN system at the Hamamatsu plant supports Rohm’s transition toward increased vertical integration and strengthens its ability to scale production for next-generation power semiconductor applications.

Vidros_Planos_Siemens

June 18, 2026
Using HighByte Intelligence Hub, users can apply flexible and scalable transformation rules to process data from multiple sources across IT and OT domains, adding business context and converting raw operational data into meaningful information.

Semiconductor_SinChip

June 17, 2026
This move will complement QBit’s existing high-performance SoC platforms, boosting its ASIC design services capability and amplifying the Taiwanese company’s market layout across Edge AI, HPC, optical communications and automotive sectors.

Headquarters-Durham

June 17, 2026
The companies plan to develop standards for high-voltage silicon carbide power modules, supporting solid-state transformers, industrial electrification and next-generation aerospace & defense platforms while strengthening supply chain resilience.

axonite_chip

June 17, 2026
The joint effort with the Fondazione Chips-IT builds on Japan and Europe semiconductor cooperation. Rapidus has also signed an MOU with the UK Semiconductor Centre, a national body promoting the semiconductor industry in the UK.

memory-contribution-semiconductor-1q26

June 16, 2026
Semiconductor revenue grew 27% QoQ in Q1 2026 to reach USD 319 billion – the highest quarterly growth Omdia has recorded since it began tracking the market in 2002. It marks the third consecutive quarter of double-digit growth, putting the market on track to surpass USD 700 billion in the first half of 2026.

Machines

June 16, 2026
The fresh funds will be used to expand manufacturing infrastructure, develop India’s first indigenous multi-axis CNC controller, strengthen its software stack, support semiconductor manufacturing initiatives, and accelerate international expansion.

geralt-computer-chip

June 15, 2026
Built on Cadence’s AI-driven electronic design automation (EDA) portfolio with Nvidia Nemotron models, and secured by Nvidia OpenShell runtime, the new agentic capabilities enable customers to run dynamic simulations in automated workflows.

quantum-computer_geralt

June 15, 2026
The French company, bringing semiconductor-grade manufacturing and industrialization to quantum computing, plans to deploy its first commercial quantum computer through the cloud by the end of 2026 under its Alloy product line.

cooperation-3

June 15, 2026
The partnership brings together CADFEM APAC’s expertise in multiphysics simulation, digital engineering and predictive development frameworks with SilTerra’s knowledge of semiconductor manufacturing, process development and fabrication technologies.

Expo-ZRH26-claus-speaking

June 12, 2026
At Evertiq Expo Zürich, Claus Aasholm of Semiconductor Business Intelligence delivered a data-driven examination of a semiconductor industry in structural transition – and the picture looked considerably different from what most quarterly reports suggest.

axonite_chip

June 12, 2026
Forge Nano’s TEPHRA platform is designed for high-volume semiconductor manufacturing and delivers the film uniformity, process repeatability, throughput, and manufacturing scalability required for commercial production environments.

Singapore_facility

June 12, 2026
The facility is positioned as a dedicated commercial-scale LED Chip-on-Board (CoB) packaging unit and is expected to create approximately 50 high-value engineering and manufacturing roles in Singapore over five years.

Singapore-facility

June 11, 2026
Applied Materials has expanded its manufacturing and R&D operations in Singapore with the opening of the Tampines Campus, a USD 500 million facility that more than doubles the company's cleanroom capacity in the country. The campus is already operating at volume production.

SiC-Wafer

June 11, 2026
Infineon Technologies and Siemens have announced a collaboration to advance electrical protection in data centres, production facilities and battery storage systems. Infineon will supply silicon carbide power modules to Siemens for use in its SENTRON 3QD2 semiconductor circuit breakers.

Romania-opening-2026

June 10, 2026
German fan and motor manufacturer ebm-papst has officially opened a new facility in Oradea, Romania, following an investment of approximately EUR 30 million. The site brings together production, research and development, and service functions under one roof.

Samsung_chip_design

June 09, 2026
Through close engineering alignment, Siemens continues to qualify and deploy its electronic design automation (EDA) software — including design, verification, simulation and silicon manufacturing enablement — with Samsung Foundry’s latest process technologies.

June 09, 2026
US semiconductor manufacturer Onsemi is reportedly planning to cut between 200 and 300 jobs at its plant in Rožnov pod Radhoštěm in the Czech Republic, according to Czech media outlet e15. The cuts follow an earlier round of approximately 170 layoffs at the same facility in 2025.

PCB-Japan_2

June 09, 2026
As a result of this latest capital increase by Japan’s Information-Technology Promotion Agency (IPA), Rapidus’ funding now totals 424.95 billion yen (about USD 2.7 billion).

Santa-Clara-HQ-Entrance

June 08, 2026
As AI factories scale globally, this strategic partnership enables memory supply to keep pace with Nvidia’s infrastructure roadmap and the sustained buildout of AI infrastructure worldwide.

Samueli_semiconductor_hub

June 08, 2026
The mission of the semiconductor hub is to foster sustained collaboration between leading faculty and industry partners Broadcom, Applied Materials, GlobalFoundries, Meta and Synopsys to drive advances in connectivity, computing and intelligent systems.

Nanopower_agreement

June 08, 2026
Norwegian company Nanopower Semiconductor’ nPZero Gen1 power management IC extends system lifetime by reducing the load on the main MCU. The agreement aims to reduce IoT power and increase battery life for UK and EU customers.

quantum-technologies-1

June 05, 2026
Rather than relying on a single architecture, SEALSQ is investing into several complementary approaches to fault-tolerant quantum computing and binding them to its own QS7001 secure hardware, QVault TPM and PQC product portfolio.

3dIC

June 05, 2026
Building on the companies’ 2025 announcement of certified Cadence tools and IP on multiple Samsung Foundry nodes, including second-generation 2nm, this new multi-year agreement further broadens the Cadence portfolio of Memory and Interface IP.

axonite_chip

June 05, 2026
The technology combines micro-scaled opto-semiconductor chips capable of 12V single-chip operation with a high-voltage (HV) driver technology, enabling a reduction of more than 10% in the number of driver-related components used in hybrid and electric vehicles.

Chips-Act

June 04, 2026
The European Commission has presented the European Technological Sovereignty Package, a set of legislative and strategic measures aimed at reducing Europe's dependence on foreign suppliers in semiconductors, AI, cloud computing and open source technology.

Tessalia

June 04, 2026
Foxconn, Radiall and Thales laid the foundation stone of their future JV. Tessalia is expected to have 800 employees at full production. Production is expected to start at the end of 2029 and to reach more than 50 million SiP components per year by 2033.

Marco-Mezger-2026

June 03, 2026
For years, memory sourcing followed a familiar logic. Buyers negotiated hard, and, when prices rose, trusted that the cycle would eventually rebalance. That approach worked – until it didn’t.

tsmc_chip_design

June 03, 2026
Nvidia CUDA-X libraries and AI models are accelerating TSMC workloads across lithography, transistor and process simulation, advanced process control and fab operations optimization.

June 02, 2026
AMD says it plans to invest more than USD 10 billion across Taiwan's semiconductor ecosystem to expand strategic partnerships and scale advanced packaging manufacturing for next-generation AI infrastructure. The company also confirmed that its Helios rack-scale platform is on track for deployment in the second half of 2026.

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