AI infrastructure boom reshapes electronics supply chain, says in4ma July 29, 2026 The unprecedented wave of investment in artificial intelligence infrastructure is transforming the global electronics supply chain, with growing consequences for PCB manufacturers, material suppliers and OEMs worldwide. According to new research from in4ma and EMSNOW, demand generated by hyperscale data centre operators is driving up PCB prices, stretching lead times and redirecting manufacturing capacity towards AI applications.
AI data centres are consuming PCBs – Chinese lead times stretch to 2028 July 28, 2026 In an interview with Evertiq, Didrik Bech, board member of PCB supplier Confidee, described how the AI infrastructure boom is creating an unprecedented demand for materials, resulting in supply shortages that could reshape market conditions across several European industries.
EMS provider EC Electronics acquires Fastlink Data Cables July 28, 2026 Fastlink Data Cables is known for manufacturing high-quality cable assemblies and box build solutions, with particular expertise in supporting data centre critical power and cooling applications alongside long-established defence and aerospace programmes.
Nvidia, Amkor sign $1.5 billion chip packaging agreement July 24, 2026 Nvidia and Amkor Technology will align their long-term roadmaps to advance technologies including high-density interconnects and next-generation heterogeneous integration.
NIELIT, SCL collaborate to advance chip innovation in India July 24, 2026 As part of this collaboration, the 1.2 µm Process Design Kit will be made available through eChipHub, and provide students, researchers, faculty members, startups, MSMEs and industry professionals with access to an indigenous semiconductor process technology for IC design and prototyping.
University of Arizona, TU/e expand semiconductor, photonics cooperation July 24, 2026 The University of Arizona and the Eindhoven University of Technology in the Netherlands have signed a five-year MOU to align education and research activities with the needs of a rapidly growing semiconductor sector.
Air Products to expand gas supply network for chip manufacturer July 23, 2026 Air Products will supply a range of industrial gases, including nitrogen, oxygen, argon and helium, to support the customer’s semiconductor operations in Taiwan.
Stop lobbying, start listening: Better policy begins with a conversation July 22, 2026 In late June I spent a full day in Brussels, moderating a room full of speakers, panelists, policymakers and manufacturers, all there to talk about the future of European electronics. By the end of it, one thing was obvious. Everyone in that room agreed the industry matters. Almost nobody disagreed about the stakes. And yet agreement is not the same as alignment, and the gap between "we support you" and "here is what we will actually do" is exactly where good intentions tend to disappear.
Paras to set up $644 million chip packaging facility in India July 22, 2026 Paras Semiconductors, a subsidiary of Indian company Paras Defence and Space Technologies, has signed an MOU with the Madhya Pradesh government’s department of science and technology to jointly set up an OSAT facility in the state’s Indore-Ujjain region.
Wistron opens Texas facility to produce Nvidia AI systems July 22, 2026 The 324,000-square-foot plant in Fort Worth, Texas produces Nvidia Grace Blackwell Ultra and will produce Vera Rubin Superchips — part of a combined USD 700 million investment in advanced American manufacturing by the US chipmaker.
ChipAgents, AWS to advance AI-powered semiconductor engineering July 21, 2026 Joining the AWS Partner Network will help ChipAgents continue scaling its platform as it supports semiconductor companies looking to improve engineering productivity and accelerate development cycles.
Electronic components market: A crisis gathering momentum July 20, 2026 Artificial intelligence, geopolitical tensions, rising raw material prices, and increasingly longer delivery times create a combination of factors that could make life much more difficult for electronics manufacturers.
TSMC pledges another $100 billion to expand US chipmaking capacity July 17, 2026 The Taiwanese chip giant’s announcement comes after it posted a 77% hike in second-quarter profit to a record high of USD 22 billion, beating market forecasts.
Intel uses next-gen ASML tool to produce its laptop chips July 15, 2026 Intel Foundry has entered high-volume manufacturing for a subset of Intel Core Ultra Series 3 processors, code-named Panther Lake, using ASML’s EXE High NA EUV technology.
Samsung begins mass production of PM1763 SSD July 14, 2026 Featuring high-speed data transfer and an optimized controller architecture, PM1763, the company’s PCIe 6.0-based enterprise SSD, is expected to serve as a key storage solution for high-performance AI platforms.
QD raises €91 million to scale next-generation chip inspection July 13, 2026 Founded in 2022 as a spin-out of the Technical University of Munich, QuantumDiamonds (QD) will use the funding to deliver lab systems to leading chipmakers and advance wafer-level capabilities for high-throughput fab inspection.
