ROHM releases level 3 SPICE models with enhanced simulation speed
July 10, 2025
ROHM’s earlier Level 1 SPICE models for SiC MOSFETs addressed this need by precisely replicating key device characteristics. However, challenges such as simulation convergence issues and prolonged computation times revealed the need for further refinement.
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Arrow launches Engineering Solutions Center in Bangalore
July 09, 2025
The newly established India ESC is designed to help innovators and technology manufacturers adopt advanced technologies such as edge computing, energy management, automation and e-mobility.
Arago raises $26M to slash AI energy consumption with new photonic chip
July 09, 2025
The heart of Arago's processor, codenamed “JEF,” is a proprietary photonic technology: instead of transistors, it uses lasers to process data with photons. The chip is designed to deliver 10× lower energy consumption than today’s leading GPUs at equivalent performance and cost.
Singapore launches innovation hub for gallium nitride semiconductors
July 08, 2025
The centre brings advanced GaN manufacturing capabilities to Singapore, positioning local innovators to compete in high-growth global markets such as advanced 5G and 6G communication systems, radars and satellite communications.
Anglia signs franchise agreement with Winslow Adaptics
July 08, 2025
Anglia Components adds IC sockets, adapters and semiconductor hardware from Winslow Adaptics, a UK-based designer and component manufacturer.
Toshiba develops tech to reduce losses in SiC trench MOSFETs, SiC SBDs
July 07, 2025
These advances are expected to greatly improve the reliability and efficiency of devices used in power conversion applications, such as electric vehicles and renewable energy systems.
Kaga Toshiba and Himeji Semiconductor introduce off-site PPA model
July 04, 2025
Toshiba Devices & Storage Group is promoting measures to advance the achievement of carbon neutrality. It aims to achieve net-zero greenhouse gas emissions from all its manufacturing sites by fiscal year 2030.
Indian startup Maieutic raises $4.15 million in seed funding
July 03, 2025
Maieutic’s platform addresses a traditionally slow and manual domain of semiconductor design by applying generative AI to automate early-stage development, detect bugs and optimize design trade-offs.
Parker Hannifin acquires Curtis Instruments for $1 billion
July 03, 2025
Curtis designs and manufactures motor speed controllers, instrumentation, power conversion and input devices that complement Parker’s strength in electric vehicle motors, hydraulic and electrification technologies.
Navitas partners with Powerchip for 200mm GaN production in Taiwan
July 02, 2025
Navitas Semiconductor has announced plans to start 200mm GaN-on-silicon production in collaboration with Powerchip Semiconductor Manufacturing Corporation (PSMC), marking a new phase in the company's supply chain and technology strategy.
TT Electronics achieves ISO 13485 certification at Mexicali facility
July 02, 2025
TT Electronics has announced that its EMS facility in Mexicali, Mexico, has been certified to the ISO 13485:2016 standard — an internationally recognised quality management system for medical device manufacturing.
Toshiba introduces 2-channel automotive high-speed digital isolators
July 02, 2025
The devices ensure the safety and reliability of the on-board charger (OBC) and battery management system (BMS) used in hybrid electric vehicles (HEVs) and electric vehicles (EVs).
Struggling US chipmaker Wolfspeed files for bankruptcy
July 01, 2025
Upon emergence from the process, it expects to have reduced its overall debt by about 70%, representing a reduction of USD 4.6 billion and a reduction of its annual total cash interest payments by approximately 60%.
Rigaku expands production facilities for semiconductor market
June 30, 2025
With the current expansion in production capacity, Rigaku has doubled the floor space of its assembly and inspection areas. The recent completion of a production facility in Yamanashi Prefecture boosts production capacity for core components such as X-ray generators and detectors.
From Gdańsk to Europe: Unisystem’s evolution in display innovation
June 30, 2025
At the turn of the 1980s and 1990s, many companies in Poland started their operations in conditions far removed from today's reality – no internet, limited access to components and technology, not to mention a lack of capital – what kept them running was often improvisation and sheer determination. Today, some of these companies are mature technology organisations, successfully competing in international markets.
ROHM launches isolated gate driver IC optimized for high-voltage GaN devices
June 27, 2025
When combined with GaN devices, this driver, BM6GD11BFJ-LB, enables stable operation under high-frequency, high-speed switching conditions, contributing to greater miniaturization and efficiency in high-current applications.
