Nvidia, Amkor sign $1.5 billion chip packaging agreement July 24, 2026 Nvidia and Amkor Technology will align their long-term roadmaps to advance technologies including high-density interconnects and next-generation heterogeneous integration.
NIELIT, SCL collaborate to advance chip innovation in India July 24, 2026 As part of this collaboration, the 1.2 µm Process Design Kit will be made available through eChipHub, and provide students, researchers, faculty members, startups, MSMEs and industry professionals with access to an indigenous semiconductor process technology for IC design and prototyping.
University of Arizona, TU/e expand semiconductor, photonics cooperation July 24, 2026 The University of Arizona and the Eindhoven University of Technology in the Netherlands have signed a five-year MOU to align education and research activities with the needs of a rapidly growing semiconductor sector.
Air Products to expand gas supply network for chip manufacturer July 23, 2026 Air Products will supply a range of industrial gases, including nitrogen, oxygen, argon and helium, to support the customer’s semiconductor operations in Taiwan.
Paras to set up $644 million chip packaging facility in India July 22, 2026 Paras Semiconductors, a subsidiary of Indian company Paras Defence and Space Technologies, has signed an MOU with the Madhya Pradesh government’s department of science and technology to jointly set up an OSAT facility in the state’s Indore-Ujjain region.
ChipAgents, AWS to advance AI-powered semiconductor engineering July 21, 2026 Joining the AWS Partner Network will help ChipAgents continue scaling its platform as it supports semiconductor companies looking to improve engineering productivity and accelerate development cycles.
Qolab secures $54M to advance scalable quantum systems July 21, 2026 The financing will support the US company’s continued development of scalable superconducting quantum computing technologies, expansion of semiconductor collaborations, and acceleration of its target toward fault-tolerant quantum computing.
Tower Semiconductor announces capacity expansion in Japan July 20, 2026 Track one adds new 300mm Silicon Photonics capacity, with full production readiness expected during the fourth quarter of 2027. It consists of repurposing the Arai facility for 300mm Silicon Photonics capacity and advanced packaging capabilities.
Electronic components market: A crisis gathering momentum July 20, 2026 Artificial intelligence, geopolitical tensions, rising raw material prices, and increasingly longer delivery times create a combination of factors that could make life much more difficult for electronics manufacturers.
Jabil opens next-gen intelligent logistics hub in Penang July 17, 2026 The digitalised facility is set to boost the company’s back-end operations and support customers’ growing product complexity and capacity demands using AI-enabled capabilities to streamline inventory management, enhance traceability and tracking and deploy autonomous robots.
TSMC pledges another $100 billion to expand US chipmaking capacity July 17, 2026 The Taiwanese chip giant’s announcement comes after it posted a 77% hike in second-quarter profit to a record high of USD 22 billion, beating market forecasts.
India approves $13.3 billion for fresh semiconductor push July 16, 2026 Companies involved in the manufacturing and R&D of the machines and manufacturing of materials, chemicals and gases that are essential for manufacturing semiconductors will be incentivized.
Intel uses next-gen ASML tool to produce its laptop chips July 15, 2026 Intel Foundry has entered high-volume manufacturing for a subset of Intel Core Ultra Series 3 processors, code-named Panther Lake, using ASML’s EXE High NA EUV technology.
10 years on – Brexit and the “new normal” July 15, 2026 A decade after the UK voted to leave the European Union, the EMS and CEM sector is still adapting to the consequences. Brexit realised many fears around supply-chain disruption, labour shortages and regulation, but it also accelerated structural change and pushed companies to modernise operations.
esmo marks 25 years, expands in Germany, China and Taiwan July 15, 2026 Today, the esmo Group employs approximately 285 people and generates annual revenue of around EUR 60 million through its two business divisions: semiconductor test solutions and special-purpose machinery.
Bosch announces $225 million funding deal with US government July 14, 2026 Bosch is investing up to $2 billion to transform the Roseville, California site into a facility that produces and tests SiC semiconductors with state-of-the-art processes and equipment.
Intel invests €5 billion to expand manufacturing in Europe July 14, 2026 Investment is expected to create permanent high-tech jobs and engage specialised tradespeople, while expanding leading-edge manufacturing capacity in Ireland.
