Evertiq - First In Electronics News & Expo

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quantum-computer_geralt

October 20, 2025
By combining SEALSQ’s PQC-enabled chip technology with IC’Alps’ ASIC design expertise, SEALSQ now offers a complete end-to-end solutions — from secure architecture and IP creation to certified production and lifecycle management.

Sponsored content by Koh Young

Visit

Seoul, Korea – Koh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany. Visitors can explore Koh Young’s latest advances in electronics manufacturing and semiconductor packaging at Booth A2.377 for Surface Mount Technology (SMT) and software innovations, and at Booth B1.213 for advanced packaging and semiconductor metrology.

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Expo-WAW24-26

October 17, 2025
Evertiq Expo Warsaw returns on 23 October 2025, bringing together Poland’s vibrant electronics community for a day dedicated to advanced technologies, manufacturing, and innovation.

Semiconductor_Founders

October 17, 2025
Built on a decade of research at MIT’s Palacios Group, Vertical’s breakthrough transistors use GaN. Vertical has demonstrated the technology on 8-inch wafers using standard silicon CMOS semiconductor manufacturing methods.

October 16, 2025
Murata Manufacturing says it is enhances its support for customers in the EMEA region and globally with its advanced electromagnetic compatibility (EMC) test laboratory in Nuremberg, Germany.

cutout-smartphone

October 16, 2025
Billions of euros worth of metals are lying unused in drawers across Europe. A new report from refurbed and Fraunhofer Austria reveals that unused smartphones in European households contain critical raw materials worth an estimated EUR 1.1 billion in total.

Kyushu

October 15, 2025
Tokyo Electron has completed a new development building for its subsidiary Tokyo Electron Kyushu in Koshi-shi, Kumamoto.

Simon-Stacey

October 14, 2025
Fabless semiconductor company Cambridge GaN Devices (CGD) has partnered with GlobalFoundries to manufacture its single-chip ICeGaN power devices. The agreement supports CGD’s fabless strategy and expands the company’s supply chain to meet increasing demand for energy-efficient GaN-based components.

Data-centre

October 14, 2025
ABB has entered into a collaboration with Nvidia to develop power solutions for next-generation, gigawatt-scale data centres.

Sponsored content by Koh Young

Visit

Seoul, Korea – Koh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany. Visitors can explore Koh Young’s latest advances in electronics manufacturing and semiconductor packaging at Booth A2.377 for Surface Mount Technology (SMT) and software innovations, and at Booth B1.213 for advanced packaging and semiconductor metrology.

300mm-fac-eq-spending

October 09, 2025
Global spending on 300mm semiconductor fabrication equipment is projected to reach USD 374 billion from 2026 and 2028, driven by rising demand for AI chips and efforts to strengthen regional semiconductor self-sufficiency, according to SEMI’s latest 300mm Fab Outlook.

building-2023

October 09, 2025
Imec has launched a new 300mm gallium nitride (GaN) program aimed at advancing power electronics technology and reducing manufacturing costs.

September 26, 2025
The collaboration marks a milestone in the evolution of photonics as a foundational technology for next-gen AI applications, including AR and human-centric digital experiences that require ultra-efficient, lightweight and high-performance optical systems.

peter-wawer-infineon-kazuhide-ino-rhom

September 25, 2025
Rohm and Infineon Technologies have signed a Memorandum of Understanding to collaborate on packages for silicon carbide (SiC) power semiconductors used in applications such as on-board chargers, photovoltaics, energy storage systems, and AI data centres.

September 24, 2025
onsemi has entered into an agreement with Aura Semiconductor to acquire rights to its Vcore power technologies, including associated IP licenses. This deal aims to enhance onsemi’s power management portfolio and roadmap, accelerating its goal to address the complete power tree in AI data centre applications.

g10-sic

September 23, 2025
Aixtron SE has shipped its 100th G10-SiC epitaxy system, highlighting growing global demand for its SiC deposition technology over the past three years.

