Evertiq - First In Electronics News & Expo

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Ground combat vehicles are rapidly evolving from fixed-function platforms into modular, software-defined systems. This shift demands interconnect solutions that support continuous upgrades without requiring redesigns of wiring infrastructure. Scalable, high-reliability connectors, particularly those based on MIL-DTL-38999, are central to enabling this transformation.

July 02, 2026
TSMC and Sony Semiconductor Solutions have signed a non-binding memorandum of understanding to form a strategic partnership for the development and manufacturing of next-generation image sensors.

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logos-on-buildings

July 02, 2026
ams OSRAM has completed the sale of its non-optical analog/mixed-signal sensor business to Infineon Technologies in a transaction valued at EUR 570 million.

production

June 30, 2026
Teledyne MEMS is expanding its manufacturing operations in Edmonton, Canada, backed by a CAD 620,000 grant from the Government of Alberta's Investment and Growth Fund. The expansion strengthens the province's role in the global semiconductor supply chain.

DACPOL-Dominik-Kowalczyk-Krakow-2026

June 25, 2026
The effectiveness of modern defence systems is no longer defined solely by the number of tanks, aircraft, missile launchers, or soldiers. Increasingly, real military capability depends on the reliability of the electronics responsible for maintaining communications, surveillance, data processing, and weapons control.

Munich-facility

June 24, 2026
The European Commission has approved EUR 76 million in German state aid for QuantumDiamonds GmbH to establish a semiconductor testing equipment facility in Munich, Germany. The facility will be the first in the EU to produce semiconductor metrology and inspection systems based on quantum sensing.

Space_AI

June 24, 2026
The investment will accelerate the commercial rollout of Irish firm Ubotica’s Live Maritime Intelligence platform, which enables governments and maritime agencies to detect emerging threats across maritime territories in real time.

June 23, 2026
Robert Bosch GmbH has agreed to pay a USD 36 million penalty to the US Bureau of Industry and Security after shipping MEMS sensor products and software to Huawei and its affiliates without the required export licence. The shipments took place between September 2020 and September 2024.

Robotics

June 12, 2026
German company Neura Robotics is building a new category of AI infrastructure where cognitive robots continuously learn, collaborate and operate across real world environments through a shared intelligence ecosystem called the Neuraverse.

Nanopower_agreement

June 08, 2026
Norwegian company Nanopower Semiconductor’ nPZero Gen1 power management IC extends system lifetime by reducing the load on the main MCU. The agreement aims to reduce IoT power and increase battery life for UK and EU customers.

headoffice

June 05, 2026
The companies will explore the potential to provide optimal products and solutions by combining Murata’s expertise in high-frequency and wireless communications, sensors, timing devices and module design with Xona’s LEO-based positioning and timing synchronization technologies.

Headquarters-Durham

June 02, 2026
Silicon carbide specialist Wolfspeed has established a dedicated data centre solutions team and regional office in the San Francisco Bay Area, targeting the growing market for high-voltage power solutions in AI infrastructure. The company has hired two industry veterans to lead the effort.

Lab

May 26, 2026
Award marks Rocket Lab's first satellite production program for geostationary orbit and continues a Space Systems Command program for development and delivery on orbit of two Heimdall prototype payloads by Rocket Lab Optical Systems.

Sponsored content by TME Transfer Multisort Elektronik

Panasonic offers a wide range of components designed for industrial automation applications. Among them, miniature photoelectric sensors are particularly popular, valued for their compact dimensions, high precision of operation, and reliability in demanding applications. Let’s check what functions these solutions offer and what distinguishes them in terms of technical parameters.

May 15, 2026
Through the JV, both companies expect to leverage Sony's expertise in sensor design alongside TSMC’s strengths in process technology and manufacturing excellence as part of a broader collaboration aimed at enhancing image sensor performance.

