Samsung, ASML to collaborate on next-gen chip manufacturing

Samsung Electronics and ASML have announced an expansion of their long-standing strategic partnership, deepening collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies.

The companies will work together to accelerate the development and deployment of technologies that support the increasing performance and efficiency requirements of advanced semiconductor manufacturing, Samsung said in a press release.

Samsung will join the industry initiative to advance next-generation 12-inch photomask technology for future manufacturing. With High NA EUV, the transition to larger, 12-inch masks is expected to further increase fab productivity, lower chipmaking costs and remove stitching constraints. It will enable advanced chip manufacturers to fully leverage the advantages of High NA EUV, making future generations of leading-edge chips more cost-effective.

Samsung also plans to introduce ASML’s High NA extreme ultraviolet (EUV) lithography into future DRAM high-volume manufacturing by 2028, the press release said. 

“Samsung is committed to maintaining leadership in advanced semiconductor manufacturing, including memory and foundry, through breakthrough technologies and strong partnerships,” Young Hyun Jun, Vice Chairman & CEO, Samsung Electronics, said. “By further strengthening our collaboration with ASML, we are helping lay the foundation for the next generation of AI and semiconductor innovation.”

“Samsung has been one of ASML’s most important innovation partners for many years. Together, we have helped advance the technologies that underpin modern semiconductor manufacturing,” Christophe Fouquet, President and Chief Executive Officer, ASML, said. “As the industry enters a new era driven by artificial intelligence, close collaboration with our customers becomes even more important.”