Synopsys, TSMC partner to accelerate AI systems innovation
Through AI-powered EDA flows, multiphysics-aware signoff methodologies, multi-die design flows, and silicon-proven Interface and Foundation IP, Synopsys and TSMC are helping customers address growing design complexity.
Synopsys has announced new innovations with TSMC that accelerate the development of next-generation AI, high-performance computing (HPC), and advanced semiconductor systems.
Through AI-powered EDA flows, multiphysics-aware signoff methodologies, multi-die design flows, and silicon-proven Interface and Foundation IP, Synopsys and TSMC are helping customers address growing design complexity while accelerating adoption of TSMC's latest process and advanced packaging technologies, Synopsys said.
“As AI systems continue to grow in scale and complexity, customers require proven IP, intelligent design solutions, and advanced packaging methodologies that work together seamlessly,” said Michael Buehler-Garcia, Senior Vice President at Synopsys. “Our joint innovations with TSMC address the continuum of silicon to systems co-design capabilities needed to accelerate development of next-generation AI and high-performance computing systems.”
“Our collaboration with Open Innovation Platform (OIP) ecosystem partners like Synopsys continues to meet the rapidly growing demands of AI and high-performance computing,” said Aveek Sarkar, Director of the Ecosystem and Alliance Management Division at TSMC. “By combining certified EDA solutions and silicon-proven IP portfolio from Synopsys with our latest process and packaging innovations, we are enabling customers to push the boundaries of performance, integration, and energy efficiency to shape the future of AI.”
