USI completes its acquisition of Asteelflash
December 03, 2020ASE Technology’s subsidiary, Universal Scientific Industrial (Shanghai), has successfully completed the acquisition Asteelflash Group from Financière AFG S.A.S. (FAFG).
Top 10 tech industry trends for 2021
October 06, 2020As the DRAM industry officially enters the EUV era, NAND Flash stacking technology advances past 150L, says TrendForce as it provides its forecast of 10 key trends in the tech industry for 2021.
ASE expands with new manufacturing fab in Taiwan
August 19, 2020Advanced Semiconductor Engineering (ASE) has officially broken ground for its new advanced packaging fab at the Nantze Export Processing Zone in Kaohsiung, Taiwan.
ASE takes the lead among Top10 largest OSAT companies in 2Q20
August 17, 2020The border restrictions and national lockdowns instituted by various governments due to the COVID-19 pandemic’s impact in 1Q20 resulted in low inventory levels for clients of packaging and testing (OSAT, outsourced semiconductor assembly and test) companies and for distribution channels as well, according to TrendForce’s latest investigations.
ASE breaks ground on new Taiwanese factory
April 03, 2018The semiconductor manufacturer has officially broken ground on its latest factory building – K25, located in Kaohsiung, Taiwan.
ASE, Amkor and JCET top OSAT provider list for 2017
November 17, 2017The annual revenue from the global IC testing and packaging industry for 2017 is estimated to grow by 2.2 percent to reach USD 51.73 billion, according to the latest research from TrendForce.
Taiwan's IC design houses under pressure with Broadcom/Qualcomm deal
November 13, 2017Fabless semiconductor giant Broadcom announced on November 6 that the company is offering US$130 billion to acquire its rival Qualcomm.
Qualcomm with Brazilian plans
March 14, 2017Qualcomm and fellow chip manufacturer ASE invest in a chip facility in São Paulo.
China’s Semi sector to undergo rapid consolidation in 2017
November 11, 2016Numerous major participants in the global semiconductor sector are engaging in deal-making to make themselves larger and more competitive. As a result, different industries within the sector will be controlled by fewer companies in the future.
ASE breaks ground on new building – adding 1’800 employees
October 10, 2016The new building is part of ASE’s expansion plans on the research and development of advanced packaging technologies that will enable the market for the Internet-of-things.
Cooperation between ASE and SPIL becomes likely, says TrendForce
June 02, 2016Two major IC packaging/testing providers based in Taiwan, Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), signed a joint share-exchange memorandum of understanding on May 26, 2016 to establish a new holding company.
ASE to invest $60 million in Cypress subsidiary
May 02, 2016Advanced Semiconductor Engineering will invest USD 60 million in Deca Technologies – a Cypress subsidiary – and license Deca’s M-Series Fan-out Wafer-Level Packaging (FOWLP) technologies and processes.
SPIL responds to ASE’s offer
December 22, 2015On December 14, 2015, Siliconware Precision Industries received a proposal from ASE regarding a potential acquisition of 100% of the SPIL's shares. And now, SPIL is answering.
ASE proposes all cash acquisition of all SPIL shares
December 15, 2015Advanced Semiconductor Engineering has submitted a proposal to Siliconware Precision Industries Co., Ltd. (SPIL) to acquire the company.
ASE receives ISO 15408-EAL6 certification
November 30, 2015Six of Advanced Semiconductor Engineering production facilities in Nantze, Kaohsiung, Taiwan; K4, K7, K8, K10, K11 and K12, have received the ISO 15408-EAL6 certification.
ASE looking to hire 6'000 for Chungli facility
November 26, 2015Sales generated at Advanced Semiconductor Engineering's Chungli facility are expected to grow, the company is looking to grow its workforce accordingly.
Exar Corporation appoints new division VP of Asia operations
October 30, 2015Exar Corporation has appointed Edward Yang as Division Vice President of Asia Operations, effective October 19, 2015.
ASE and TKD JV is a done deal
September 04, 2015Advanced Semiconductor Engineering has officially inaugurated ASE Embedded Electronics Incorporated.
Romteck teams up with u-blox
August 21, 2015Romteck Australia, a provider of remote monitoring systems and services catering to fire services, airports, defense organizations and mining companies Australia-wide, collaborates with u-blox.
ASE to establish a JV with TDKLoad more news
June 08, 2015Advanced Semiconductor Engineering and TDK Corporation will establish a joint venture company in Taiwan which is expected to manufacture IC embedded substrates using TDK's SESUB technology.