Tokyo Electron, IBM renew partnership for advanced chip tech
April 03, 2025
The two companies will explore technology for smaller nodes and chiplet architectures to achieve the performance and energy efficiency requirements for the future of generative AI.
Ad
ASML and imec team up to advance European research and sustainability
March 11, 2025
ASML and imec have entered into a new five-year strategic partnership aimed at advancing semiconductor research and sustainability in Europe. The agreement will leverage both companies' expertise to drive technological innovation and sustainable initiatives in the semiconductor industry.
ASML reports sakes of €28.3 billion in 2024
January 30, 2025
Dutch semiconductor equipment manufacturer ASML closed 2024 on a high note, reporting total net sales of EUR 28.3 billion for the year and a net income of EUR 7.6 billion.
Eaton wins contract to support NY CREATES’ new facility
January 15, 2025
Eaton has signed a contract valued at approximately USD 20 million to help support the construction of NY CREATES' new NanoFab Reflection semiconductor R&D facility at its Albany NanoTech Complex.
Japan to invest $635M in chipmaker Rapidus in 2025
December 27, 2024
Rapidus is building a plant in the city of Chitose in Hokkaido to start mass production of next-generation semiconductors with a circuit line width of 2 nanometers in 2027.
Rapidus installs Japan's first AMSL EUV lithography machine
December 19, 2024
Japanese semiconductor manufacturer, Rapidus, has reached a milestone by installing Japan's first Extreme Ultraviolet (EUV) lithography machine from ASML. This advanced technology is now part of Rapidus' Innovative Integration for Manufacturing (IIM-1) foundry, an advanced semiconductor fab under construction in Chitose, Hokkaido.
ASML reaffirms 2030 revenue targets
November 19, 2024
At its 2024 Investor Day, ASML provided an update on its long-term strategy as well as global market and technology trends, confirming potential 2030 scenarios for annual revenue between approximately USD 44 billion and USD 60 billion.
Samsung's new R&D complex takes shape
November 19, 2024
Samsung says that it will start installing equipment at its new semiconductor research and development complex (NRD-K) at its Giheung campus, located south of Seoul.
US to invest $825 million in New York chip facility
November 01, 2024
The site in Albany, New York, will focus on extreme ultraviolet (EUV) lithography, which is used to make the most advanced nodes for the next generation of chips and processors.
Samsung delays ASML chip gear deliveries for Texas plant
October 21, 2024
The delayed shipments to the Taylor plant involve ASML’s advanced extreme ultraviolet (EUV) lithography tools, according to Reuters.
Fujifilm to expand its semiconductor materials business
October 01, 2024
Fujifilm Corporation plans to invest JPY 20 billion (EUR 125 million) in its semiconductor materials business. The investment will strengthen the company's facilities for the development, production and quality evaluation of advanced semiconductor materials in Shizuoka and Oita, Japan.
Japan’s new R&D base will introduce EUV lithography equipment
September 04, 2024
With its extremely short wavelengths of about 13.5 nanometers, EUV lithography allows for finer etching of smaller features on chips.
Samsung to bring in ASML’s High-NA EUV equipment
August 19, 2024
Samsung’s first High-NA EUV machine may be used for foundry operations. SK hynix’s High-NA equipment is expected to be introduced in 2026.
SMIC: making 5nm chips without EUV machines?
June 20, 2024
New reports say China’s largest foundry has found a way to manufacture 5nm chips using deep ultraviolet (DUV) lithography machines purchased before the US imposed export restrictions.
Investment group pays $11bn for stake in Intel's Ireland fab
June 07, 2024
Intel has confirmed that Apollo and its affiliates will acquire a 49% equity interest in a joint venture entity related to the chip firm's Fab 34.
ASML and imec open joint lab
June 04, 2024
Imec and ASML are teaming up with the opening of the High NA EUV Lithography Lab in Veldhoven, the Netherlands, a lab jointly run by both companies.
Micron's DRAM plant in Hiroshima to be operational in 2027
May 30, 2024
US memory manufacturer Micron Technology is reportedly planning to set up a new DRAM plant in Hiroshima, Japan, with production targeted to start by the end of 2027.
ASML: we can disable our machines remotely
May 23, 2024
What happens if China invades Taiwan? ASML and TSMC will shut their factories down – from anywhere in the world.
Zeiss's chip sales pass EUR 2 billion for the first time
May 23, 2024
Optics giant Zeiss has reported a record-breaking half-yearly performance by its semiconductor division.
TSMC on track to mass produce 3nm chips this year
May 17, 2024
The world's biggest chip maker, TSMC, it set to make 3mn chips in the second half of 2024 following successful testing of its N3E process.
Samsung expands partnership with ZEISS to boost memory tech
April 29, 2024
Samsung Electronics and imaging specialist ZEISS Group have agreed to deepen their collaboration in a move to achieve better yields and performance in next-generation memory chips.
US asset managers mulling huge investment in Intel Ireland
April 29, 2024
Apollo Global Management, KKR & Co and Stonepeak are working on a joint venture to raise billions of euros to help fund Intel's semiconductor fabrication facility in Ireland, say reports.
TSMC: A16 manufacturing will start in 2026
April 26, 2024
The race is on to manufacture the worlds fastest chips, and TSMC has just made a bold claim to be winning it.
Unnamed firm buys world's second High-NA EUV machine
April 22, 2024
ASML has disclosed that it has shipped a second Extreme Ultraviolet Lithography (EUV) machine, but it hasn't named the customer.
Earthquake could have cost TSMC $92.44m
April 19, 2024
The recent earthquake in Taiwan caused an estimated loss of USD 92.44 million to the island's biggest chip firm, says Reuters.
Intel builds the world's most advanced EUV litho machine
April 19, 2024
Intel's newly-formed chip foundry business says it has successfully assembled the most advanced piece of semiconductor kit ever made: a High Numerical Aperture Extreme Ultraviolet lithography scanner.
Gudeng to build EUV pod factory in Japan
April 15, 2024
Gudeng Precision Industrial Co will launch a new facility in Fukuoka Prefecture’s Kurume to reduce its reliance on Taiwanese and Chinese production.
Shin-Etsu to build semiconductor materials plant in Japan
April 12, 2024
Industrial giant Shin-Etsu Chemical has confirmed it will invest $547 million in a new facility at Isesaki in Japan's Gunma Prefecture.
Huawei to develop lithography tech at new R&D centre
April 12, 2024
Chinese tech giant Huawei is reported to be building a new research unit in Shanghai. It wants to develop chipmaking tools that could eventually rival those of ASML, Canon, and Nikon.
Has Huawei invented a tech to bypass EUV lithography?
March 25, 2024
Reports say Huawei Technologies has achieved a breakthrough that will enable it to design advanced chips without the need for extreme ultraviolet lithography (EUV) machines.
ASML reaches 'first light' on High NA EUV
March 01, 2024
Dutch lithography firm ASML has confirmed that its next-gen high-numerical aperture extreme ultraviolet tool is functional.
Load more news