Nexperia secures US manufacturing partner for power MOSFETs May 28, 2026 Less than a week after parent company Wingtech filed a CNY 8 billion lawsuit against its interim leadership in a Chinese court, Nexperia has announced a manufacturing partnership with US-based foundry Polar Semiconductor for the production of next-generation power MOSFETs.
Amkor acquires additional land in Arizona to expand advanced packaging campus May 28, 2026 US semiconductor packaging and test provider Amkor Technology has secured an additional 67-acre parcel of land adjacent to its existing campus in Peoria, Arizona, expanding its footprint for future advanced packaging and test capacity.
Zirconn launches SMT division in China May 28, 2026 Zirconn is expanding its manufacturing capabilities in China. The company has launched a new SMT assembly division aimed at increasing its capacity to deliver advanced electronic projects for customers in Europe and international markets.
Huawei proposes Tau Scaling Law as successor to Moore's Law May 27, 2026 At the IEEE International Symposium on Circuits and Systems in Shanghai on May 25, Huawei presented the Tau scaling law — a new principle for guiding semiconductor development that the company proposes as a replacement for Moore's Law, which has underpinned the industry for more than five decades.
Quectel expands EMEA reach with Future Electronics deal May 27, 2026 Quectel Wireless Solutions has entered into an expanded distribution partnership with Future Electronics to bring its full portfolio of products and services to customers across the EMEA region.
IBM announces US quantum chip foundry with $1B CHIPS support May 27, 2026 The CHIPS incentive from the US Department of Commerce will support R&D efforts of a new IBM company, Anderon, which will operate as a 300-mm quantum wafer foundry. In addition to the USD 1 billion CHIPS incentive, IBM will contribute USD 1 billion of cash into Anderon.
Cyient Semiconductors raises $30M in equity and debt funds May 26, 2026 The fresh funding will be deployed to advance the company’s product R&D roadmap across custom power semiconductors and custom ASSPs, build in-house chip validation and testing infrastructure, and support working capital requirements.
Huawei says it can deliver 1.4-nm equivalent chips by 2031 May 25, 2026 Currently, China’s most advanced proven chipmaking capability is believed to be around 7nm, and experts say 1.4nm is likely the global limit for advanced chipmaking around the end of the decade. So the Chinese tech giant’s claims could represent a breakthrough.
The next two years won't offer shortcuts – A memory market reality check May 25, 2026 Following his presentation at Evertiq Expo Zürich, Memphis Electronics' Nikolaos Florous had a conversation with Evertiq to go deeper on the market outlook. The short version: conditions will stay difficult, and procurement teams that haven't adapted yet are running out of time.
Axion Semiconductor acquires Texas firm Moov Technologies May 25, 2026 Moov's platform supports the sourcing and sale of semiconductor fabrication, packaging, test, EMS and SMT equipment, as well as surplus, idle and scrap tools.
Commission approves €288M German state aid for chip value chain May 25, 2026 Germany notified plans to support Zeiss’s ‘HNA@SCALE’ project, which will introduce and industrialise the next generation of EUV optical columns, and Zadient’s ‘Sic-Pro' investment project for the construction of a factory for SiC.
KKR sells Circor Aerospace to Parker Hannifin for $2.6 billion May 25, 2026 This combination of Parker Hannifin and Circor Aerospace brings together complementary capabilities, product portfolios, and platform exposures to create a stronger, more diversified aerospace and defense supplier with enhanced scale.
Evertiq Expo celebrated 15 years – in the city where it all began May 22, 2026 On 21 May, Evertiq Expo returned to Lund – the city where it all started. After several years at Malmö Arena, the event was back on home turf for its 15th anniversary, this time at Sparbanken Skåne Arena.
Lava plans to invest $114M in electronics components unit May 22, 2026 The Indian mobile phone company will manufacture key smartphone components such as display modules, camera modules, multilayer PCBs and enclosures in the country as part of its localisation strategy.
Avnet opens new integration facility in Singapore May 22, 2026 Located within Avnet’s existing Farnell Distribution Center in Singapore, the new integration facility is designed to support system, server, and rack build services, as well as international shipping.
Intuitive Machines to acquire Goonhilly Earth Station and COMSAT May 21, 2026 The acquisition, which will include the Goonhilly Lunar and Deep Space Communications, Commercial Satcom, and Defense and Security divisions, significantly expands global ground station resources and capacity on Intuitive Machines’ integrated space-to-ground network.