Perception_team

May 08, 2026
The Danish startup will use this funding to accelerate development of its 10K sensor systems and software-defined cameras, expand its engineering team, support initial deployments across defense, security and emergency response sectors, and strengthen integrations with partners.

pile-of-wafers

May 07, 2026
A structural shift in the global mature-node foundry market is underway, according to research from TrendForce. Capacity cuts, surging demand for AI power components, and TSMC's planned reallocation are combining to push utilisation rates toward 90% — and set the stage for price increases.

Transmission_building

May 05, 2026
The acquisition aligns with Dhoot’s strategy to capitalize on accelerating trends towards increasing electrification, premiumization and electronic content in vehicles, supported by rising EV adoption.

Expo-ZRH26-claus-speaking

April 30, 2026
During Evertiq Expo Zurich on April 23, 2026, Claus Aasholm, founder of Semiconductor Business Intelligence, offered a pointed assessment of a semiconductor industry growing rapidly — but not evenly. In his keynote and a follow-up conversation, Aasholm argued that while headline figures suggest unprecedented expansion, underlying dynamics point to structural imbalances across the supply chain.

April 22, 2026
The combination of TI’s sensing technologies and the Lattice Holoscan Sensor Bridge solution will provide developers with a flexible hardware foundation for synchronized, low latency sensor data pipelines in advanced robotics and industrial applications.

Dominik-Kowalczyk

April 21, 2026
In many projects, electromagnetic compatibility (EMC) is still treated as a final-stage verification step. In practice, this approach increasingly leads to delays, costly redesigns and errors that are difficult to eliminate — particularly in complex defence systems. As Dominik Kowalczyk, an explosion protection specialist at Dacpol, told Evertiq, EMC analysis should cover the entire lifecycle of a project — from concept to deployment. He also pointed out where signal integrity is most often lost and why the traditional approach to EMC is no longer keeping pace with growing system complexity.

Mechelen-manufacturing-site

April 21, 2026
Aumovio plans to divest its manufacturing site in Mechelen, Belgium, to Dumarey Group, as part of efforts to optimise its production footprint.

March 30, 2026
Aechelon’s technology is used by the US military and allies to train pilots and test advanced aircraft and autonomous systems before live flight, and supports a range of critical national security platforms.

sign-on-building

March 24, 2026
Under the partnership, Infineon will provide its advanced wide-bandgap (WBG) power semiconductors, including silicon carbide (SiC) technology, along with application engineering support for system-level integration.

office

March 20, 2026
Infineon plays a key role in Subaru’s integrated electronic control unit (ECU) for next‑generation advanced driver assistance systems (ADAS) and vehicle motion control.

Phantom

March 13, 2026
This week’s Video Friday features a Reuters report exploring a topic that until recently belonged mostly to science fiction: humanoid robots designed for military environments.

IITD_research

March 12, 2026
The partnership will focus on research areas that support the future of mobility and engineering systems. These include quantum technologies, future materials, neuromorphic engineering and electric mobility.

Hungary-2026

February 23, 2026
German sensor manufacturer SICK has inaugurated a capacity expansion at its site in Kunsziget, Hungary, following a EUR 30 million investment that has created more than 300 new jobs.

Switzerland_1

February 19, 2026
Switzerland is regularly described as one of the world’s most innovative economies. In the Global Innovation Index, the country has repeatedly ranked first, ahead of much larger industrial nations. This position reflects a combination of high R&D intensity, strong patent activity and a dense network of research-performing companies. Yet these aggregate indicators say relatively little about how innovation is structured in practice, and even less about the position of electronics within the Swiss economy.

RWS-CAVS

February 06, 2026
Kongsberg Defence & Aerospace has signed a contract with Patria for the delivery of Protector Remote Weapon Stations (RWS) to the German and Swedish Common Armoured Vehicle System (CAVS) 6x6 programme.

logos-on-buildings

February 04, 2026
Infineon Technologies has entered into an agreement to acquire the non-optical analog and mixed-signal sensor portfolio from ams OSRAM Group for EUR 570 million.

Office-Building-2025

February 04, 2026
Kongsberg Defence & Aerospace has been awarded a contract worth approximately NOK 16 billion (EUR 1.4 billion) to supply counter-unmanned aerial systems (CUAS) to Poland.

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