Ecolab to acquire Ovivo’s electronics business for $1.8 billion
August 15, 2025
The acquisition will strengthen Ecolab’s high-tech growth engine by bringing together Ovivo’s ultra-pure water technologies with Ecolab’s leading water solutions, digital technologies and global service capabilities.
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Xanadu partners with DISCO to develop advanced wafer processing
August 15, 2025
This partnership focuses on enhancing wafer dicing processes, specialized wafer preparation for heterogeneous integration and assembly, as well as achieving ultra-smooth surfaces through polishing optimization.
Global semiconductor sales increase 7.8% from Q1 to Q2
August 14, 2025
Global semiconductor sales were $179.7 billion during the second quarter of 2025, an increase of 7.8% compared to Q1, reports the Semiconductor Industry Association (SIA).
Applied Materials to build $200M components plant in Arizona
August 14, 2025
Applied Materials says it will invest more than USD 200 million to build an advanced manufacturing facility in Chandler, Arizona, dedicated to producing components for semiconductor equipment.
US uses hidden trackers to monitor AI Chip shipments bound for China
August 14, 2025
US authorities have reportedly embedded concealed tracking devices in certain shipments of advanced AI chips to detect possible violations of export restrictions targeting China, according to sources cited by Reuters.
TSMC to phase out 6-inch wafer production
August 13, 2025
TMSC is planning to gradually phase out its 6-inch wafer production over the next two years, while consolidating its 8-inch wafer operations to enhance efficiency, Reuters reports.
indie Semiconductor to acquire emotion3D in $20 million deal
August 13, 2025
indie Semiconductor has agreed to acquire emotion3D GmbH, an Austrian developer of perception algorithms and software for in-cabin sensing, advanced driver assistance systems (ADAS), and automated driving, the companies announced.
EnSilica opens mixed-signal design centre in Budapest
August 12, 2025
UK-based chipmaker EnSilica has opened a new mixed-signal ASIC design centre in Budapest, Hungary, expanding its presence in the EU.
FuriosaAI closes $125M round to scale production of AI inference chip
August 11, 2025
The new funding will be used to accelerate mass production of Furiosa’s RNGD chip to support global enterprise customers and lay the groundwork for development of Furiosa’s next-generation chip.
Tokyo Electron fires employee suspected of stealing TSMC tech
August 11, 2025
The six people arrested on allegations of intellectual property theft at the Taiwanese chipmaker include a person identified by local media reports as a former employee of Tokyo Electron. The leaked information was reportedly related to TSMC’s most advanced 2-nanometer chip technology.
SIA: Hope tariff exemptions, trade deals ensure US chip leadership
August 08, 2025
President Trump said this week that he plans to impose 100% tariffs on imported semiconductors but indicated he would not charge companies that commit to making chips in the US.
onsemi to set up research centre for wide bandgap materials
August 07, 2025
onsemi plans to invest USD 8 million with Stony Brook University to establish a wide band gap research centre that will advance innovation in power semiconductors and foster the next generation of professionals in this field.
Coherent opens first datacom R&D centre in Penang
August 06, 2025
US-based photonics manufacturer Coherent has opened its first Datacom R&D centre in Malaysia, expanding its global footprint to advance optical transceiver technologies for AI and cloud computing.
A homemade crisis: Europe's EMS market shrank 14% in 2024
August 06, 2025
At Evertiq Expo Berlin, market analyst Dieter Weiss (in4ma) and Christoph Solka (IPC, today Global Electronics Association) took the stage once more — not to speak of promise and growth, but of collapse. With data from over 400 companies and biting commentary, the duo unpacked what they claim to be the worst year for Europe’s EMS industry in two decades — and a crisis entirely of the industry’s own making.
San’an and Inari to acquire Lumileds
August 05, 2025
San’an Optoelectronics and Inari Amertron Berhad have signed a definitive agreement to acquire 100% of the shares of Lumileds Holding B.V. and its European and Asian subsidiaries (Lumileds International).
SkyWater Technology announces IP license agreement with Infineon
August 04, 2025
This new IP enables customers to design and build high-reliability mixed-signal SoCs entirely within a secure US supply chain. It will be released through SkyWater’s S130 platform.