NTT_wireless

September 22, 2025
By irradiating a laser beam with an optical power of 1 kW, the two Japanese companies succeeded in receiving 152 W of electric power 1 kilometer away.

Sponsored content by Würth Elektronik eisos

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In our highly connected world, the smooth operation and communication of electronic devices is of critical importance: They must neither be susceptible to electromagnetic interference, nor become a source of interference themselves. Würth Elektronik supports you in EMC optimization.

inaguration-villnius

September 19, 2025
TLT Manufacturing has inaugurated four new factories at the High-Tech Hill technology park in Vilnius, Lithuania, in what the company describes as a major step for European manufacturing resilience and intellectual property security.

Pocatello-fab

September 18, 2025
US-based LA Semiconductor has launched the sale process for its wafer fabrication facility in Pocatello, Idaho, engaging Macquarie Group to oversee the transaction.

3-phone

September 18, 2025
Consumer electronics company Nothing has secured USD 200 million in a Series C funding round at a valuation of USD 1.3 billion, the company's CEO Carl Pei announced in a community update.

PCB-India_3

September 18, 2025
As part of the collaboration, the companies will establish a state-of-the-art semiconductor validation and production test floor in Bangalore. The facility features clean room capabilities and equipment to productize silicon to volume production.

Production-Front-End

September 17, 2025
Semiconductor manufacturer STMicroelectronics plans to establish a new pilot line for Panel-Level Packaging (PLP) technology at its Tours facility in France, backed by a USD 60 million investment. The pilot line is expected to be operational in the third quarter of 2026.

axonite_chip

September 17, 2025
The total phased investment for the fully integrated SiC power semiconductor project in Dholera, Gujarat, is estimated to be over USD 1 billion. Work on the project is expected to start by April 2026.

Sponsored content by Transfer Multisort Elektronik

SE-evertiq-com700x300

During daily work with portable devices, light electrical equipment, or consumer electronics, an important role is played not only by the functionality of the device itself but also by the way it is powered. The guarantee of user comfort, safety, and durability of the entire system is a properly selected power cable. With such applications in mind, the company SIMECH has prepared a series of spiral power cords with a UNI-SCHUKO angled plug, which work perfectly wherever mobility, flexibility, and reliability are required.

University

September 10, 2025
A team of materials scientists at Rice University in Houston, Texas, optimized the precursor materials to lower the synthesis temperature of the 2D semiconductor and showed that it grows in a controlled, directional manner.

SiC

September 09, 2025
SiC and GaN semiconductors are becoming increasingly critical for the development of modern power electronics systems. As Marcin Mierzejewski (KERAFOL Keramische Folien GmbH & Co. KG) points out in an interview with Evertiq, leveraging these technologies gives engineers new opportunities – enabling component miniaturization, meeting growing demands for higher computing power, and addressing the challenges associated with rising power densities.

Electronics_Merck_MOU

September 08, 2025
Merck will offer its full suite of products and services, including high-purity electronic materials, advanced gas and chemical delivery systems, turnkey fab infrastructure services, and its Material Intelligence solutions powered by AI, for Tata Electronics’ fab in Gujarat.

Phasecraft

September 03, 2025
The new funding, which brings the total raised to over USD 50 million including grant funding, will allow the company to double down on its R&D breakthroughs and expand industrial efforts, building real-world solutions for end users.

board-2025

September 03, 2025
The Component Obsolescence Group Deutschland (COGD) is marking its 20th anniversary as it intensifies its efforts to help companies address the growing challenge of component and material obsolescence.

handheld-games-sales-volume

August 28, 2025
New Omdia research reveals 2.3 million PC gaming handhelds, including the Steam Deck, will be sold globally in 2025. This will represent growth of 32% from 2024, when 1.7 million units were sold.

office_logo

August 28, 2025
Toshiba Electronic Devices & Storage Corporation and SICC have signed a memorandum of understanding (MOU) to explore collaboration on SiC power semiconductor wafers, the companies announced.

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