Apple brings more iPhone component production to the US October 21, 2026 Qnity Electronics will produce films for the variable aperture camera in the iPhone 18 Pro in the US. The deal is part of an expansion of Apple’s American Manufacturing Program, under which nearly 100 components in Apple’s newest iPhones now come from American companies.
Europe’s electronics industry has forgotten how to win October 20, 2026 We have become very good at defending what little we have left. That instinct must be balanced with the winning spirit.
TSMC to build another 3nm fab in Tainan October 19, 2026 TSMC plans to build a new 3nm fab in Tainan, with production slated to start in the first half of 2028. The company is also moving some 5nm capacity over to 3nm as demand for its leading-edge processes continues to grow.
Applied Materials opens $5 billion EPIC Center in Silicon Valley October 13, 2026 Applied Materials has unveiled its EPIC Center in Sunnyvale, California, where chipmakers, equipment suppliers and universities will develop new semiconductor processes alongside the company’s own engineers. TSMC, Intel, Samsung, SK hynix and Micron are among the founding partners.
GlobalFoundries to make AI chip component for TSMC in $2B deal October 09, 2026 Under the agreement, GF will provide manufacturing service to TSMC, and add fabrication capacity at its Malta, New York facility, supporting growing demand for high-performance computing and AI systems.
KIOXIA joins Applied Materials' EPIC Center as memory makers line up September 30, 2026 Flash memory maker KIOXIA will join Applied Materials' EPIC Center in Silicon Valley as an innovation partner. It is the latest in a series of chipmakers to sign up.
Synopsys, TSMC partner to accelerate AI systems innovation September 25, 2026 Through AI-powered EDA flows, multiphysics-aware signoff methodologies, multi-die design flows, and silicon-proven Interface and Foundation IP, Synopsys and TSMC are helping customers address growing design complexity.
Siemens, TSMC advance AI-powered chip design automation September 24, 2026 As part of this collaboration, Siemens and TSMC have enabled an AI-powered agent for automated design rule check (DRC) fixing across digital and custom integrated circuit (IC) design flows.
ASML, TSMC to advance transition to large-format EUV photomasks September 24, 2026 While High NA EUV will be adopted for production using the current 6-inch masks, the transition to larger, 12-inch masks is expected to further increase fab productivity, lower chipmaking costs and remove stitching constraints, benefiting the entire semiconductor industry.
Taiwan breaks ground on advanced packaging industrial park September 23, 2026 TSMC, the world’s largest contract chipmaker, will build two buildings at the Baipu Industrial Park, including a technology validation laboratory and a talent training centre.
Ceva partners with LG Electronics to accelerate UWB adoption September 11, 2026 The collaboration pairs Ceva-Waves UWB baseband IP and software with UWB radio frequency (RF) technology developed by LG's SoC Center, giving customers a silicon-ready platform for integrating UWB into their SoCs. LG's UWB RF supports TSMC's 22nm process.
SMIC narrows gap with Samsung as global foundry revenue hits record $53.49 billion September 10, 2026 SMIC posted the strongest growth among the top three foundries in Q2 2026, with revenue surging 20% QoQ to more than USD 3 billion and market share edging up to 5.4% – closing in on Samsung Foundry's 5.9%. Combined revenue for the world's top ten foundries rose 11.5% to nearly USD 53.49 billion, a new record, according to TrendForce.
Sony, TSMC plan $6.4 billion image sensor factory in Japan August 11, 2026 Sony Semiconductor Solutions will hold a controlling stake in the venture — about 60% — with TSMC owning the remaining 40%.
Stop lobbying, start listening: Better policy begins with a conversation July 22, 2026 In late June I spent a full day in Brussels, moderating a room full of speakers, panelists, policymakers and manufacturers, all there to talk about the future of European electronics. By the end of it, one thing was obvious. Everyone in that room agreed the industry matters. Almost nobody disagreed about the stakes. And yet agreement is not the same as alignment, and the gap between "we support you" and "here is what we will actually do" is exactly where good intentions tend to disappear.
TSMC pledges another $100 billion to expand US chipmaking capacity July 17, 2026 The Taiwanese chip giant’s announcement comes after it posted a 77% hike in second-quarter profit to a record high of USD 22 billion, beating market forecasts.
TSMC and Sony sign MOU for next-generation image sensor JV July 02, 2026 TSMC and Sony Semiconductor Solutions have signed a non-binding memorandum of understanding to form a strategic partnership for the development and manufacturing of next-generation image sensors.