Rigaku launches XTRAIA XD-3300 mass production for chip market
August 01, 2025
XTRAIA XD-3300 is capable of performing of direct, non-destructive diffraction measurements of superlattice structures with the highest resolution on microscopic pads on wafers.
Teramount raises $50M to advance optical connectivity solutions for AI
July 31, 2025
Israeli company Teramount’s TeraVerse solution is a detachable, serviceable connector that links optical fibers coming from outside the rack to the silicon photonics chips inside Co-Packaged Optics (CPO) systems.
xLight raises $40 million to build powerful chip-making laser
July 28, 2025
This funding further enables Silicon Valley startup xLight to develop the world’s most powerful EUV free electron lasers (FEL), which has the potential to revolutionize advanced semiconductor manufacturing and unlock other critical economic and national security applications.
Tesla signs $16.5 billion chip contract with Samsung Electronics
July 28, 2025
The Samsung-Tesla deal comes at a sensitive time as South Korea is trying to reach a trade deal with the US after the Trump administration’s stated intention of imposing 25% tariffs.
$20M semiconductor research facility coming to Stony Brook University
July 28, 2025
As a result of the partnership, onsemi will invest USD 8 million to support the center’s operations, while Stony Brook University will invest USD 10 million in renovations and equipment. Empire State Development will support the new facility through a capital grant of up to USD 2 million.
Indian semiconductor startup Netrasemi raises $12 million in series A
July 25, 2025
Netrasemi is developing two Edge-AI chips: the A2000, an AI video analytics chip; and the R1000, a microcontroller for smart IoT sensors — both currently in the tapeout stage.
SK Hynix reports record jump in profit as demand for AI chips soars
July 24, 2025
SK Hynix reported a bigger-than-expected 68% jump in operating income in the June quarter. The South Korean chipmaker, a key supplier to AI giant Nvidia, said new model launches by customers would drive high-end AI chip demand growth, and that it was on track to double HBM chip sales for the full year.
Air Liquide starts molybdenum plant in Korea to support next-gen chips
July 24, 2025
Molybdenum is emerging as a promising replacement for the traditional chip manufacturing material tungsten. This new manufacturing facility will supply leading semiconductor customers with Air Liquide’s advanced materials offering Subleem.
INL to lead advancements in US semiconductor manufacturing
July 23, 2025
Idaho National Laboratory (INL) has been chosen to serve as the chief digital officer for the Semiconductor Manufacturing and Advanced Research with Twins USA Institute (SMART USA).
Wacker commissions €300M production line for chip-grade polysilicon
July 22, 2025
By virtue of the new production line, the German chemical company is increasing its production capacity for products that comply with the highest semiconductor-grade standards by more than 50 percent. This expansion in capacity will also create around 150 new jobs.
Air Liquide invests $50M to build gas plant for chipmaking in US
July 21, 2025
The French company is set to design, build and operate a new advanced production facility at the site of one of the world’s leading semiconductor manufacturers in southeastern United States.
Synopsys completes $35 billion acquisition of Ansys
July 18, 2025
The deal was 18 months in the making. United with Ansys, Synopsys can now deliver holistic system design solutions for customers in industries spanning semiconductors, high-tech, automotive, aerospace, industrial, and more.
Tata Electronics, Bosch to collaborate in electronics, chipmaking
July 18, 2025
Tata Electronics and Bosch intend to collaborate on chip packaging and manufacturing at Tata Electronics’ upcoming assembly and test unit in Assam and foundry in Gujarat.
Smartkem may team up with Manz Asia for AI chip packaging solutions
July 17, 2025
When finalized, the Joint Development Agreement (JDA) will focus on the co-development of next-generation dielectric ink solutions for advanced packaging manufacturing, particularly tailored for AI chip packaging applications.
Libra launches in-house high precision underfill capabilities
July 17, 2025
Underfill is typically a thermoset epoxy applied between semiconductor packages and PCBs or substrates. It delivers essential benefits: reinforcing solder-joint reliability, mitigating thermal expansion mismatches, improving thermal management, and enhancing mechanical durability.
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