Siemens, TSMC advance AI-powered chip design automation
As part of this collaboration, Siemens and TSMC have enabled an AI-powered agent for automated design rule check (DRC) fixing across digital and custom integrated circuit (IC) design flows.
Siemens has announced continued collaboration with TSMC to drive innovation in AI-powered automation and advanced semiconductor design enablement.
Building on a longstanding relationship within the TSMC Open Innovation Platform (OIP) ecosystem, the companies are expanding design enablement efforts across semiconductor design workflows to help mutual customers improve productivity, accelerate design cycles, and manage increasing design complexity, Siemens said in a press release.
As part of this collaboration, Siemens and TSMC have enabled an AI-powered agent for automated design rule check (DRC) fixing across digital and custom integrated circuit (IC) design flows. Powered by Calibre software and tightly integrated with Aprisa software and Solido software, the agent is designed to help engineering teams reduce manual effort, improve workflow efficiency, and accelerate time-to-tapeout.
“By combining Siemens’ EDA portfolio with TSMC’s leading process and packaging technologies, we are helping customers achieve new levels of productivity, speed and design confidence,” said Ankur Gupta, executive vice president, EDA IC Software, Siemens Digital Industries Software.
“Our collaboration with OIP partners like Siemens focuses on delivering intelligent, trusted automation that empowers engineers to navigate rising design complexity while achieving stringent performance and energy-efficiency targets,” said Aveek Sarkar, director of the ecosystem and alliance management division at TSMC.