TSMC partners with Amkor to accelerate advanced packaging in US June 24, 2026 The agreement establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services. By working together as partners to expand capacity, the companies aim to enable a more efficient, mutually beneficial operating model.
The semiconductor industry as it is, not as it is told June 12, 2026 At Evertiq Expo Zürich, Claus Aasholm of Semiconductor Business Intelligence delivered a data-driven examination of a semiconductor industry in structural transition – and the picture looked considerably different from what most quarterly reports suggest.
Nvidia, TSMC use AI to advance chip design and manufacturing June 03, 2026 Nvidia CUDA-X libraries and AI models are accelerating TSMC workloads across lithography, transistor and process simulation, advanced process control and fab operations optimization.
Huawei says it can deliver 1.4-nm equivalent chips by 2031 May 25, 2026 Currently, China’s most advanced proven chipmaking capability is believed to be around 7nm, and experts say 1.4nm is likely the global limit for advanced chipmaking around the end of the decade. So the Chinese tech giant’s claims could represent a breakthrough.
TetraMem announces 22nm RRAM analog IMC SoC milestone May 19, 2026 The US company’s MLX200 platform integrates multi-level RRAM arrays with mixed-signal compute engines to enable high-throughput vector-matrix operations within memory, while maintaining compatibility with advanced CMOS processes.
Sony, TSMC sign MOU to develop and manufacture image sensors May 15, 2026 Through the JV, both companies expect to leverage Sony's expertise in sensor design alongside TSMC’s strengths in process technology and manufacturing excellence as part of a broader collaboration aimed at enhancing image sensor performance.
TSMC joins Applied Materials' EPIC Center as founding partner May 14, 2026 Applied Materials has announced a new innovation partnership with TSMC at its EPIC Center in Silicon Valley, where the two companies will co-develop materials, equipment and process technologies for next-generation semiconductor devices. TSMC becomes the latest company to join the platform.
Inside Fab 21: TSMC reveals Arizona chip production site May 08, 2026 TSMC has released a video showcasing its semiconductor manufacturing operations in Arizona, offering a rare glimpse inside its expanding US production site, known as Fab 21.
Mature-node foundry prices set to rise as AI demand tightens capacity May 07, 2026 A structural shift in the global mature-node foundry market is underway, according to research from TrendForce. Capacity cuts, surging demand for AI power components, and TSMC's planned reallocation are combining to push utilisation rates toward 90% — and set the stage for price increases.
Siemens collaborates with TSMC to advance AI for chip design April 23, 2026 TSMC is working with Siemens to enhance productivity in custom integrated circuit (IC) design to enable multi-step, multi-tool automations for DRC-centric physical verification with Siemens’ Calibre software.
Japan approves extra $4 billion for chipmaker Rapidus April 13, 2026 Established in 2022, Rapidus has secured funding from both the public and private sectors. It is aiming to mass-produce cutting-edge chips using 2-nanometer technology by 2027.
TSMC targets 3nm production at second Japan fab by 2028 April 01, 2026 TSMC is planning to begin equipment installation and launch mass production of advanced 3-nanometre chips at its second fabrication plant in Japan in 2028, according to a Taiwanese government filing.
Inside one of Taiwan's semiconductor factories March 27, 2026 Taiwan’s semiconductor industry is often discussed in terms of scale, complexity, and technological leadership. Less often, we get a closer look at how these facilities actually operate from the inside.
Foundry set to grow 24.8%, but not all of the market is keeping pace March 27, 2026 In December, Claus Aasholm, an analyst at Semiconductor Business Intelligence, raised an uncomfortable question in Evertiq: does the traditional semiconductor cycle still exist? His argument was straightforward — AI-driven growth is pulling the market into parallel trajectories that are increasingly difficult to reconcile within a single top-line number.
Samsung unleashes $73 billion blitz in AI chips race March 25, 2026 The South Korean tech giant is ramping up investment 22% in 2026 to retake the lead in AI semiconductors from SK Hynix, which has become the main provider of high-bandwidth memory to Nvidia.
From global dependence to local ambition – Apple’s supply chain shift March 20, 2026 With advanced semiconductor manufacturing still heavily concentrated in Taiwan, geopolitical tensions are forcing companies like Apple to reassess their supply chain strategies. The question is no longer if diversification is needed, but how quickly it can be achieved.