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Weebit and SkyWater to take ReRAM tech to volume production
September 23, 2021
Weebit Nano, a developer of next-gen memory technologies for the semiconductor industry, has entered into an agreement with semiconductor foundry SkyWater Technology to take Weebit’s Resistive RAM (ReRAM) technology to volume production.
Nowi and Murata to develop LoRa energy autonomous platforms
May 21, 2021
Murata and Nowi have entered a strategic partnership that aims to enable and simplify the development of sustainable energy autonomous IoT platforms for use in ‘Plug & Forget’ solutions.
Sponsored content by congatec AG
Rugged four-legged robot with three brains
ANYbotics provides solutions for robot applications with the most advanced mobility and autonomy requirements in challenging terrains. The massive embedded computing performance for the key tasks – situational awareness, motion control and mission fulfillment – is delivered by three COM Express Computer-on-Modules from congatec.
Sponsored content by congatec AG
A highly reliable performance boost for the edge
The new Intel Atom® x6000E Series, Intel Celeron® and Pentium® N & J processors (code name Elkhart Lake) impress with twice the graphics speed of their predecessors and 50% more multi-thread performance on up to 4 cores. congatec is now making these processors available on the 2.5-inch Pico-ITX form factor, leveraging their industrial quality for the most reliable performance boost possible.
WiMi subsidiary VIYI Technology to acquire Fe-da Electronics
November 06, 2020
WiMi Hologram, an AR service provider in China, says that its wholly-owned subsidiary, VIYI Technology has entered into a framework agreement to acquire 100% equity interests of Fe-da Electronics, a provider of IoT solutions based in Singapore.
FCA revs up support for the Motor City
February 27, 2020
Fiat Chrysler Automobiles has released details on its planned expanded presence in Detroit, including the first new assembly plant within the city limits in almost three decades.
NTU Singapore and GF to explore next-gen memory technology
October 23, 2019
Nanyang Technological University, Singapore (NTU Singapore) and GlobalFoundries will jointly be exploring the next-generation of embedded memory for smart systems.
Rutronik and AP Memory inks global distribution agreement
September 06, 2019
Rutronik Elektronische Bauelemente GmbH and Taiwanese memory solutions supplier, AP Memory Technology Corp., have entered into a global distribution agreement.
FCA expands in Michigan, curtails in Illinois
February 27, 2019
Fiat Chrysler Automobiles is continuing the investment realignment it began in 2016 by injecting USD 4.5 billion and 6,500 jobs into five Michigan plants, but initiating a production and man-power scale-back in Illinois.
Autotalks expands into China
November 20, 2018
Autotalks, a V2X (Vehicle to Everything) communication solutions provider, is expanding its operations to China in order to bring its V2X offering to the Chinese vehicle industry.
UMC: "Our DRAM technology design is different"
November 12, 2018
“There is a misimpression that UMC did not have any DRAM knowledge or experience. This is emphatically untrue. From 1996 to 2010, UMC accumulated nearly 15 years of experience in manufacturing DRAM products."
Everspin & SilTerra to create manufacturing centre for MRAM
November 06, 2018
Everspin Technologies, a developer and manufacturer of Magnetoresistive RAM (MRAM), has entered into a multi-year partnership with Malaysian semiconductor company SilTerra, to create additional manufacturing capacity for Toggle MRAM products.
Sponsored content by Kontron
Kontron introduces COMe-cVR6 (E2) Module with new AMD Ryzen™ Embedded V1000 Processor
Kontron, a leading global provider of IoT/Embedded Computer Technology (ECT), introduces its new COMe-cVR6 (E2) Module in the COM Express® Compact Type 6 form factor. It is based on the new AMD Ryzen™ Embedded V1000 processor, which sets the benchmark for high-end embedded computer modules. The COM Express® Compact module's smaller form factor significantly saves space in comparison to most comparable solutions, allowing developers to create more compact designs with higher performance. Variants of the COMe-cVR6 (E2) are also resitant to vibration and shocks thanks to their permanently soldered memory, just as all other components, such as voltage dividers, capacitors, and controllers are selected for highest resistance to environmental stresses. The new COM Express® module is particularly suitable for applications in harsh environments, medical or industrial image processing systems, as well as complex automation systems.