Nordic Semiconductor acquires Memfault
June 25, 2025
Nordic Semiconductor acquires its long-term partner, Memfault Inc., a cloud platform provider for large-scale deployments of connected products. Through the acquisition Nordic Semi takes the step from a hardware supplier to a complete solution partner.
Renu Electronics wins €7 million contract
June 25, 2025
Renu Electronics GmbH has secured a major contract worth EUR 7 million annually to supply electronic water metering solutions to an unnamed customer in the European market.
Cybersecurity in IoT: Mandatory from August 2025
June 24, 2025
From 1 August 2025, all new radio-connected devices entering the EU market must comply with strict cybersecurity standards. What does this mean, and how can manufacturers prepare? We explored the topic at Evertiq Expo Krakow 2025.
Wolfspeed moves to slash debt through bankruptcy plan
June 23, 2025
US-based semiconductor manufacturer Wolfspeed has entered into a restructuring agreement with key creditors that will significantly reduce its debt load and cash interest expenses. The company plans to implement a pre-packaged Chapter 11 bankruptcy filing in the near future.
LG Chem, Noritake co-develop paste for automotive power semiconductors
June 19, 2025
The silver paste co-developed by LG Chem and Noritake is a high-performance paste containing nano-sized silver (Ag) particles, combining LG Chem’s particle engineering technology with Noritake’s particle dispersion expertise.
TI to invest $60 billion is US manufacturing expansion
June 18, 2025
Texas Instruments plans to invest more than USD 60 billion in US-based semiconductor manufacturing, marking what the company describes as the largest investment in foundational chip production in US history. The investment spans seven fabs across three major sites in Texas and Utah and is expected to support more than 60,000 new jobs.
Flex CEO sees AI and healthcare as US manufacturing bright spots
June 18, 2025
The CEO of global electronics manufacturer Flex, Revathi Advaithi, sees the most optimism for US manufacturing in sectors tied to AI, data centres, and healthcare, while consumer electronics and automotive continue to face headwinds.
DRDO, IIT Delhi demonstrate free-space quantum secure communication over 1 km
June 18, 2025
Free-space Quantum Key Distribution (QKD) eliminates the need to lay optical fibers. The experiment attained a secure key rate of nearly 240 bits per second with a quantum bit error rate of less than 7%.
Applied Materials and CEA-Leti expand joint lab
June 17, 2025
Applied Materials and CEA-Leti have entered what they call the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors. Under a memorandum of understanding (MOU), the companies plan to expand their joint lab and develop materials engineering solutions to address emerging infrastructure challenges in AI data centres.
Nordic Semi acquires Neuton.AI
June 17, 2025
Nordic Semiconductor has acquired the intellectual property and core technology assets of Neuton.AI, a developer of fully automated TinyML solutions. The move is aimed at advancing Nordic's capabilities in edge AI, particularly in combination with the company’s nRF54 Series of ultra-low-power wireless SoCs.
TSMC, University of Tokyo open joint lab to boost chip research
June 16, 2025
Together, TSMC and UTokyo aim to promote cutting-edge research and development in semiconductor technologies, generate innovative solutions, and cultivate semiconductor talent.
MIPS partners with Cyient to enhance RISC-V-based intelligent power solutions
June 13, 2025
The partnership will focus on enabling real-time, safety-critical applications, power delivery, and compute efficiency in demanding platforms for automotive, industrial and data center markets.
Teltonika to triple output with four new manufacturing sites in Lithuania
June 12, 2025
Lithuanian electronics manufacturer Teltonika is significantly expanding its production footprint with the construction of four new factories, aiming to triple production by the end of 2025.
RIR expands manufacturing of 1200V SiC diodes in collaboration with PASC
June 11, 2025
Besides serving existing domestic Indian and US customers, shipping from Taiwan also provides improved access to strategic high-growth markets for SiC devices in the South East Asian region.
Orbic Electronics to build $110 million manufacturing hub on Long Island
June 11, 2025
Orbic Electronics Manufacturing has broken ground on a EUR 110 million advanced manufacturing facility in Hauppauge, Suffolk County. The project, which involves reshoring production operations from India and China, is expected to create over 1,000 high-tech and skilled jobs while retaining 66 existing positions.
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