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TSMC ranks in Top10 in three wafer size categories
February 25, 2021
As of December 2020, only TSMC—the world’s largest foundry—was listed among the wafer capacity leaders in each of the three wafer size categories. It had the most 200mm wafer capacity last year and ranked second, trailing only Samsung, in 300mm wafer capacity.
Panthronics seals global partnership agreement with AdvanIDe
February 22, 2021
Panthronics AG, a fabless semiconductor company specialising in high performance wireless technology, has signed a global partnership agreement with specialist supplier of NFC, RFID and smart card components, AdvanIDe.
Mitsubishi Electric to open new factory automation centre
February 17, 2021
Mitsubishi Electric Corporation will establish the Malaysia FA Center on the premises of its subsidiary Mitsubishi Electric Sales Malaysia Sdn. Bhd., which is located in Selangor state on the west coast of Peninsular Malaysia.
Harwin addresses growing demand in Asia with expansion
February 05, 2021
To address the growing customer base in Asia, the UK-based connector manufacturer announces that it has invested in its Singapore regional headquarters.
Leuze expands with new plant in Malaysia
January 29, 2021
To meet the demand in the Asian markets, Leuze is currently constructing a new plant in Malacca, Malaysia, scheduled for completion in the first quarter of 2022.
The world's top 10 automated countries
January 28, 2021
The average robot density in the manufacturing industry hit a new global record of 113 units per 10'000 employees.
Tobey Gonnerman named Fusion Worldwide's new President
January 21, 2021
The global sourcing distributor announces that Tobey Gonnerman has been appointed as the company’s new President.
A2 Global expands with new facility in Singapore
January 14, 2021
Electronic component distribution and supply chain service provider, A2 Global Electronics, announces the opening of its new distribution facility located in the New Tech Park area of Singapore.
UTAC completes acquisition of Singapore wafer bumping assets
January 12, 2021
UTAC Holdings Ltd. says that its affiliate has completed its purchase of the Singapore-based wafer bumping assets from Powertech Technology (Singapore) Pte. Ltd.
Appear partners with Foxconn on new smartphone
January 08, 2021
Appear Inc. is launching the worlds first graphene battery-powered 5G Smartphone, and to meet expected demand the company has partnered with with Foxconn India.
Soitec looking to attract new talent – creating 100 new jobs
January 05, 2021
Semiconductor materials specialist, Soitec, is continuing its growth path and launches a company-wide job creation program called ELEVATE.
QuantuMDx invests millions on scale-up to mass manufacture
December 30, 2020
Newcastle-based QuantuMDx announces that it has invested over GBP 11 million to scale up production of its flagship diagnostic device, Q-POC and disposable test cassette, to mass manufacture.
Infineon plans to make Singapore its global AI innovation hub
December 04, 2020
The German chip-giant is celebrating its 50th anniversary in Singapore announcing plans to make the country its AI innovation hub as it moves forward with its digital transformation.
Ontic acquires Aircraft Instruments product line from Flightline Electronics
November 23, 2020
Ontic, an aerospace industry provider of ‘Extended Life Solutions’ for OEM legacy products, has acquired the manufacturing rights of four aircraft instruments from Flightline Electronics Inc, a subsidiary of Ultra Electronics.
Ayar Labs raises $35M as interest in optical I/O grows
November 10, 2020
Ayar Labs managed to raise USD 35 million as it completed a Series B financing co-led by Downing Ventures and BlueSky Capital. New investors include Applied Ventures, LLC, Castor Ventures, Downing Ventures (U.K.), and SGInnovate (Singapore).
To feed the demand for 5G RF solutions, GF and Soitec ink supply agreement
November 06, 2020
GlobalFoundries and Soitec have entered into a multi-year supply agreement for 300mm radio frequency silicon-on-insulator (RF-SOI) wafers.
WiMi subsidiary VIYI Technology to acquire Fe-da Electronics
November 06, 2020
WiMi Hologram, an AR service provider in China, says that its wholly-owned subsidiary, VIYI Technology has entered into a framework agreement to acquire 100% equity interests of Fe-da Electronics, a provider of IoT solutions based in Singapore.
STMicro sets up ‘Lab-in-Fab’ to advance adoption of piezoelectric MEMS
October 28, 2020
The company says it is partnering with A*STAR’s IME, a research institute in Singapore, and Japanese manufacturing-tool vendor ULVAC, to jointly setup and operate an 8-inch (200mm) R&D line focused on Piezo MEMS technology within ST’s existing manufacturing facility in Singapore.
Applied Materials and Besi to jointly develop chip integration technology
October 23, 2020
Applied Materials and BE Semiconductor Industries (Besi) says they aim to develop the industry’s first complete and proven equipment solution for die-based hybrid bonding, an emerging chip-to-chip interconnect technology that enables heterogeneous chip and subsystem designs for applications including high-performance computing, AI and 5G.
Airbus Ventures invests in Singapore startup
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October 22, 2020
Airbus Ventures latest investment has led the company to Singapore and Zero Error Systems (ZES).
