AT&S funds new microelectronics research group at TU Graz February 19, 2026 Austria-based AT&S is funding the establishment of a new microelectronics research group at Graz University of Technology (TU Graz), with a focus on IC substrates and advanced packaging technologies.
ChipAgents expands funding to $74M for AI-driven IC design February 19, 2026 US-based ChipAgents has raised USD 50 million in an oversubscribed Series A1 funding round, bringing its total capital raised to USD 74 million.
ams Osram to cut 2,000 jobs under new savings programme February 19, 2026 On February 10, 2026, ams Osram reported fourth-quarter revenue above the midpoint of its guidance and, at the same time, announced a new “Simplify” savings and transformation programme targeting EUR 200 million, which will affect around 2,000 employees globally.
Infineon: GaN market to reach USD 3 billion by 2030 February 18, 2026 German semiconductor manufacturer Infineon Technologies expects the gallium nitride (GaN) power semiconductor market to reach nearly USD 3 billion by 2030, according to the 2026 edition of its annual “GaN Insights” report.
Lam Research opens new Boise office to support US memory manufacturing February 18, 2026 US semiconductor equipment supplier Lam Research has opened a new office in Boise, expanding its presence in Idaho to support projected growth in domestic semiconductor manufacturing.
Invest International provides $60M loan to Nexperia for global expansion February 18, 2026 Invest International has signed a USD 60 million term loan agreement with Nexperia to support the company’s 2026 global production capacity expansion programme.
GF and Renesas deepen US chip production partnership February 17, 2026 US semiconductor foundry GlobalFoundries and Japanese Renesas Electronics have expanded their manufacturing partnership in a multi-billion-dollar deal aimed at increasing semiconductor production in the United States.
Intel backs away from manufacturing deal with Tower Semiconductor February 16, 2026 Tower Semiconductor has disclosed that Intel does not intend to proceed with a previously signed agreement to manufacture 300mm wafers for Tower’s customers at Intel’s facility in New Mexico.
ITRI breaks ground on advanced semiconductor R&D centre in Hsinchu February 15, 2026 Industrial Technology Research Institute (ITRI) has broken ground on a new Advanced Semiconductor R&D Centre at its headquarters campus in Hsinchu, Taiwan.
GigaDevice signs distribution agreement with SEMITRON for DACH region February 15, 2026 GigaDevice, a fabless semiconductor supplier, has signed a distribution agreement with German electronics distributor SEMITRON, expanding its sales and support footprint in the DACH region.
Applied Materials to pay $252 million over illegal exports to China February 13, 2026 Applied Materials has reached a settlement with the US Department of Commerce’s Bureau of Industry and Security (BIS) over alleged violations of export regulations. The company will pay USD 252.5 million, the second-highest penalty ever imposed by BIS.
Europe losing ground in semiconductor research February 13, 2026 Research and development in semiconductor technology is increasingly taking place outside Europe, particularly in Asia, according to a new analysis by EconPol Europe.
Camtek books $25m Hawk inspection system order from tier-1 IDM February 13, 2026 Camtek has received an order worth approximately USD 25 million for its Hawk inspection systems from a tier-1 integrated device manufacturer (IDM).
Global silicon wafer shipments rise in 2025, revenue declines February 12, 2026 Global silicon wafer shipments increased in 2025, while total wafer revenue declined slightly, according to year-end data from SEMI.
Samsung to join Applied Materials’ $5B EPIC semiconductor R&D centre February 12, 2026 Samsung Electronics will join Applied Materials’ EPIC (Equipment and Process Innovation and Commercialisation) Centre in Silicon Valley, a semiconductor research and development facility backed by a USD 5 billion investment.
Dutch court orders investigation into Nexperia governance February 12, 2026 The Dutch Enterprise Chamber has ruled that there are valid grounds to doubt proper management at semiconductor manufacturer Nexperia under its previous governance structure, the company said on February 11.
Okmetic Vantaa fab expansion enters volume production February 11, 2026 Okmetic has entered volume production at its expanded Vantaa facility in Finland, targeting 150–200 mm silicon and bonded silicon-on-insulator (SOI) wafers.
