Imagination and BAIC Capital creates automotive joint venture
May 14, 2020Imagination Technologies and BAIC Group Industrial Investment (BAIC Capital), have signed a joint venture agreement to initiate the establishment of an automotive fabless semiconductor company.
Tachyum opens new EU headquarters in Slovakia
April 08, 2020The semiconductor startup has opened a new European Union headquarters to address the regional needs of its growing number of customers, partners, vendors throughout the EU.
1Q/20 Graphics DRAM price sees sharp upturn
December 31, 2019Server DRAM prices are expected to lead the uptrend in 1Q20 DRAM prices because the supply has been constrained by unstable yield rates of 1Xnm processes.
Spot prices see sharp upturn
December 16, 2019DRAM spot prices have begun to rebound, in turn improving the overall DRAM market sentiment, and memory component buyers in the contract market will be induced to raise their inventories as well. Contract prices are expected to rally as early as 1Q20.
Samsung’s CPU project ends, layoffs in CA and TX
November 06, 2019Samsung has confirmed in a letter to the Texas Workforce Commission that layoffs as a result of the closure of the CPU project at the Samsung R&D Center (SARC) in Austin, Texas and the San Jose Advanced Computing Lab (ACL) in San Jose, California, will begin December 31.
NVIDIA leads way but competition is intensifying
October 15, 2019Diversity is the name of the game when it comes to the edge Artificial Intelligence (AI) chipset industry. In 2019, the AI industry is witnessing the continual migration of AI workloads, particularly AI inference, to edge devices, including on-premise servers, gateways, and end-devices and sensors.
US-China trade impacts global top ten IC design companies
September 05, 2019The global top ten IC design companies for 2Q19 ranked by revenue have just been released by TrendForce, in which we see revenues of the top five all falling YoY.
U-M funds robust in-memory computing system, MemryX
February 26, 2019The University of Michigan has pledged USD 2.75 million into four U-M startups with potential funding of up to USD 20 million through subsequent financing rounds.
Top 10 fabless IC design houses
November 22, 2018TrendForce announced the ranking of top 10 fabless IC design houses worldwide based on their revenues for 3Q18, among which Qualcomm was the only one to post a slight decline.
Innodisk enters alliance to bring AIoT into the spotlight
October 31, 2018Innodisk, along with partners and its four subsidiaries, are expanding into to the sectors where IoT intersects with AI to reach previously untapped potential.
Sponsored content by KontronKontron introduces COMe-cVR6 (E2) Module with new AMD Ryzen™ Embedded V1000 Processor Kontron, a leading global provider of IoT/Embedded Computer Technology (ECT), introduces its new COMe-cVR6 (E2) Module in the COM Express® Compact Type 6 form factor. It is based on the new AMD Ryzen™ Embedded V1000 processor, which sets the benchmark for high-end embedded computer modules. The COM Express® Compact module's smaller form factor significantly saves space in comparison to most comparable solutions, allowing developers to create more compact designs with higher performance. Variants of the COMe-cVR6 (E2) are also resitant to vibration and shocks thanks to their permanently soldered memory, just as all other components, such as voltage dividers, capacitors, and controllers are selected for highest resistance to environmental stresses. The new COM Express® module is particularly suitable for applications in harsh environments, medical or industrial image processing systems, as well as complex automation systems.
Micron begins volume production of GDDR6 high performance memory
June 29, 2018Micron Technology, Inc. begins mass production for 8Gb GDDR6 memory, delivering significant performance improvements over the fastest available GDDR5 designs.
Mike Rayfield and David Wang join AMD
January 24, 2018AMD has appointed Mike Rayfield as senior vice president and general manager of AMD Radeon Technologies Group (RTG), and David Wang as senior vice president of engineering for RTG.
From heading graphics at AMD to Intel
November 10, 2017Intel has hired a true AMD veteran, Raja Koduri, as its new chief architect, senior vice president of the newly formed Core and Visual Computing Group, and general manager of a new initiative to drive edge computing solutions.
What are the iPhone 8 Plus top cost drivers?
September 26, 2017The new Apple iPhone 8 Plus, equipped with 64 gigabytes (GB) of NAND flash memory, carries a bill of materials (BOM) cost that comes out to USD 288.08 higher than any previous versions of the company’s smartphones, according to a preliminary estimate from IHS Markit.
Vicor’s Power-on-Package enables higher performance for AI processors
September 11, 2017Vicor Corporation today announced the introduction of Power-on-Package modular current multipliers for high performance, high current, CPU/GPU/ASIC (“XPU”) processors.
MIPS I6500-F, CPU IP designed for safety critical systems in an autonomous age
June 28, 2017Imagination Technologies (IMG.L) announces a highly-scalable 64-bit MIPS multiprocessing solution that has been stringently assessed and validated to meet functional safety (FuSa) compliance for ISO 26262 and IEC 61508 standards.
Sondrel acquire IMGworks division of Imagination TechLoad more news
May 17, 2017Sondrel has signed an agreement to acquire the IMGworks division of Imagination Technologies.