Eaton wins contract to support NY CREATES’ new facility
January 15, 2025
Eaton has signed a contract valued at approximately USD 20 million to help support the construction of NY CREATES' new NanoFab Reflection semiconductor R&D facility at its Albany NanoTech Complex.
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Rapidus targeting 2nm chip production for Broadcom
January 13, 2025
Fresh reports say Japanese foundry Rapidus will begin trial production of 2nm chips in April 2025, and has Broadcom lined up as its first major customer.
GlobalFoundries and IBM settle ongoing lawsuits
January 08, 2025
GlobalFoundries and IBM have settled their ongoing lawsuits, resolving all litigation matters, including breach of contract, trade secrets and intellectual property claims between the two companies.
Rapidus unveils plans for new R&D facility and clean room
October 03, 2024
Rapidus Corporation will set up a clean room within Seiko Epson Corporation's facility in Chitose, Hokkaido, and open an R&D center for semiconductor post-processing called Rapidus Chiplet Solutions (RCS).
India’s L&T plans $300 million semiconductor push
September 13, 2024
Meanwhile, L&T Semiconductor Technologies has also announced a collaboration with IBM for R&D to develop advanced processors.
IBM disbands China R&D department, impacting 1000 jobs
August 26, 2024
The news comes at a time when the US and China are sparring over areas like semiconductors. Beijing is worried that restrictions on US technology could hamper the growth of Chinese companies like Huawei.
ASMPT and IBM extend chiplet R&D collaboration
July 26, 2024
ASMPT and IBM have renewed their agreement to conduct research on chiplet packaging technologies. They will work together to advance thermo-compression and hybrid bonding technology using ASMPT’s Firebird TCB and Lithobolt hybrid bonding tools.
Rapidus and IBM to advance chiplet packages
June 04, 2024
Rapidus and IBM have entered into a joint development partnership aimed at establishing mass-production technologies for chiplet packages. Through the agreement, Rapidus will receive packaging technology from IBM for high-performance semiconductors.
Honda and IBM sign MOU on automotive computing
May 17, 2024
Japanese car giant Honda has sealed an agreement with US computing pioneer IBM to research the tech needed to develop the software-defined vehicles (SDV) of the future.
Kevin O’Buckley to lead Foundry Services at Intel
May 14, 2024
Stuart Pann, Senior Vice President and General Manager of Foundry Services, will retire from Intel after 35 years of service at the end of May. He will be succeeded by Kevin O’Buckley.
IBM plans $730m expansion of Canadian chip operation
April 29, 2024
IBM is preparing to invest heavily in its 800-acre semiconductor packaging and testing plant in Bromont, Quebec.
Rapidus establishes subsidiary in Silicon Valley
April 15, 2024
Japanese chip manufacturer Rapidus is targeting the the lucrative US market by setting up a division in the backyard of some of the country's biggest tech firms.
IBM bags 10-year $576m US defence contract
March 22, 2024
The US Defense Microelectronics Activity (DMEA) has handed IBM an up-to-10 year USD 576 million contract to consult on the purchase of chips for the military.
AI chip deals remain low; chip makers take over as major buyers
February 28, 2024
New research from Omdia reveals that while demand for AI chips is soaring, AI chip deals remain low – and that chip manufacturers are taking over as the major buyers.
Toppan and IBM to advance development of EUV photomasks
February 20, 2024
Toppan Photomask has entered into a joint research and development agreement with IBM related to the 2 nanometer (nm) logic semiconductor node, using extreme ultraviolet (EUV) lithography. The agreement also includes High-NA EUV photomask development capability on next-generation semiconductors.
Toppan partners with IBM on 2nm logic semiconductor node
February 08, 2024
Toppan Photomask has confirmed a five year agreement with IBM to develop a 2 nanometer logic semiconductor node using extreme ultraviolet (EUV) lithography.
Albany University to build $10bn semiconductor R&D centre
December 15, 2023
The State University of New York at Albany has received USD 1 billion from the state and USD 9 billion from private investment to create a High NA Extreme Ultraviolet Lithography facility.
IBM forms body to "accelerate responsible innovation in AI"
December 08, 2023
IBM has unveiled the AI Alliance – a new body comprising 50 organisations from industry, startup, academia, research and government. Members include AMD, Dell, Intel, Meta and Oracle.
Fictiv expands its manufacturing network into Mexico
November 06, 2023
Fictiv, the operating system for custom manufacturing, has added Mexico to its global network of manufacturing partners.
Japan is looking to revitalise its semiconductor industry
October 31, 2023
Japan flexes its advantages in semiconductor upstream equipment and raw materials, and unveils strategic progress of key players in Kyushu, Tohoku, and Hokkaido, says TrendForce
Swedish company delivers first quantum chips to clients
September 18, 2023
Chalmers University of Technology in Gothenburg, Sweden, has spent two decades developing quantum devices. However, translating this research into commercial products has been hindered by challenges relating to production and quality control. Until now.
Rapidus breaks ground on semiconductor plant in Hokkaido
September 04, 2023
Japanese semiconductor company Rapidus Corporation has officially broken ground on its future IIM-1 plant in Chitose City in Hokkaido, Japan.
IBM and Tokyo University have just booted up their quantum computer
June 16, 2023
The IBM Quantum System One is now operational for researchers across Japan.
Rapidus to start construction of its new semiconductor plant in Hokkaido
April 26, 2023
Rapidus Corporation says that it will start preparing for the construction of a plant for the development and manufacturing of state-of-the-art semiconductors in Chitose City in Hokkaido.
From AMD to ADI – Alan Lee takes on the role as CTO
April 25, 2023
Analog Devices, Inc. has appointed Alan Lee to the position of Chief Technology Officer (CTO). In this role, Alan will identify and work to advance the next-generation technologies.
GlobalFoundries files lawsuit against IBM
April 21, 2023
The semiconductor manufacturer accuses IBM of having unlawfully disclosed information to Intel, the Japanese consortium Rapidus and others.
Rapidus selects Hokkaido for new semiconductor plant
March 01, 2023
Rapidus Corporation has selected Chitose City in Hokkaido as the site for the company’s new semiconductor plant.
IBM and Rapidus form strategic semiconductor partnership
December 15, 2022
IBM and Rapidus has entered into a joint development partnership to advance logic scaling technology as part of Japan's initiatives to become a global leader in semiconductor research, development, and manufacturing.
IBM plans to invest $20 billion in the Hudson Valley Region
October 06, 2022
IBM plans to invest USD 20 billion across the Hudson Valley region over the next 10 years. The goal of the investments, which will be strengthened by close collaboration with New York State, is to expand the technology ecosystem in New York.
Samsung invests in Israeli AI systems & semiconductor company
June 20, 2022
Samsung Ventures has made an investment in NeuReality, an Israeli AI systems and semiconductor company.
AMD acquires Pensando for $1.9 billion
April 05, 2022
AMD has entered into a definitive agreement to acquire Pensando for approximately USD 1.9 billion before working capital and other adjustments.
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