CCRAFT raises $7.8 million to scale photonic chip manufacturing July 06, 2026 The proceeds will support the Swiss company’s ambitious technical roadmap towards an industrialized production line, unlocking additional manufacturing capacity to serve key Tier-1 customers.
Report: $13 billion outlay for India Semiconductor Mission 2.0 cleared July 03, 2026 India Semiconductor Mission 2.0 will be geared towards strengthening the entire semiconductor value chain, including chip design, fabrication and packaging.
Kimball Electronics acquires Dutch medical CDMO Helvoet July 02, 2026 US electronics manufacturer Kimball Electronics has acquired Helvoet Polymer Technologies B.V., a Dutch contract development and manufacturing organisation specialising in micro-molding and precision injection molding for medical applications. The purchase price is EUR 90 million, or approximately USD 103 million.
Kurita, Membrane establish JV to cater to Indian chip industry July 02, 2026 Japan’s Kurita Industries provides a range of water treatment solutions for the electronics industry, including semiconductors, in Japan, East Asia, North America and Europe, which is essential for their manufacturing processes.
Fujifilm partners with Gujarat to boost chip materials manufacturing July 01, 2026 Fujifilm India aims to assess opportunities to establish a semiconductor materials production base in Dholera, Gujarat, while working closely with government stakeholders, industry bodies and private enterprises to strengthen a semiconductor supply chain.
IBM debuts ‘world’s first’ sub-1 nanometer chip technology June 29, 2026 IBM’s new sub-1 nm chip packs nearly 100 billion transistors onto a chip the size of a fingernail, nearly twice the density of IBM’s 2 nm chip, unveiled in 2021.
SK keyfoundry develops Bi-SCR-based On-Chip EMC protection tech June 29, 2026 While conventional ESD protection devices were primarily limited to controlling momentary discharges during chip manufacturing or assembly processes, the new technology enables complete on-chip control of harsh system-level EMC environments.
Quantum tech firm Aegiq opens new headquarters in Sheffield June 26, 2026 The UK startup’s goal is to deliver quantum computers at scale based on photonics, leveraging chip manufacturing supply chains, working with industry leaders to deliver real-world impact in advanced manufacturing, defence, clean energy and healthcare.
EU clears €76 million German state aid for QuantumDiamonds June 24, 2026 The European Commission has approved EUR 76 million in German state aid for QuantumDiamonds GmbH to establish a semiconductor testing equipment facility in Munich, Germany. The facility will be the first in the EU to produce semiconductor metrology and inspection systems based on quantum sensing.
QCi acquires NHanced in deal valued at up to $145 million June 24, 2026 By adding semiconductor and nanophotonics fabrication capabilities, advanced packaging expertise and specialized engineering talent, QCi is strengthening its operational capabilities and manufacturing readiness.
Brewer to acquire Heraeus Epurio’s semiconductor chemical business June 19, 2026 The acquisition expands Brewer Science’s advanced materials portfolio and strengthens its ability to support semiconductor customers with highly specialized, ultrapure chemical solutions critical to advanced lithography and microdevice fabrication.
Imec unlocks system-level III-V chiplet integration on Si-CMOS June 18, 2026 By combining high-density embedded capacitors, a scalable modeling framework for passive components, and laser-assisted bonding for III-V chiplet assembly, the platform lays the foundation for next-generation wireless (mmWave and sub-THz) systems.
QBit Semiconductor acquires 60% stake in Singapore’s SinChip June 17, 2026 This move will complement QBit’s existing high-performance SoC platforms, boosting its ASIC design services capability and amplifying the Taiwanese company’s market layout across Edge AI, HPC, optical communications and automotive sectors.
Rapidus, Fondazione Chips-IT sign MoU to boost chip manufacturing June 17, 2026 The joint effort with the Fondazione Chips-IT builds on Japan and Europe semiconductor cooperation. Rapidus has also signed an MOU with the UK Semiconductor Centre, a national body promoting the semiconductor industry in the UK.
Air Liquide invests €200M in Korea to back SK hynix’s AI chip project June 16, 2026 In order to supply SK hynix’s new packaging and testing fab “P&T7”, located in Cheongju, in the Chungcheongbuk province, Air Liquide will build and operate a state-of-the-art nitrogen production unit.
Cadence unveils fully autonomous virtual engineer for chip design June 15, 2026 Built on Cadence’s AI-driven electronic design automation (EDA) portfolio with Nvidia Nemotron models, and secured by Nvidia OpenShell runtime, the new agentic capabilities enable customers to run dynamic simulations in automated workflows.