Evertiq Expo Berlin 2026 wraps up the first half of the year June 22, 2026 Evertiq Expo Berlin 2026 took place on June 18 at TEC Event Campus in Berlin's Siemensstadt district – a new venue for the event, which previously called Technology Park Berlin Adlershof home. The day brought together 328 people from 199 companies, with 163 visitors meeting 78 exhibiting companies.
Renesas acquires Pictorus to accelerate embedded system development June 19, 2026 With the acquisition of Pictorus, Renesas gains a cloud‑based behavioral modeling platform that accelerates embedded system development, moving the engineering experience beyond point tools by providing a connected platform for model-based system design.
SK hynix ships samples of 12-layer next-gen HBM4E June 19, 2026 The 12-layer HBM4E shows improvements in both performance and power efficiency. The product features a maximum data processing speed of 16Gbps per pin and power efficiency that is up more than 20 percent from previous models.
Semiconductor market hits record quarter, driven by memory surge June 16, 2026 Semiconductor revenue grew 27% QoQ in Q1 2026 to reach USD 319 billion – the highest quarterly growth Omdia has recorded since it began tracking the market in 2002. It marks the third consecutive quarter of double-digit growth, putting the market on track to surpass USD 700 billion in the first half of 2026.
Evertiq Expo Berlin 2026: a closer look at the conference programme June 12, 2026 From AI-driven production planning and advanced PCB manufacturing to supply chain resilience and Europe's industrial competitiveness, Evertiq Expo Berlin 2026 will bring together experts from across the electronics industry to discuss some of the sector's most pressing challenges. Ahead of the event on 18 June, we take a closer look at this year's conference programme.
The semiconductor industry as it is, not as it is told June 12, 2026 At Evertiq Expo Zürich, Claus Aasholm of Semiconductor Business Intelligence delivered a data-driven examination of a semiconductor industry in structural transition – and the picture looked considerably different from what most quarterly reports suggest.
Forge Nano secures wafer fab equipment order from photonics firm June 12, 2026 Forge Nano’s TEPHRA platform is designed for high-volume semiconductor manufacturing and delivers the film uniformity, process repeatability, throughput, and manufacturing scalability required for commercial production environments.
India’s Polymatech establishes manufacturing hub in Singapore June 12, 2026 The facility is positioned as a dedicated commercial-scale LED Chip-on-Board (CoB) packaging unit and is expected to create approximately 50 high-value engineering and manufacturing roles in Singapore over five years.
Xbox: “We are in a hardware component crisis” June 12, 2026 In an internal memo published on June 10, Xbox CEO Asha Sharma outlined five realities facing the gaming company — including a stark assessment of the hardware component situation.
Nvidia partners with SK hynix to advance memory for AI factories June 08, 2026 As AI factories scale globally, this strategic partnership enables memory supply to keep pace with Nvidia’s infrastructure roadmap and the sustained buildout of AI infrastructure worldwide.
DRAM prices surge – industry revenue up 81% in a single quarter June 08, 2026 The DRAM industry posted revenue of USD 97 billion in the first quarter of 2026, up 81% quarter-on-quarter, driven by a rapid surge in contract prices for conventional DRAM. Contract prices rose approximately 93 to 98 percent compared to the previous quarter, according to TrendForce.
Cadence, Samsung Foundry deepen 2nm and 3D‑IC collaboration June 05, 2026 Building on the companies’ 2025 announcement of certified Cadence tools and IP on multiple Samsung Foundry nodes, including second-generation 2nm, this new multi-year agreement further broadens the Cadence portfolio of Memory and Interface IP.
Middle East conflict drives PCB prices up 40%, disrupting electronics supply chains June 03, 2026 The war in the Middle East has disrupted supplies of raw materials used in PCBs and pushed prices sharply higher, compounding cost pressures that were already building across the electronics industry, according to industry sources and executives cited by Reuters.
Why stockpiling doesn’t work anymore June 03, 2026 For years, memory sourcing followed a familiar logic. Buyers negotiated hard, and, when prices rose, trusted that the cycle would eventually rebalance. That approach worked – until it didn’t.
Bull and Foxconn partner to manufacture AI infrastructure in Europe June 02, 2026 French computing company Bull and Foxconn have announced a strategic partnership to manufacture AI and cloud infrastructure in Europe. The collaboration combines Bull's AI systems design and go-to-market capabilities with Foxconn's manufacturing scale, with an initial investment exceeding EUR 120 million.
Global EMS grew in 2025 – Europe watched from the sidelines June 01, 2026 Following his keynote at Evertiq Expo Zürich, in4ma founder and analyst Dieter Weiss had an interview with Evertiq to discuss the numbers behind global EMS growth in 2025 – and what they reveal about where the European industry stands.