Chipbond opens advanced semiconductor facility in Penang February 11, 2026 Taiwanese semiconductor packaging and testing company Chipbond Technology has officially opened a new manufacturing facility in Penang, Malaysia, marking a major step in the company’s global expansion.
FPT launches advanced semiconductor testing and packaging plant in Vietnam February 11, 2026 FPT plans to establish an advanced semiconductor testing and packaging facility in Vietnam, aiming to expand domestic back-end manufacturing capacity and strengthen the country’s position in the global semiconductor supply chain.
Viettel breaks ground on Vietnam’s first semiconductor fab February 10, 2026 Viettel Group has broken ground on the construction of what has been dubbed Vietnam’s first semiconductor chip fabrication plant, marking the country’s entry into domestic chip manufacturing.
Global semiconductor sales reach record high in 2025 February 10, 2026 Global semiconductor sales climbed to a record USD 791.69 billion in 2025, marking a 26.1% increase compared with the previous year, according to figures released by the European Semiconductors Industry Association (ESIA). In Europe, semiconductor sales reached USD 54.46 billion during the year, up 6.2% YoY.
EU launches NanoIC, Europe’s largest Chips Act pilot line February 09, 2026 The European Union has inaugurated NanoIC, its largest pilot line under the Chips Act, at IMEC Leuven in Belgium. The facility represents a total investment of EUR 2.5 billion, of which EUR 700 million coming from EU funding, EUR 700 million from national and regional governments, and the remainder from industry partners, including ASML.
Taiwan pushes back on US calls to relocate semiconductor capacity February 09, 2026 Taiwan has rejected US calls to shift a large share of its semiconductor manufacturing capacity to American soil, arguing that the island’s tightly integrated semiconductor ecosystem, which has been built up over decades, cannot be relocated, Reuters reported.
AI boom set to push memory revenues far beyond foundry market by 2026 February 09, 2026 The ongoing AI-driven investment cycle is expected to lift global semiconductor revenues to new highs by 2026, with the memory market growing to more than twice the size of the wafer foundry industry, according to new data from market research firm TrendForce.
Siemens acquires Canopus AI February 05, 2026 Siemens has acquired Canopus AI, a France-based developer of AI-driven metrology and inspection software for semiconductor manufacturing. The transaction closed on January 12, 2026.
Infineon completes the sale of its manufacturing site in Bangkok February 05, 2026 German semiconductor manufacturer Infineon Technologies has completed the sale of its backend manufacturing site in Bangkok/Nonthaburi, Thailand, to the company's supplier, Malaysian Pacific Industries Berhad (MPI)
How do you follow the electronics industry without drowning in it? February 05, 2026 The electronics industry no longer moves in straight lines. One day the focus is on semiconductors and AI infrastructure, the next it shifts to export controls, defence electronics, or a materials issue that suddenly turns into a supply chain concern.
GF partners with Telsys to expand Israel presence February 04, 2026 GlobalFoundries has entered into a strategic partnership with Telsys, a leading Israeli distributor of electronic components and systems for the high-tech industry.
Wolfspeed completes Renesas equity issuance following CFIUS approval February 04, 2026 Wolfspeed has received clearance from the Committee on Foreign Investment in the United States (CFIUS) for its equity issuance to Renesas Electronics, completing a key element of the company’s court-approved restructuring process.
US plans USD 12 billion critical minerals stockpile February 03, 2026 The United States is preparing to establish a USD 12 billion strategic stockpile of critical minerals, a move aimed at reducing supply chain exposure to China and strengthening domestic access to raw materials used across electronics, EVs and defence systems.
FAMES inaugurates pilot line in Grenoble after first validated results February 03, 2026 The FAMES pilot line has been officially inaugurated at CEA-Leti’s site in Grenoble, France, following the delivery of its first validated technical results. The inauguration marks the opening of a new cleanroom facility dedicated to advanced semiconductor technologies and based on 300mm semiconductor equipment.
VIS licenses GaN technology from TSMC February 02, 2026 Vanguard International Semiconductor Corporation (VIS) has signed a technology licensing agreement with TSMC covering both low-voltage (80V) and high-voltage (650V) gallium nitride (GaN) process technologies.