Evertiq - First In Electronics News & Expo

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Singapore_facility

June 12, 2026
The facility is positioned as a dedicated commercial-scale LED Chip-on-Board (CoB) packaging unit and is expected to create approximately 50 high-value engineering and manufacturing roles in Singapore over five years.

Samueli_semiconductor_hub

June 08, 2026
The mission of the semiconductor hub is to foster sustained collaboration between leading faculty and industry partners Broadcom, Applied Materials, GlobalFoundries, Meta and Synopsys to drive advances in connectivity, computing and intelligent systems.

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Nanopower_agreement

June 08, 2026
Norwegian company Nanopower Semiconductor’ nPZero Gen1 power management IC extends system lifetime by reducing the load on the main MCU. The agreement aims to reduce IoT power and increase battery life for UK and EU customers.

Intel-deal-2026

June 05, 2026
Foxconn and Intel are teaming up to jointly develop and deploy next-generation AI infrastructure and intelligent computing platforms, combining Intel's processor and silicon capabilities with Foxconn's manufacturing scale and system integration expertise.

axonite_chip

June 05, 2026
The technology combines micro-scaled opto-semiconductor chips capable of 12V single-chip operation with a high-voltage (HV) driver technology, enabling a reduction of more than 10% in the number of driver-related components used in hybrid and electric vehicles.

pcb

June 03, 2026
The war in the Middle East has disrupted supplies of raw materials used in PCBs and pushed prices sharply higher, compounding cost pressures that were already building across the electronics industry, according to industry sources and executives cited by Reuters.

Yokaichi-and-Tome

June 03, 2026
Japanese component manufacturer Murata has broken ground on two new production buildings in Japan within the space of two weeks, adding to a capacity expansion programme that saw a third building completed in April. The new facilities will produce thermistors, chip inductors and noise suppression filters.

Marco-Mezger-2026

June 03, 2026
For years, memory sourcing followed a familiar logic. Buyers negotiated hard, and, when prices rose, trusted that the cycle would eventually rebalance. That approach worked – until it didn’t.

tsmc_chip_design

June 03, 2026
Nvidia CUDA-X libraries and AI models are accelerating TSMC workloads across lithography, transistor and process simulation, advanced process control and fab operations optimization.

PCB-India_2

June 01, 2026
The facility in the Indian state of Odisha will focus on advanced packaging glass core substrates, high-density interconnect substrates and associated semiconductor technologies, with Intel supporting technology know-how and process expertise.

Bloomington-Minnesota-manufacturing-facility

May 28, 2026
Less than a week after parent company Wingtech filed a CNY 8 billion lawsuit against its interim leadership in a Chinese court, Nexperia has announced a manufacturing partnership with US-based foundry Polar Semiconductor for the production of next-generation power MOSFETs.

geralt-computer-chip

May 28, 2026
The financing round was led by Accel, Factorial Funds, and Founders Fund, with participation from Conviction, Gigascale, 01A, Felicis, Buckley Ventures and 8VC, alongside existing backers.

He-Tingbo

May 27, 2026
At the IEEE International Symposium on Circuits and Systems in Shanghai on May 25, Huawei presented the Tau scaling law — a new principle for guiding semiconductor development that the company proposes as a replacement for Moore's Law, which has underpinned the industry for more than five decades.

Quantum_Wafer

May 27, 2026
The CHIPS incentive from the US Department of Commerce will support R&D efforts of a new IBM company, Anderon, which will operate as a 300-mm quantum wafer foundry. In addition to the USD 1 billion CHIPS incentive, IBM will contribute USD 1 billion of cash into Anderon.

PCB-India_3

May 26, 2026
The fresh funding will be deployed to advance the company’s product R&D roadmap across custom power semiconductors and custom ASSPs, build in-house chip validation and testing infrastructure, and support working capital requirements.

May 25, 2026
Currently, China’s most advanced proven chipmaking capability is believed to be around 7nm, and experts say 1.4nm is likely the global limit for advanced chipmaking around the end of the decade. So the Chinese tech giant’s claims could represent a breakthrough.

PCB-EU_1

May 25, 2026
Germany notified plans to support Zeiss’s ‘HNA@SCALE’ project, which will introduce and industrialise the next generation of EUV optical columns, and Zadient’s ‘Sic-Pro' investment project for the construction of a factory for SiC.

nexperia-4

May 25, 2026
The Nexperia dispute has taken a significant new turn. Parent company Wingtech Technology has filed a lawsuit against Nexperia and three members of its leadership team in a Chinese court, demanding CNY 8 billion (EUR 1 ‌billion) in damages and calling for the reversal of Dutch governance measures it characterises as discriminatory.

chip

May 19, 2026
The US company’s MLX200 platform integrates multi-level RRAM arrays with mixed-signal compute engines to enable high-throughput vector-matrix operations within memory, while maintaining compatibility with advanced CMOS processes.

Expo-KRK2026-01

May 18, 2026
On May 7, the Evertiq Expo Kraków 2026 trade show took place at Fabryczna 13. The event brought together 456 representatives from the European electronics industry and 48 exhibiting companies. Among the 291 registered visitors, the organizers noted a large number of new attendees representing companies that had not previously participated in Evertiq Expo.

PCB-India_1

May 18, 2026
The collaboration between the two companies will focus on deploying ASML’s holistic suite of advanced lithography tools and solutions for Tata Electronics’ upcoming 300 mm (12 inch) semiconductor fab in Dholera, Gujarat.

Guadalajara-mexico-plant

May 14, 2026
Connectivity specialist Molex has completed the acquisition of Teramount, an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimised for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.

PCB-India_2

May 14, 2026
HrdWyr develops chips for sectors such as consumer electronics, EVs, industrial systems and data centres. The funding will accelerate the development of the company’s AISoC products and expand customer engagements across key global markets.

acquires-Indesmatech

May 12, 2026
Semiconductor distributor Macnica ATD Europe has acquired Indesmatech, a pan-European technology advisory company specialising in semiconductor representation, design-in support and consulting.

Open-German-RD-Centre

May 12, 2026
Taiwanese power electronics manufacturer Delta has officially opened a new R&D centre in Soest, Germany, expanding its European innovation capacity with a focus on high-efficiency power solutions for AI data centres and electric mobility.

PCB-India_3

May 11, 2026
The fresh funds will be used to commercialise the Bengaluru-based fabless startup’s first system on chip SoC, scale product engineering, and boost partnerships across foundries, IP ecosystems and OEMs.

Arizona-2025

May 08, 2026
TSMC has released a video showcasing its semiconductor manufacturing operations in Arizona, offering a rare glimpse inside its expanding US production site, known as Fab 21.

May 08, 2026
The acquisition brings together Lattice’s low power FPGAs with AMI’s platform firmware and infrastructure manageability solutions for cloud and AI to create a complete portfolio of secure management and control solutions.

employees-in-cleanroom

May 06, 2026
US semiconductor equipment maker Applied Materials has entered into a definitive agreement to acquire the NEXX business from ASMPT, adding panel-level electrochemical deposition technology to its advanced packaging lineup.

racks

May 06, 2026
This alliance aims to address the surging demand in the inference market and set standards for high-performance, energy-efficient sovereign AI infrastructure.

soc_founders

May 06, 2026
The Swiss semiconductor startup builds integrated circuits that process visual and positional sensor data to give devices a real-time understanding of where they are and what’s around them.

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