Samsung starts mass production of next-gen V-NAND
April 26, 2024
Samsung Electronics has started making 286-layer NAND flash memory chips, which expand bit density by 50% compared with 8th-generation V-NAND tech.
Micron: government grant will kickstart $50bn investment
April 26, 2024
US memory giant Micron has officially announced its USD 6.1 billion CHIPS and Science Act grant, and says the cash injection will support a huge CAPEX project to 2030.
Festo and Phoenix Contact enter technology partnership
April 23, 2024
Festo, manufacturer of pneumatic and electrical automation technology, will use PLCnext Technology, the open ecosystem for automation from Phoenix Contact, in future intelligent devices.
Toshiba to axe 5,000 jobs as re-structure continues
April 22, 2024
Japan's Toshiba Corp is reported to have cut its staff count by 5000 – that's 10% of the total – as it tries to streamline its operations as a private company.
Silvaco files for IPO, closes deal with Micron
April 19, 2024
Silvaco Group has agreed an enhanced partnership with Micron just a few days after filing for a $100m initial public offering on the Nasdaq Global Market.
SK hynix and TSMC to collaborate on HBM4 innovation
April 19, 2024
SK hynix has signed an MoU with TSMC for work together on next-generation HBM, with plans to mass produce HBM4 chips from 2026.
Micron standing by for $6.1bn CHIPS and Science Act package
April 19, 2024
US memory chip specialist Micron Electronics will receive a US government subsidy worth USD 6.1 billion next week, say multiple reports.
Samsung slipped to third place in global top 20
April 18, 2024
According to Omdia's latest report the semiconductor industry experienced a downturn in the market, with 2023 revenues slipping 9% to USD 544 billion compared to 2022. This decline however follows two years of record growth – which only serves to illustrate the cyclical nature of the industry.
FPT says its “all In” on AI, automotive and semiconductors
April 17, 2024
FPT Corporation has unveiled its strategic directions for the 2024-2026 period, with five focused areas defined as AI, Automotive, Semiconductor, Digital Transformation, and Green Transformation.
Microchip acquires Neuronix AI Labs
April 16, 2024
Microchip Technology has acquired Neuronix AI Labs to expand its capabilities for power-efficient, AI-enabled edge solutions deployed on field programmable gate arrays (FPGAs).
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Intelligent power modules with new optocoupler from CT Micro
CT Micro offers the CTS480, an interface optocoupler for intelligent power modules (IPM) with a high CMR (Common Mode Rejection) value. It contains an AlGaAs LED and a photodetector with integrated Schmitt trigger to provide logic-compatible waveforms so that no additional waveform design is required. The highly integrated, compact power coupler is designed to drive motors in applications such as household appliances, fans, pumps and general drives.
Arm, Intel Google and Meta launch self-designed AI chips
April 12, 2024
The future direction for dominance in the AI chip space took another turn this week as four huge stakeholders revealed their own products.
Global semiconductor equipment billings slip in 2023
April 11, 2024
Worldwide sales of semiconductor manufacturing equipment edged down 1.3% to USD 106.3 billion in 2023 from an all-time record of USD 107.6 billion in 2022, SEMI reports.
South Korea to spend $6.94bn fighting 'all-out AI war'
April 09, 2024
South Korean President Yoon Suk Yeol has promised to invest 9.4 trillion won (USD 6.94 billion) to keep the country in the global AI race for the next 30 years.
Samsung Electronics expects 10x jump in profits
April 09, 2024
The post-pandemic slump appears to be over – if Samsung Electronics' Q1 profits projection is anything to go by.
SolarEdge acquires EV charging startup Wevo Energy
April 05, 2024
Publicly listed US firm SolarEdge has bought the entire share capital of Wevo Energy to boost its presence in the commercial and industrial (C&I) segment.
Its official: SK hynix to invest $3.87 billion in US plant
April 04, 2024
South Korean memory specialist SK hynix says that it will invest an estimated USD 3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products.
Taiwan earthquake spares DRAM and foundry production
April 03, 2024
In the wake of a 7.2-magnitude earthquake off the eastern coast of Taiwan at 7:58 AM on April 3rd, TrendForce immediately investigated the damage and operational status of various manufacturers.
2023 semiconductor market revenue down 9% from 2022
March 28, 2024
A new Omdia report reveals a downturn in the semiconductor industry, with revenue down 9% from USD 597.7 billion in 2022 to USD 544.8 billion in 2023. A decline that follows two years of record growth, highlighting the cyclical nature of the semiconductor market.
Farnell inks distribution agreement with Alliance Memory
March 27, 2024
Farnell has signed a global distribution agreement with Alliance Memory, bringing a significant new supplier to Farnell’s semiconductor portfolio.
Camtek receives $25M order
March 26, 2024
Camtek has received a new order for approximately USD 25 million from a tier-1 HBM manufacturer, for the inspection and metrology of High Bandwidth Memory (HBM).
Rochester and IM ensure availability of legacy storage solutions
March 26, 2024
Rochester Electronics and Intelligent Memory (IM) have joined forces to ensure the continued availability of mature and legacy DRAM and NAND storage solutions tailored for industrial and embedded applications.
Siemens to acquire business unit from ebm-papst
March 26, 2024
Siemens AG has signed an agreement to acquire the industrial drive technology (IDT) business of ebm-papst.
South Korea reveals new subsidy for Gyeonggi mega cluster
March 25, 2024
President Yoon Suk Yeol of South Korea has earmarked $372.86bn for the city of Yongin as the government starts the transformation of southern Gyeonggi into a hub for chip production.
MediaTek partners with Ranovus to enter the CPO market
March 25, 2024
Taiwanese chip firm MediaTek is making a move into the field of Heterogeneous Integration Co-Packaged Optics (CPO) via a partnership with optical communications firm Ranovus.
Singapore team develops revolutionary low power bit-switch
March 25, 2024
Academic researchers have created a microelectronic device that can potentially function as a high-performance “bit-switch”. It consumes 1,000 times less power than commercial memory technologies.
SK hynix starts volume production of industry’s first HBM3E
March 20, 2024
The South Korean memory giant has started volume production of HBM3E1, the latest AI memory product with ultra-high performance, for supply to a customer from late March.
300mm fab equipment spending to reach new highs in 2027
March 19, 2024
Global 300mm fab equipment spending for front-end facilities is forecast to reach a record USD 137 billion in 2027 after topping USD 100 billion for the first time by 2025, reports SEMI
Samsung to use MR-MUF tech in a bid to boost its HBM yields?
March 19, 2024
Korean memory giant Samsung is rumoured to have purchased a range of chipmaking equipment related to the mass reflow molded underfill (MR-MUF) method.
Cerebras Systems launches 'the world’s fastest AI chip'
March 15, 2024
AI specialist Cerebras has unveiled Wafer Scale Engine 3 – a chip featuring 4 trillion transistors and 900,000 AI cores, which is purpose built for training the industry’s largest models.
TikTok owner buys stake in InnoStar Semiconductor
March 15, 2024
Social media firm ByteDance, owner of TikTok, has bought into InnoStar to help the memory chip developer boost production of its virtual reality tech.
Intelligent Memory secures ESD certification for manufacturing facility
March 14, 2024
The manufacturer of industrial-grade memory product solutions has successfully gained a third-party certification for the protection against electrostatic discharge (ESD) in its manufacturing and warehouse facilities in Hong Kong.
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