ROHM launches isolated gate driver IC optimized for high-voltage GaN devices
June 27, 2025
When combined with GaN devices, this driver, BM6GD11BFJ-LB, enables stable operation under high-frequency, high-speed switching conditions, contributing to greater miniaturization and efficiency in high-current applications.
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Advanced chip capacity to surge 69% by 2028 on AI demand
June 26, 2025
The global semiconductor industry is expected to significantly expand its advanced manufacturing capacity through 2028, driven by accelerating demand for artificial intelligence applications, according to SEMI’s latest 300mm Fab Outlook report.
Mindgrove partners with Bosch to enhance chip design solutions
June 26, 2025
Indian fabless firm Mindgrove will provide Bosch with chips and boards for field deployment and testing, supported with engineering and logistics assistance. Data generated from these deployments will be used for improvements.
Continental launches semiconductor unit, partners with GlobalFoundries
June 24, 2025
Continental's Automotive Group Sector has established a new internal unit — Advanced Electronics & Semiconductor Solutions (AESS) — to design and verify application-specific semiconductor circuits, as the company prepares for its planned spin-off into the standalone entity Aumovio.
Plug and Play partners with Synopsys to expand chip ecosystem program
June 23, 2025
By providing startups with access to professional-grade EDA tools, which often represent a significant investment at the early stage, Plug and Play and Synopsys aim to help lower the barrier to chip innovation, accelerate time to market, and reduce development costs across the chip design space.
Claus Aasholm on the ripples and tsunamis in the chip supply chain
June 23, 2025
“This tide does not lift all boats” – Aasholm warns of structural industry shifts driven by AI, geopolitics and China’s quiet semiconductor conquest.
Report: Apple considers using AI to design its chips
June 20, 2025
Johny Srouji, Apple’s senior vice president of hardware technologies, said one of the key lessons the tech giant learned was that it needed to use the most cutting-edge tools available to design its chips.
GCT partners with Iridium to integrate NTN DirectSM service into chipset
June 20, 2025
GCT and Iridium will work together to expedite the development of a new Iridium network-enabled Narrowband Internet of Things (NB-IoT) chipset based on requirements for 3GPP Release 19.
TI to invest $60 billion is US manufacturing expansion
June 18, 2025
Texas Instruments plans to invest more than USD 60 billion in US-based semiconductor manufacturing, marking what the company describes as the largest investment in foundational chip production in US history. The investment spans seven fabs across three major sites in Texas and Utah and is expected to support more than 60,000 new jobs.
New layoffs coming to Intel, memo reveals up to 20% job cuts globally
June 18, 2025
Intel plans to lay off between 15% and 20% of its factory workforce, according to an internal memo obtained by The Oregonian. The cuts are expected to begin in July and result in several thousand job losses worldwide.
Sparc Foundry secures €17.2M public funding for photonic chip plant
June 18, 2025
Sparc Foundry, a Spanish startup focused on photonic semiconductors, has received a EUR 17.2 million capital injection from the Spanish Society for Technological Transformation (SETT). The funding has been approved by the Council of Ministers under the national PERTE Chip initiative and represents 43.9% of the company's capital expansion.
Applied Materials and CEA-Leti expand joint lab
June 17, 2025
Applied Materials and CEA-Leti have entered what they call the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors. Under a memorandum of understanding (MOU), the companies plan to expand their joint lab and develop materials engineering solutions to address emerging infrastructure challenges in AI data centres.
InCore unveils SoC generator: from idea to FPGA validation in minutes
June 17, 2025
At the heart of this innovation is Indian fabless semiconductor startup InCore’s SoC Generator, a powerful automation platform built to radically simplify and accelerate SoC development.
Taiwan adds China’s Huawei and SMIC to export control list
June 16, 2025
The two Chinese companies, who are already on a US trade blacklist, have been put on Taiwan’s “Strategic High-Tech Commodities Entity List” together with many of their international subsidiaries.
TSMC, University of Tokyo open joint lab to boost chip research
June 16, 2025
Together, TSMC and UTokyo aim to promote cutting-edge research and development in semiconductor technologies, generate innovative solutions, and cultivate semiconductor talent.
MIPS partners with Cyient to enhance RISC-V-based intelligent power solutions
June 13, 2025
The partnership will focus on enabling real-time, safety-critical applications, power delivery, and compute efficiency in demanding platforms for automotive, industrial and data center markets.
