ClassOne, IBM Research team up to develop non-NMP solvent processing
May 26, 2025
The focus of the joint project will be to develop best known methods (BKMs) for non-NMP solvent processing in manufacturing IBM semiconductor devices.
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IBM and Deca to launch advanced chip packaging in Quebec
May 22, 2025
Deca Technologies has signed an agreement with IBM to implement Deca’s M-Series and Adaptive Patterning technologies in IBM’s advanced packaging facility in Bromont, Quebec. Under the agreement, IBM will implement a high-volume manufacturing line with a focus on Deca’s M-Series Fan-out Interposer Technology (MFIT).
IBM, Oracle expand partnership to advance agentic AI, hybrid cloud
May 09, 2025
To give customers a consistent way to build and manage agents across multi-agent, multi-system business processes, spanning both Oracle and non-Oracle applications and data sources, IBM is making its watsonx Orchestrate AI agent offerings available on Oracle Cloud Infrastructure.
IBM, TCS team up to deploy India’s largest quantum computer
May 06, 2025
IBM and the Andhra Pradesh government have entered into discussions that aim for the Quantum Valley Tech Park to be anchored by an IBM Quantum System Two installation, with a 156-qubit Heron quantum processor.
IBM to invest $150 billion in the US over 5 years
April 29, 2025
This includes an investment of over USD 30 billion in R&D and manufacturing of mainframe and quantum computers. IBM said it will continue to design, build and assemble quantum computers in the US.
IBM acquires Hakkoda to enhance data platform expertise
April 11, 2025
This acquisition amplifies IBM’s ability to meet the rapidly growing demand for data services and help clients build integrated enterprise data estates optimized for speed, cost and efficiency.
Tokyo Electron, IBM renew partnership for advanced chip tech
April 03, 2025
The two companies will explore technology for smaller nodes and chiplet architectures to achieve the performance and energy efficiency requirements for the future of generative AI.
ULVAC to develop dilution refrigerator for quantum computing
March 24, 2025
ULVAC, with input from IBM, has been developing the next generation of dilution refrigeration systems that meet IBM’s specifications for their superconducting qubit-based quantum computers.
Sphere Energy aims to jumpstart the European EV industry with AI-powered battery brain
February 11, 2025
Sphere Energy is planning to transform the European EV industry by creating AI-powered brains to simulate battery behavior.
Eaton wins contract to support NY CREATES’ new facility
January 15, 2025
Eaton has signed a contract valued at approximately USD 20 million to help support the construction of NY CREATES' new NanoFab Reflection semiconductor R&D facility at its Albany NanoTech Complex.
Rapidus targeting 2nm chip production for Broadcom
January 13, 2025
Fresh reports say Japanese foundry Rapidus will begin trial production of 2nm chips in April 2025, and has Broadcom lined up as its first major customer.
GlobalFoundries and IBM settle ongoing lawsuits
January 08, 2025
GlobalFoundries and IBM have settled their ongoing lawsuits, resolving all litigation matters, including breach of contract, trade secrets and intellectual property claims between the two companies.
Rapidus unveils plans for new R&D facility and clean room
October 03, 2024
Rapidus Corporation will set up a clean room within Seiko Epson Corporation's facility in Chitose, Hokkaido, and open an R&D center for semiconductor post-processing called Rapidus Chiplet Solutions (RCS).
India’s L&T plans $300 million semiconductor push
September 13, 2024
Meanwhile, L&T Semiconductor Technologies has also announced a collaboration with IBM for R&D to develop advanced processors.
IBM disbands China R&D department, impacting 1000 jobs
August 26, 2024
The news comes at a time when the US and China are sparring over areas like semiconductors. Beijing is worried that restrictions on US technology could hamper the growth of Chinese companies like Huawei.
ASMPT and IBM extend chiplet R&D collaboration
July 26, 2024
ASMPT and IBM have renewed their agreement to conduct research on chiplet packaging technologies. They will work together to advance thermo-compression and hybrid bonding technology using ASMPT’s Firebird TCB and Lithobolt hybrid bonding tools.
Rapidus and IBM to advance chiplet packages
June 04, 2024
Rapidus and IBM have entered into a joint development partnership aimed at establishing mass-production technologies for chiplet packages. Through the agreement, Rapidus will receive packaging technology from IBM for high-performance semiconductors.
Honda and IBM sign MOU on automotive computing
May 17, 2024
Japanese car giant Honda has sealed an agreement with US computing pioneer IBM to research the tech needed to develop the software-defined vehicles (SDV) of the future.
Kevin O’Buckley to lead Foundry Services at Intel
May 14, 2024
Stuart Pann, Senior Vice President and General Manager of Foundry Services, will retire from Intel after 35 years of service at the end of May. He will be succeeded by Kevin O’Buckley.
IBM plans $730m expansion of Canadian chip operation
April 29, 2024
IBM is preparing to invest heavily in its 800-acre semiconductor packaging and testing plant in Bromont, Quebec.
Rapidus establishes subsidiary in Silicon Valley
April 15, 2024
Japanese chip manufacturer Rapidus is targeting the the lucrative US market by setting up a division in the backyard of some of the country's biggest tech firms.
IBM bags 10-year $576m US defence contract
March 22, 2024
The US Defense Microelectronics Activity (DMEA) has handed IBM an up-to-10 year USD 576 million contract to consult on the purchase of chips for the military.
AI chip deals remain low; chip makers take over as major buyers
February 28, 2024
New research from Omdia reveals that while demand for AI chips is soaring, AI chip deals remain low – and that chip manufacturers are taking over as the major buyers.
Toppan and IBM to advance development of EUV photomasks
February 20, 2024
Toppan Photomask has entered into a joint research and development agreement with IBM related to the 2 nanometer (nm) logic semiconductor node, using extreme ultraviolet (EUV) lithography. The agreement also includes High-NA EUV photomask development capability on next-generation semiconductors.
Toppan partners with IBM on 2nm logic semiconductor node
February 08, 2024
Toppan Photomask has confirmed a five year agreement with IBM to develop a 2 nanometer logic semiconductor node using extreme ultraviolet (EUV) lithography.
Albany University to build $10bn semiconductor R&D centre
December 15, 2023
The State University of New York at Albany has received USD 1 billion from the state and USD 9 billion from private investment to create a High NA Extreme Ultraviolet Lithography facility.
IBM forms body to "accelerate responsible innovation in AI"
December 08, 2023
IBM has unveiled the AI Alliance – a new body comprising 50 organisations from industry, startup, academia, research and government. Members include AMD, Dell, Intel, Meta and Oracle.
Fictiv expands its manufacturing network into Mexico
November 06, 2023
Fictiv, the operating system for custom manufacturing, has added Mexico to its global network of manufacturing partners.
Japan is looking to revitalise its semiconductor industry
October 31, 2023
Japan flexes its advantages in semiconductor upstream equipment and raw materials, and unveils strategic progress of key players in Kyushu, Tohoku, and Hokkaido, says TrendForce
Swedish company delivers first quantum chips to clients
September 18, 2023
Chalmers University of Technology in Gothenburg, Sweden, has spent two decades developing quantum devices. However, translating this research into commercial products has been hindered by challenges relating to production and quality control. Until now.
Rapidus breaks ground on semiconductor plant in Hokkaido
September 04, 2023
Japanese semiconductor company Rapidus Corporation has officially broken ground on its future IIM-1 plant in Chitose City in Hokkaido, Japan.
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