Taiwan breaks ground on advanced packaging industrial park
TSMC, the world’s largest contract chipmaker, will build two buildings at the Baipu Industrial Park, including a technology validation laboratory and a talent training centre.
Taiwan has broken ground on a new advanced packaging industrial park in Kaohsiung, where the world’s largest contract chipmaker, TSMC, plans to establish facilities for technology validation and talent training, according to Reuters.
TSMC will build two buildings at the Baipu Industrial Park, including a technology validation laboratory and a talent training centre, Kaohsiung Deputy Mayor Lo Ta-sheng said.
“With the rapid development of AI and high-performance computing, advanced packaging has become a critical part of global semiconductor competition,” Taiwan President Lai Ching-te said.
The park will serve as a testing and validation centre for equipment and materials used in TSMC’s advanced packaging, the Reuters report said.
TSMC’s advanced packaging technology is used to produce advanced AI chips designed by Nvidia, AMD and Broadcom.
TSMC has maintained its dominance in the global foundry market, with a 72.5% market share in the second quarter, according to data released by TrendForce. Strong demand for AI server processors kept TSMC’s advanced 5-, 4- and 3-nanometer capacity fully booked during the quarter, the research firm said, according to a report by CNBC.