Samsung Electronics begins shipment of HBM4E samples June 01, 2026 Samsung’s HBM4E delivers a stable pin speed of 14 gigabits-per-second (Gbps), with performance scalable up to 16Gbps to support increasingly intensive data processing requirements. This represents more than a 20% increase over its HBM4.
Vector supports the NXP CoreRide Platform May 29, 2026 The collaboration between Vector and NXP Semiconductors focuses on accelerating the industrialization of Software-Defined Vehicles (SDV). The latest outcome of this collaboration is the newly released NXP CoreRide Z248 zonal reference system.
Fractile raises $220M to build next generation of inference hardware May 28, 2026 The financing round was led by Accel, Factorial Funds, and Founders Fund, with participation from Conviction, Gigascale, 01A, Felicis, Buckley Ventures and 8VC, alongside existing backers.
SK hynix unveils ‘iHBM’ thermal solution to boost AI performance May 27, 2026 This latest heat management solution helps reduce thermal resistance by 30% and enables chips to operate stably even in high-temperature and high-pressure conditions.
NAND Flash revenues surge 84% in Q1 as AI demand drives shortage May 26, 2026 The combined revenue of the world's five largest NAND Flash suppliers jumped 83.7% quarter-on-quarter in the first quarter of 2026, surpassing USD 38.9 billion. Surging demand for enterprise SSDs from AI infrastructure buildout, combined with constrained supply, pushed prices well above expectations, according to TrendForce.
Evertiq Expo Berlin – between resilience, AI and manufacturing reality May 26, 2026 The German electronics industry is entering a period defined less by stability and more by adaptation. For years, the sector benefited from a model built on industrial strength, global supply chains and close ties between manufacturing and export-driven growth. Today, many of those assumptions are being re-evaluated.
Micron starts 1α DRAM production at Virginia fab in $2 billion expansion May 26, 2026 US memory manufacturer Micron has begun 1-alpha DRAM manufacturing at its Manassas, Virginia facility — the most advanced memory technology ever produced in the United States, according to the company. The more than USD 2 billion investment will quadruple Micron's DDR4 wafer supply at the site.
The next two years won't offer shortcuts – A memory market reality check May 25, 2026 Following his presentation at Evertiq Expo Zürich, Memphis Electronics' Nikolaos Florous had a conversation with Evertiq to go deeper on the market outlook. The short version: conditions will stay difficult, and procurement teams that haven't adapted yet are running out of time.
Evertiq Expo celebrated 15 years – in the city where it all began May 22, 2026 On 21 May, Evertiq Expo returned to Lund – the city where it all started. After several years at Malmö Arena, the event was back on home turf for its 15th anniversary, this time at Sparbanken Skåne Arena.
TetraMem announces 22nm RRAM analog IMC SoC milestone May 19, 2026 The US company’s MLX200 platform integrates multi-level RRAM arrays with mixed-signal compute engines to enable high-throughput vector-matrix operations within memory, while maintaining compatibility with advanced CMOS processes.
Kioxia introduces KIOXIA BG8 Series SSDs for PC OEMs May 18, 2026 Compared to the previous generation, the KIOXIA BG8 Series achieves up to 47 % higher sequential read, 67 % higher sequential write, 44 % higher random read, and 30 % higher random write performance.
Forge Nano delivers wafer fab equipment to leading firm May 15, 2026 Forge Nano’s TEPHRA platform will support development and manufacturing activities related to next-generation optical and photonics technologies used in high-speed communications and data infrastructure applications.
TSMC joins Applied Materials' EPIC Center as founding partner May 14, 2026 Applied Materials has announced a new innovation partnership with TSMC at its EPIC Center in Silicon Valley, where the two companies will co-develop materials, equipment and process technologies for next-generation semiconductor devices. TSMC becomes the latest company to join the platform.
Global semiconductor materials market reached a record $73.2B in 2025 May 13, 2026 Global semiconductor materials market revenue increased 6.8% year-over-year to USD 73.2 billion in 2025, SEMI reports
Macnica ATD Europe acquires Indesmatech May 12, 2026 Semiconductor distributor Macnica ATD Europe has acquired Indesmatech, a pan-European technology advisory company specialising in semiconductor representation, design-in support and consulting.
Memory is no longer a commodity – The industry hasn't fully caught up May 08, 2026 Nikolaos Florous of Memphis Electronic delivered a data-heavy, at times bluntly honest overview of the global memory market at Evertiq Expo Zürich – and his central message was uncomfortable: the rules have changed, and most of the industry is still playing by the old ones.