Lear to shut down production in Gründau, cutting 180 jobs August 27, 2026 US automotive supplier Lear Corporation plans to cease production at its facility in Gründau, Germany, relocating manufacturing to Slovakia, Serbia and Tunisia. Around 180 jobs will be lost, with the phase-out expected to begin immediately and complete by mid-2027. Approximately 120 engineering positions will remain at the site, according to IG Metall.
Navitas Semiconductor to acquire Claros for $233 million August 27, 2026 Navitas’ potential acquisition of Claros would extend the company’s AI infrastructure portfolio from the grid all the way to the xPU by bringing industry-leading VPD and IVR capabilities that can directly power the high-current, high-speed processors at the heart of modern AI systems.
Navitas partners with Magnachip to accelerate HV, UHV SiC adoption August 24, 2026 Under the terms of the agreement, Magnachip will license Navitas’ GeneSiC Trench-Assisted PlanarTM (TAP) technology to enter the HV and UHV SiC markets. The license covers 1200 V, 2300 V, 3300 V and higher voltage GeneSiC technologies.
Sony Semiconductor returns to full operations at Kumamoto facility after earthquake August 20, 2026 Sony Semiconductor Solutions' Kumamoto Technology Center, which was halted following an earthquake in the Kumamoto region on July 28, began staged resumption of operations on August 4. The company expects to return to pre-earthquake operating levels by mid-August, according to updates published by Sony Semiconductor Solutions.
Incap Germany adds new selective soldering system in Karlsfeld August 19, 2026 Incap Germany has commissioned a new SEHO SelectLine-C 500 selective soldering system at its Karlsfeld facility, expanding production capacity and automation capabilities for through-hole technology components.
Mitsubishi Electric to wholly acquire Poland-based Medcom August 17, 2026 Medcom designs, manufactures, sells and maintains electrical equipment for railcars and electric urban transportation, including auxiliary power supply systems, propulsion control systems and industrial power electronics equipment. Its primary business is in Europe.
Sivers announces $3.4M program with SemiNex for InP light sources August 14, 2026 The program targets high-power external laser sources for co-packaged optics (CPO), high-channel-count DFB arrays for wavelength-multiplexed links, and SOA gain stages that extend optical reach as channel counts scale.
US space tech startup Array Labs raises $21 million August 14, 2026 The investment round was anchored by Mitsubishi Electric Corporation. Array Labs and Mitsubishi Electric have also entered into a partnership to develop and bring to market satellite-based maritime and aircraft tracking services for customers in Asia-Pacific.
Canada’s Stathera raises $55 million to scale silicon timing August 12, 2026 Stathera will use the proceeds to fund mass production of its GEN2 silicon timing portfolio while accelerating development of its next-generation platform for AI data centers and growing the company’s engineering and commercial teams.
Navitas files patent infringement lawsuit against Renesas August 12, 2026 The lawsuit comes weeks after Japanese semiconductor company Renesas sued US-based Navitas in the California federal court, claiming the company poached its employees to steal trade secrets for developing next-gen GaN chips.
India’s CESC unit to buy solar portfolio from ReNew for $510M August 11, 2026 The transaction marks a shift in the composition of Purvah’s portfolio — from a platform built primarily on projects under development to one anchored by assets already generating contracted cash flows.
Rashi Peripherals announces JV with Japan’s Restar August 07, 2026 Rashi will transfer its semiconductor business division into a wholly owned subsidiary headquartered in Bengaluru and step-down subsidiary headquartered in Singapore. Restar Corporation will subsequently acquire a 26% equity stake in the subsidiary.
Fuji enables SMT placement of large, heavy components for AI servers August 06, 2026 The company can handle large, heavy components measuring 200 x 200 mm and weighing 2.0 kg with the standard configurations of both its NXTR and AIMEXR pick and place machines.
Renesas Gen 3 MRDIMM chipset solutions advance performance August 05, 2026 Renesas’ Gen 3 MRDIMM solutions deliver 25 percent higher memory bandwidth than its second-generation solutions, while continuing to use existing DDR5 infrastructure. As a result, server platforms can extract more performance without disruptive architectural changes.
Dawn raises $25M to advance reusable space transportation August 03, 2026 This Series B funding will directly finance New Zealand-Dutch company Dawn Aerospace’s global rollout, scaling commercial and operational teams in the US and Europe to support its expanding international customer base.
Incap reports 21% increase in half-yearly revenue August 03, 2026 In the January–June 2026 period, Incap reported revenue of EUR 130.2 million, an increase of 21.1% from last year. It reported revenue of EUR 74.2 million for the April–June 2026 quarter, a year-on-year increase of 34.1%.