Europe's PCB comeback is colliding with a supply chain that isn't ready July 13, 2026 Europe's printed circuit board industry is having a moment. Defence spending is up, AI is driving demand, and policymakers are finally talking about electronics as strategic infrastructure. But as I discovered in a recent EMS@C-Level conversation with Vytautas Ilgunas, Chief Commercial Officer at TLT PCB, and Raymond Goh, Chief Operating Officer at Confidee, the comeback is running headfirst into a supply chain that we spent the last two decades hollowing out. The demand is real. The capacity to serve it, particularly in materials, is not.
QD raises €91 million to scale next-generation chip inspection July 13, 2026 Founded in 2022 as a spin-out of the Technical University of Munich, QuantumDiamonds (QD) will use the funding to deliver lab systems to leading chipmakers and advance wafer-level capabilities for high-throughput fab inspection.
Sumitomo Chemical to establish JV with Samsung Electro-Mechanics July 13, 2026 The joint venture company will engage in the business of glass core substrates for advanced semiconductor packages. Glass core substrates are known for features like excellent rigidity, dimensional stability, low warpage and low thermal expansion.
Wolfspeed files patent infringement lawsuit against Navitas July 10, 2026 Products accused of infringement encompass major product lines of Navitas, including its GaN-based FETs — such as the GaNFast, GaNSlim, and GaNSafe product families — as well as Navitas's GeneSiC MOSFETs and SiCPAK modules. Navitas has refuted the allegations.
SandboxAQ wins $500M award to accelerate AI-led materials discovery July 10, 2026 The award under the US CHIPS and Science Act will accelerate the development and deployment of SandboxAQ’s AI-driven materials discovery platform to address critical semiconductor materials bottlenecks and supply chain risks.
LTSCT, Azuremoto to advance SiC, power semiconductor solutions July 10, 2026 The MoU establishes a structured framework for cross-border business cooperation across SiC power semiconductor products for the AI data centre market, and rectifiers and MOS-based power semiconductor products targeting LTSCT’s key business verticals.
It's gotten worse – and the memory market isn't done yet July 09, 2026 Two months ago, at Evertiq Expo Zürich, Nikolaos Florous left little room for optimism. Tight memory market conditions would persist, he said — and things would likely get worse before they got better.
Analog Devices completes acquisition of Empower Semiconductor July 08, 2026 The two companies had earlier announced that they had entered into a definitive agreement under which Analog Devices would acquire Empower in an all-cash transaction for USD 1.5 billion.
Europe holds a 2.5% share of a market it helped build July 08, 2026 New data from in4ma and EMSNOW puts the global EMS and ODM industry at USD 820 billion for 2025 – and Europe's share of that figure is shrinking in relative terms even as the continent's largest players post revenue growth.
Silex acquires Onsemi fab in Pennsylvania for $40 million July 07, 2026 Swedish MEMS foundry Silex Microsystems has entered into a binding agreement to acquire a 200mm semiconductor fab in Mountain Top, Pennsylvania, in the United States, from Onsemi. The purchase price is USD 40 million.
FOXTRON, MediaTek to advance intelligent vehicle experiences July 07, 2026 The MediaTek Dimensity AX C-X1 platform, which incorporates NVIDIA’s leading-edge GPU and advanced AI technologies, will be integrated into premium automotive solutions across the partners’ ecosystems.
Air Liquide invests over $170M to back SK hynix’s US fab July 03, 2026 Air Liquide will deliver large volumes of nitrogen, oxygen, argon, hydrogen and other industrial gases to SK hynix’s new cutting-edge advanced chips packaging facility.
Coherent receives $50 million CHIPS funding to expand InP fab in Texas July 03, 2026 Coherent has signed a letter of intent to receive up to USD 50 million under the US CHIPS and Science Act to expand its indium phosphide semiconductor manufacturing facility in Sherman, Texas. The expansion will double manufacturing space and quadruple wafer production capacity, and is expected to create more than 1,000 jobs.
Report: $13 billion outlay for India Semiconductor Mission 2.0 cleared July 03, 2026 India Semiconductor Mission 2.0 will be geared towards strengthening the entire semiconductor value chain, including chip design, fabrication and packaging.
Infineon opens €5 billion Smart Power Fab in Dresden July 02, 2026 Infineon Technologies has opened its Smart Power Fab in Dresden, Germany – described as the world's largest fab for power semiconductors and analog/mixed-signal technologies.