Trump's first onshoring win isn’t the iPhone – it's the AI server
June 12, 2025
As Nikkei Asia reports in a new investigation, the US is quietly assembling a domestic supply chain for one of the most complex machines in the world: the AI server. And while Apple has resisted political pressure to move iPhone production onshore, a host of data centre suppliers – including Foxconn, Wistron, TSMC and SK Hynix – are rapidly expanding their US footprint to serve customers like Nvidia, Microsoft and Amazon.
NXP reportedly to close four 8-inch fabs in shift toward 12-inch production
June 11, 2025
NXP Semiconductors is reportedly planning to shut down four of its 8-inch (200mm) wafer fabrication plants – one in the Netherlands and three in the United States — as part of a strategic transition to 12-inch (300mm) wafer production.
Sony to release stacked SPAD depth sensor for automotive LiDAR applications
June 11, 2025
The new sensor product employs a dToF pixel unit composed of 3×3 (horizontal × vertical) SPAD pixels as a minimum element to enhance measurement accuracy using a line scan methodology.
SEMI: Global chip equipment billings up 21% in Q1 2025
June 10, 2025
Global semiconductor equipment billings reached USD 32.05 billion in the first quarter of 2025, marking a 21% increase compared to the same period in 2024, according to the latest Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report published by SEMI.
Sustainability and market dynamics at Evertiq Expo Berlin 2025
June 09, 2025
As the curtains close on Evertiq Expo Berlin 2025, it’s clear the expo was a success – hosting 82 exhibiting companies and welcoming 198 visitors from 136 different companies. In total, the expo attracted a total of 387 participants exploring technology trends and discussing industry challenges.
GENESIS project launches to steer Europe towards sustainable chipmaking
June 09, 2025
With a budget of close to €55 million, GENESIS will drive innovative solutions in emission control, eco-friendly materials such as alternatives to PFAS-based ones, waste minimization, and raw material reuse.
Tata Electronics partners with BEL to bolster India’s chip ambitions
June 09, 2025
Tata Electronics and Bharat Electronics Limited (BEL) will explore collaboration opportunities to identify fab, OSAT and design services solutions from Tata Electronics based on the current and future requirements of BEL.
Siemens expands OSAT Alliance to boost US chip supply chains
June 06, 2025
Mosaic Microsystems will use Siemens‘ EDA technologies to develop ADKs for its thin glass substrate technology, while NHanced Semiconductors will employ Siemens EDA tech to develop ADKs for their silicon interposer-based tech.
Air Liquide’s gas supply deal with VSMC to boost Singapore’s chip industry
June 03, 2025
Strategically located within the Tampines Wafer Fab Park, one of Singapore’s four key wafer fabrication hubs, the new facility will bolster Singapore’s position as a global semiconductor powerhouse.
IIT Kharagpur, A*STAR team up to advance semiconductor innovation
June 02, 2025
The MoU opens new avenues for joint research in advanced CMOS and post-CMOS technologies; heterogeneous integration and packaging; AI hardware accelerators; next-generation memory systems; photonics and quantum devices; and chip reliability, thermal management and failure analysis.
Celtonn bags ESA contract to develop chip hardware for satellites
June 02, 2025
As the project lead, Celtonn will develop a high-linearity, low-noise amplifier (LNA) for V-band feeder uplink — a key enabler for next-generation satellite communication payloads.
U.S. imposes new export restrictions on chip design software to China
May 30, 2025
The United States has instructed a wide range of companies to halt shipments of various products to China without a license, and has revoked previously issued licenses for certain vendors, according to a report from Reuters.
TSMC to launch European chip design centre in Munich
May 27, 2025
Taiwanese semiconductor giant TSMC is preparing to strengthen its European presence with the opening of a new design centre in Munich, Germany.
Report: Nvidia to launch cheaper Blackwell AI chip for China
May 26, 2025
The GPU, which will feature Nvidia’s new generation Blackwell-architecture AI processors, may be priced between USD 6,500 and USD 8,000, significantly below the USD 10,000-USD 12,000 the H20 sold for, Reuters reports.
Lightshift to build Vermont’s largest energy storage project
May 26, 2025
Chip manufacturer GlobalFoundries will use Lightshift Energy’s 16MW/52MWh system for peak shaving by storing electricity during periods of low demand and discharging it during peak times to alleviate grid stress.
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