Evertiq - First In Electronics News & Expo

Ad

Ad

chip_technology

June 29, 2026
IBM’s new sub-1 nm chip packs nearly 100 billion transistors onto a chip the size of a fingernail, nearly twice the density of IBM’s 2 nm chip, unveiled in 2021.

axonite_chip

June 29, 2026
While conventional ESD protection devices were primarily limited to controlling momentary discharges during chip manufacturing or assembly processes, the new technology enables complete on-chip control of harsh system-level EMC environments.

Ad

MIMCAP_silicon_interposer

June 18, 2026
By combining high-density embedded capacitors, a scalable modeling framework for passive components, and laser-assisted bonding for III-V chiplet assembly, the platform lays the foundation for next-generation wireless (mmWave and sub-THz) systems.

Motion

May 20, 2026
The financing positions Quantum Motion to deliver utility-scale and commercially viable quantum computers that fit inside existing standard data centres and racks.

chip

May 19, 2026
The US company’s MLX200 platform integrates multi-level RRAM arrays with mixed-signal compute engines to enable high-throughput vector-matrix operations within memory, while maintaining compatibility with advanced CMOS processes.

May 15, 2026
Through the JV, both companies expect to leverage Sony's expertise in sensor design alongside TSMC’s strengths in process technology and manufacturing excellence as part of a broader collaboration aimed at enhancing image sensor performance.

flags-HQ

May 11, 2026
Austrian-German semiconductor manufacturer ams Osram has agreed to divest its CMOS image sensor business to US-based indie Semiconductor for EUR 40 million, as part of a strategic refocusing toward AI photonics and augmented reality.

pile-of-wafers

May 07, 2026
A structural shift in the global mature-node foundry market is underway, according to research from TrendForce. Capacity cuts, surging demand for AI power components, and TSMC's planned reallocation are combining to push utilisation rates toward 90% — and set the stage for price increases.

UMC

May 04, 2026
Building on HyperLight’s collaboration with Wavetek, which brought TFLN photonics from laboratory innovation to a HVM line within a 6-inch CMOS foundry, Taiwan’s UMC is bringing to the partnership its 8-inch production capability and expertise.

server-hall

April 15, 2026
Extended lead times for key semiconductor and hardware components are increasingly shaping supply conditions in the server market, according to TrendForce.

Marco-Peter-2026

January 29, 2026
When German memory company Neumonda talks about bringing semiconductor memory manufacturing back to Germany, it sparks curiosity — not about the technology itself, but about the scale, the investment needed, and whether it’s actually possible.

dresden-render

January 28, 2026
European Semiconductor Manufacturing Company (ESMC) has celebrated the topping-out of its new office buildings at its Dresden semiconductor fab, the company said in a LinkedIn update. The ceremony marked the placement of the final structural beam in the central building.

Sapien_MOU

January 26, 2026
The two South Korean companies will advance the design and technical evaluation of CMOS backplane technology, which is a core component of micro-displays. This partnership covers both technology and business aspects.

quantum-technologies-1

January 19, 2026
Current quantum computers demand huge investment: custom fabrication, exotic cooling, specialist teams. Equal1 delivers a different model: quantum servers where cost, ease of deployment, power efficiency, and integration are first-order requirements.

crolles-fab-big-room

December 09, 2025
Quobly says that it has reached a key milestone in its roadmap toward industrial-scale quantum processors, with the first custom 28Si FD-SOI wafers from Soitec now cycling in STMicroelectronics’ 300 mm manufacturing facility in Crolles.

PCB-India_1

December 08, 2025
This modernization initiative supports the Government of India’s objectives under the India Semiconductor Mission (ISM), which aims to expand domestic semiconductor capability, reduce reliance on imports, and create accessible fabrication capacity for startups, academia and strategic sectors.

November 12, 2025
GlobalFoundries has entered into a technology licensing agreement with TSMC for 650V and 80V Gallium Nitride (GaN) technology. The move aims to accelerate GF’s next generation of GaN products for datacenter, industrial and automotive power applications and provide US-based GaN capacity for a global customer base.

quantum-computer_geralt

November 07, 2025
Under the agreement, SkyWater will fabricate and jointly optimize the superconducting process modules required to produce QuamCore’s SFQ digital controller, the ultra-low-power chip that interfaces directly with the qubits inside the cryostat.

Semiconductor_Founders

October 17, 2025
Built on a decade of research at MIT’s Palacios Group, Vertical’s breakthrough transistors use GaN. Vertical has demonstrated the technology on 8-inch wafers using standard silicon CMOS semiconductor manufacturing methods.

Simon-Stacey

October 14, 2025
Fabless semiconductor company Cambridge GaN Devices (CGD) has partnered with GlobalFoundries to manufacture its single-chip ICeGaN power devices. The agreement supports CGD’s fabless strategy and expands the company’s supply chain to meet increasing demand for energy-efficient GaN-based components.

building-2023

October 09, 2025
Imec has launched a new 300mm gallium nitride (GaN) program aimed at advancing power electronics technology and reducing manufacturing costs.

Kitakami-Plant-2025

October 02, 2025
Kioxia and Sandisk have started operations at a new semiconductor fabrication facility in Kitakami, Japan, aimed at producing advanced flash memory for applications including artificial intelligence.

Project

September 29, 2025
The STARLight project brings together a consortium of leading industrial and academic partners with the aim of establishing a high-volume manufacturing line, developing leading-edge optical modules, and fostering a complete value chain.

Pocatello-fab

September 18, 2025
US-based LA Semiconductor has launched the sale process for its wafer fabrication facility in Pocatello, Idaho, engaging Macquarie Group to oversee the transaction.

August 25, 2025
Together, the companies are advancing the development and commercialization of next-generation BCD (Bipolar-CMOS-DMOS) process technology, which allows different functions to be combined on a single chip, making devices more power efficient and compact.

sensor

August 22, 2025
Adopting high-volume, scalable manufacturing strategies, these products provide cost-effective solutions for both consumer and industrial market demands.

Leadership_Team

July 22, 2025
German photonic deep tech scale-up Q.ANT has brought to maturity the world’s first commercial photonic processor for real-world AI and HPC workloads — executing complex AI operations much faster while saving significant amounts of energy.

July 02, 2025
Navitas Semiconductor has announced plans to start 200mm GaN-on-silicon production in collaboration with Powerchip Semiconductor Manufacturing Corporation (PSMC), marking a new phase in the company's supply chain and technology strategy.

depth_sensor

June 11, 2025
The new sensor product employs a dToF pixel unit composed of 3×3 (horizontal × vertical) SPAD pixels as a minimum element to enhance measurement accuracy using a line scan methodology.

AStar_MOU

June 02, 2025
The MoU opens new avenues for joint research in advanced CMOS and post-CMOS technologies; heterogeneous integration and packaging; AI hardware accelerators; next-generation memory systems; photonics and quantum devices; and chip reliability, thermal management and failure analysis.

Fraunhofer-partnership-agreement

May 20, 2025
NY Creates and the Fraunhofer Institute for Photonic Microsystems (Fraunhofer IPMS) have signed a Joint Development Agreement (JDA) aimed at advancing research and development of next-generation memory devices at the 300mm wafer scale.

Madras_CoE_CPPICS

May 05, 2025
An R&D centre at IIT Madras has developed a fibre array attachment tool in partnership with izmo Microsystems, which will be integrated with izmo’s packaging facility for photonics chip packaging. The centre also launched a high-speed silicon photonics QRNG.

Load more news

© 2026 Evertiq AB

Ad