Intel partners with Lens to boost advanced semiconductor packaging August 03, 2026 Intel and Lens will leverage their respective strengths in advanced semiconductor packaging, precision manufacturing, glass substrate R&D, and process innovation to support the growing demands of AI, data center, and specialized computing applications.
UMC reports 17% increase in YoY second quarter revenue July 30, 2026 Second quarter consolidated revenue was NT$68.73 billion, increasing 12.6% from NT$61.04 billion in 1Q26. UMC’s Board of Directors has approved a plan to expand cleanroom capacity at its Singapore P4 facility and to construct a new fab in Taiwan.
Worldwide silicon wafer shipments increase 7.4% in Q2 2026 July 30, 2026 SEMI Silicon Manufacturers Group (SMG) has reported that worldwide silicon wafer shipments increased 7.4% year-on-year to 3,573 million square inches (MSI) from the 3,327 MSI recorded during the same quarter of 2025.
Mitsubishi Electric, Sony to advance vision sensor solutions July 29, 2026 The two companies will establish a joint venture that will help integrate Sony’s image sensors and edge AI technologies with Mitsubishi Electric’s expertise in FA control systems.
Rethinking finance amid semiconductor supply chain uncertainties July 28, 2026 Companies are reassessing where they build, how much flexibility they need, which suppliers they depend on and where financial decisions are made.
EIM, HPCL to advance charging, battery swapping in India July 28, 2026 Under the agreement, Energy In Motion (EIM) will deploy charging and battery swapping infrastructure at Hindustan Petroleum Corporation Limited (HPCL) retail outlets across India in a phased rollout.
Jabil expands manufacturing capacity in India July 21, 2026 Located in the Maharashtra Industrial Development Corporation (MIDC) industrial zone, this facility is the latest addition to Jabil’s India footprint, which has grown from 500,000 square feet to 1.2 million square feet over the past year.
Emesent secures $17M to boost autonomous intelligence platform July 21, 2026 Capital will be deployed to scale manufacturing at Emesent’s Queensland facility and to advance Cortex AI, the company’s onboard autonomy intelligence, and Aura, its cloud-based platform for 3D data processing, visualization and analytics.
Electronic components market: A crisis gathering momentum July 20, 2026 Artificial intelligence, geopolitical tensions, rising raw material prices, and increasingly longer delivery times create a combination of factors that could make life much more difficult for electronics manufacturers.
Nvidia partners with Japan firms to advance physical AI July 16, 2026 Japanese companies such as AIRoA, Fanuc, Fujitsu, Hitachi, Kawasaki Heavy Industries, Kubota, NEC, SoftBank, Sony, and Yaskawa Electric intend to join the Nvidia Cosmos Coalition to help build open frontier physical AI models.
Mitsubishi Motors, Highlanders sign MOU to develop humanoid robots July 15, 2026 Under this MOU, the two companies will explore the joint development of humanoid robots for use at Mitsubishi Motors’ manufacturing facilities as well as mass production of Highlanders products at Mitsubishi Motors’ Kyoto Plant.
10 years on – Brexit and the “new normal” July 15, 2026 A decade after the UK voted to leave the European Union, the EMS and CEM sector is still adapting to the consequences. Brexit realised many fears around supply-chain disruption, labour shortages and regulation, but it also accelerated structural change and pushed companies to modernise operations.
Mitsubishi Electric wholly acquires GSaaS provider Infostellar July 09, 2026 Tokyo-based Infostellar provides ground segment as a service (GSaaS) offerings for orbiting satellites. The two companies aim to accelerate the global expansion of ground station networks and establish a high-quality space communications infrastructure.
Maruti Suzuki inaugurates vehicle manufacturing plant in India July 08, 2026 At full capacity the advanced vehicle manufacturing facility in Haryana is expected to produce one million units per annum. The projected total investment at the plant will be about USD 3.5 billion, creating over 21,000 jobs.
Mitsubishi Power, LNGPH sign deal for gas turbine parts and services July 08, 2026 LNGPH is an integrated LNG import and regasification terminal and gas-to-power complex in the Philippines with a total installed capacity of 2.5GW, supporting the reliable supply of natural gas for power generation in the Luzon grid.
Micron breaks ground on new cleanroom at Hiroshima facility July 07, 2026 Micron Technology has broken ground on a new cleanroom at its manufacturing facility in Higashi-Hiroshima, Japan. The first phase covers approximately 300,000 square feet and is intended to strengthen Micron's advanced memory manufacturing capacity to meet growing AI demand. Equipment move-in is scheduled for the second half of 2028.