Analog Devices to buy Empower Semiconductor for $1.5 billion May 21, 2026 Empower’s silicon capacitors are already in production, and IVR programs are advancing in close collaboration with leading hyperscalers and AI silicon providers — capabilities ADI will accelerate through its scale, manufacturing and customer reach.
UK firm Quantum Motion raises $160 million in Series C May 20, 2026 The financing positions Quantum Motion to deliver utility-scale and commercially viable quantum computers that fit inside existing standard data centres and racks.
GE Aerospace to invest $10 million in Pune facility May 20, 2026 This latest investment builds on the USD 42 million announced over the last two years, bringing GE Aerospace’s total investment in the Pune (India) facility to more than USD 52 million over three years.
Are you overthinking semiconductor datecodes? May 20, 2026 The electronics industry has spent years learning to fear shortages, counterfeit components and end-of-life notices. But according to Ronny Nietzsche, Regional Sales Manager Nordic-Baltic Region at Rochester Electronics, another problem may be quietly shaping purchasing decisions — an outdated understanding of semiconductor date codes.
Evertiq Expo Lund: Strategies, security and the hardware Europe is missing May 19, 2026 Factories are being built, strategies are being written and investments are being made at a pace the electronics industry has not seen in decades. What is actually happening — and what is still missing — is the theme of this year's Expo in Lund.
TetraMem announces 22nm RRAM analog IMC SoC milestone May 19, 2026 The US company’s MLX200 platform integrates multi-level RRAM arrays with mixed-signal compute engines to enable high-throughput vector-matrix operations within memory, while maintaining compatibility with advanced CMOS processes.
Highlights from Evertiq Expo Kraków May 18, 2026 On May 7, the Evertiq Expo Kraków 2026 trade show took place at Fabryczna 13. The event brought together 456 representatives from the European electronics industry and 48 exhibiting companies. Among the 291 registered visitors, the organizers noted a large number of new attendees representing companies that had not previously participated in Evertiq Expo.
Tata Electronics, ASML sign MoU to boost India’s chip ecosystem May 18, 2026 The collaboration between the two companies will focus on deploying ASML’s holistic suite of advanced lithography tools and solutions for Tata Electronics’ upcoming 300 mm (12 inch) semiconductor fab in Dholera, Gujarat.
Sony, TSMC sign MOU to develop and manufacture image sensors May 15, 2026 Through the JV, both companies expect to leverage Sony's expertise in sensor design alongside TSMC’s strengths in process technology and manufacturing excellence as part of a broader collaboration aimed at enhancing image sensor performance.
Forge Nano delivers wafer fab equipment to leading firm May 15, 2026 Forge Nano’s TEPHRA platform will support development and manufacturing activities related to next-generation optical and photonics technologies used in high-speed communications and data infrastructure applications.
TSMC joins Applied Materials' EPIC Center as founding partner May 14, 2026 Applied Materials has announced a new innovation partnership with TSMC at its EPIC Center in Silicon Valley, where the two companies will co-develop materials, equipment and process technologies for next-generation semiconductor devices. TSMC becomes the latest company to join the platform.
Molex completes its acquisition of Teramount May 14, 2026 Connectivity specialist Molex has completed the acquisition of Teramount, an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimised for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.
Indian semiconductor startup HrdWyr raises $13 million May 14, 2026 HrdWyr develops chips for sectors such as consumer electronics, EVs, industrial systems and data centres. The funding will accelerate the development of the company’s AISoC products and expand customer engagements across key global markets.
Scanfil signs €25 million deal with industrial automation company May 13, 2026 Finnish EMS provider Scanfil has signed an agreement with an unnamed industrial automation company, part of a global technology group. The initial scope of the agreement represents a business volume of EUR 25 million.
Renesas completes acquisition of Greek Vision AI software firm Irida Labs May 13, 2026 Japanese semiconductor company Renesas Electronics has completed the acquisition of Irida Labs, a Greece-based company specialising in embedded software for AI-powered visual perception systems. The deal brings in-house a technology partnership that had already been in place between the two companies.
Global semiconductor materials market reached a record $73.2B in 2025 May 13, 2026 Global semiconductor materials market revenue increased 6.8% year-over-year to USD 73.2 billion in 2025, SEMI reports