IIT Kharagpur, A*STAR team up to advance semiconductor innovation
June 02, 2025
The MoU opens new avenues for joint research in advanced CMOS and post-CMOS technologies; heterogeneous integration and packaging; AI hardware accelerators; next-generation memory systems; photonics and quantum devices; and chip reliability, thermal management and failure analysis.
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NY Creates and Fraunhofer team up on 300mm memory R&D
May 20, 2025
NY Creates and the Fraunhofer Institute for Photonic Microsystems (Fraunhofer IPMS) have signed a Joint Development Agreement (JDA) aimed at advancing research and development of next-generation memory devices at the 300mm wafer scale.
IIT Madras launches two silicon photonics products
May 05, 2025
An R&D centre at IIT Madras has developed a fibre array attachment tool in partnership with izmo Microsystems, which will be integrated with izmo’s packaging facility for photonics chip packaging. The centre also launched a high-speed silicon photonics QRNG.
Certus Semiconductor joins TSMC IP alliance program
April 25, 2025
Certus, a US-based provider of custom I/O and ESD solutions, delivers production-proven IP that ensures seamless integration with TSMC process nodes, ranging from 180nm to 12nm.
Lightmatter’s photonic superchip advances interconnect innovation
April 18, 2025
With fully integrated fiber attachment supporting 256 fibers, Passage M1000 delivers an order of magnitude higher bandwidth in a smaller package size compared to existing CPO solutions.
indie partners with GF to boost automotive radar tech
March 07, 2025
These high-performance radar systems-on-chip (SoC), manufactured on GlobalFoundries’ 22FDX platform, will target 77 GHz and 120 GHz radar applications for advanced driver assistance systems.
SkyWater acquires Infineon’s Austin fab in strategic expansion
February 26, 2025
US-based semiconductor foundry, SkyWater Technology, has entered into an agreement to acquire Infineon Technologies’ 200mm fabrication facility in Austin, Texas (Fab 25). The transaction includes a long-term supply agreement between the two companies.
ams OSRAM secures €227M EU support for Austrian chip facility
February 25, 2025
ams OSRAM has received approval from the European Commission for up to EUR 227 million in funding under the European Chips Act to expand its semiconductor manufacturing in Premstätten, Austria.
ams Osram: "Our turnaround is in full swing"
February 12, 2025
Austrian semiconductor manufacturer ams Osram delivers cost savings ahead of plan, Q4 revenues and profitability above mid-point of guided range.
Automotive sensor market set to hit $14.3B by 2029
January 21, 2025
The global automotive sensor market is on track to grow from USD 9.3 billion in 2023 to USD 14.3 billion by 2029, driven by trends such as electrification and advanced driver-assistance systems (ADAS), according to a report by Yole Group.
Rumors: iPhone with camera sensors from Samsung
January 06, 2025
Years ago, Apple began using Sony camera sensors in its iPhones. But now India Today reports, citing recent rumors, that in 2026 these collaborations may be replaced by Samsung.
ESMC officially breaks ground on Dresden fab
August 20, 2024
Ground has been broken and the land preparation for ESMC's first semiconductor fab in Dresden, Germany has officially started.
VR/MR device shipments to reach 37 million units by 2030
August 05, 2024
TrendForce’s latest report reveals that shipments of near-eye displays are expected to increase year-by-year over the next few years following inventory clearance.
Construction at TSMC's Dresden plant could be weeks away
July 30, 2024
Work at TSMC's German facility has been delayed many times, but new reports suggest it is almost ready to break ground.
Doosan Tesna to start build of $160m chip testing plant
July 09, 2024
South Korea’s Doosan Tesna is set to construct a semiconductor testing factory in Pyeongtaek, Gyeonggi Province, to meet growing demand for the inspection of new system on chip (SoC) tech.
onsemi acquires SWIR Vision Systems
July 03, 2024
onsemi has completed the acquisition of SWIR Vision Systems, a provider of CQD (colloidal quantum-dot-based) short wavelength infrared (SWIR) technology.
EV Group and Fraunhofer IZM-ASSID expand partnership
June 18, 2024
Wafer bonding and lithography equipment supplier EV Group (EVG) has entered into a strategic partnership with Fraunhofer IZM-ASSID (All Silicon System Integration Dresden), to develop and optimise alternative bonding and debonding technologies for advanced CMOS and heterogeneous integration applications, including quantum computing.
TSMC to start construction of European plant this year
May 22, 2024
TSMC is reportedly planning to start construction of its first European manufacturing facility during the fourth quarter of 2024.
ams Osram to significantly expand production in Styria
May 14, 2024
ams Osram is strengthening its development and production site in Premstätten. Aldo Kamper, CEO of ams Osram AG, has presented plans to invest a total of EUR 588 million in the development and production site in Premstätten by 2030.
The next generation of transistors comes from the south of Sweden
May 08, 2024
NordAmps, a spin-off from Lund University, is looking to revolutionise the landscape of high-frequency wireless communication and sensing with its vertical nanowire transistor technology.
imec to set up new 300mm R&D facility in Spain
March 14, 2024
imec is teaming up with the Spanish government and the region of Andalusia, to establish a new 300mm R&D process line for specialised chip technologies.
Christian Koitzsch to head TSMC's European operation
January 05, 2024
Christian Koitzsch has left Bosch to become the president of TSMC's under-construction subsidiary in Dresden, Germany.
Siemens, sureCore and Semiwise team up on quantum computing
December 22, 2023
Siemens Digital Industries Software has joined forces with sureCore and Semiwise to develop cryogenic CMOS circuits for quantum computing systems.
Foxconn and Porotech form partnership on AR micro-displays
December 18, 2023
Two electronics giants have confirmed they are working together to commercialise MicroLED Microdisplays for augmented reality applications in wearable and smart devices.
NXP's investment plans cover four European countries
September 26, 2023
Austria, Germany, the Netherlands, and Romania are all included in NXP Semiconductors’ European expansion plans.
US foundry upgrades offering with new ALD system
September 07, 2023
SkyWater Technology has installed a new atomic layer deposition (ADL) System for the development and production of advanced technologies
Intel and Tower reaches new US foundry deal
September 06, 2023
Following the cancelled deal between Intel and Tower Semiconductor, a deal which would have created a new foundry giant, the companies have reached a new deal – a deal to cooperate.
Global smartphone production reaches 272M units in Q2
September 04, 2023
TrendForce reports global smartphone production has faced back-to-back quarterly declines.
13 new 300mm wafer fabs being brought online in 2023
August 11, 2023
At the end of 2022, there were 167 semiconductor fabs processing 300mm wafers for the fabrication of ICs, including CMOS image sensors, and non-IC products such as power discretes.
Japanese watchmakers and Western automakers boost micro LED market
August 10, 2023
Mass production of large displays and wearable devices is propelling the Micro LED market. TrendForce predicts that the market value of Micro LED chips will reach USD 27 million in 2023, indicating a YoY growth of 92%.
TSMC, Bosch, Infineon, and NXP establishes European JV
August 08, 2023
TSMC, Bosch, Infineon and NXP plans to jointly invest in European Semiconductor Manufacturing Company (ESMC) GmbH, in Dresden, Germany to provide advanced semiconductor manufacturing services.
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