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Phasecraft

September 03, 2025
The new funding, which brings the total raised to over USD 50 million including grant funding, will allow the company to double down on its R&D breakthroughs and expand industrial efforts, building real-world solutions for end users.

board-2025

September 03, 2025
The Component Obsolescence Group Deutschland (COGD) is marking its 20th anniversary as it intensifies its efforts to help companies address the growing challenge of component and material obsolescence.

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handheld-games-sales-volume

August 28, 2025
New Omdia research reveals 2.3 million PC gaming handhelds, including the Steam Deck, will be sold globally in 2025. This will represent growth of 32% from 2024, when 1.7 million units were sold.

office_logo

August 28, 2025
Toshiba Electronic Devices & Storage Corporation and SICC have signed a memorandum of understanding (MOU) to explore collaboration on SiC power semiconductor wafers, the companies announced.

new-Coating-Line-2025

August 27, 2025
EMS provider BMK has commissioned a new heavy-duty coating line, aimed at enhancing the company's technical capabilities and efficiency in protective coating of electronic assemblies.

August 25, 2025
Together, the companies are advancing the development and commercialization of next-generation BCD (Bipolar-CMOS-DMOS) process technology, which allows different functions to be combined on a single chip, making devices more power efficient and compact.

satellite_chips

August 22, 2025
The launch of the satellite culminates a decade-long partnership between Texas Instruments (TI) and the Indian Space Research Organization (ISRO) to optimize the performance of the electronic systems responsible for this Earth-observation mission.

hq-paderborn

August 21, 2025
Voltabox AG, soon to be renamed Voltatron AG, has signed an agreement to acquire all shares in GMS Electronic Vertriebs GmbH from Gebhart Holding GmbH.

PCB-India_2

August 20, 2025
The four new proposals approved are from SiCSem, CDIL, 3D Glass Solutions and ASIP Technologies. The SiCSem and 3D Glass units will be set up in Odisha, CDIL will expand its facility in Punjab, and ASIP will establish a plant in Andhra Pradesh.

India-CCL

August 19, 2025
Wipro Infrastructure Engineering (WIN) has set up a new business division, Wipro Electronic Materials, as the company looks to manufacture high-performance base materials for PCBs.

bike

August 18, 2025
Indian startup iGo, which operates under iGowise Mobility, focuses on electric platforms for urban and rural markets. The company’s strategy emphasizes collaboration with existing manufacturing infrastructure instead of building new facilities from the ground up.

August 14, 2025
GlobalFoundries has entered into an agreement with Apple for a deeper collaboration aiming to advance semiconductor technologies and strengthen US manufacturing.

Brium

August 14, 2025
US authorities have reportedly embedded concealed tracking devices in certain shipments of advanced AI chips to detect possible violations of export restrictions targeting China, according to sources cited by Reuters.

AI-Chip

August 13, 2025
TrendForce’s latest investigations find that the global electronics market in 2025 will be sharply divided.

tim-cook-event

August 07, 2025
Apple has announced a new USD 100 billion investment as part of a broader initiative to expand its operations and manufacturing footprint in the United States. The move raises the company’s total planned U.S. investment to USD 600 billion over the next four years.

global-wafer-shipments

August 06, 2025
SEMI reports that worldwide silicon wafer shipments increased 9.6% year-on-year to 3,327 million square inches (MSI) from the 3,035 MSI recorded during the same quarter of 2024.

production-2020

August 04, 2025
This new IP enables customers to design and build high-reliability mixed-signal SoCs entirely within a secure US supply chain. It will be released through SkyWater’s S130 platform.

PCB-EU_2

July 31, 2025
Semiconductor distribution sales in Europe experienced a significant decline of 14%, amounting to €2.20 billion. Among the major countries, Austria faced again the steepest drop with a decrease of almost 37%, followed by France with a reduction of 20%.

semiconductor_molecules

July 30, 2025
The investigators demonstrated the ability to produce semiconductor materials containing up to 50% magnetic atoms, whereas current methods are often limited to a concentration of magnetic atoms no greater than 5%.

Diraq

July 28, 2025
The funding was awarded through the Australian government’s Department of Industry, Science and Resources’ Critical Technologies Challenge Program. The project’s aim is to ascertain the feasibility of using quantum computers to improve the optimization of increasingly complex energy networks.

Leadership_Team

July 28, 2025
This funding further enables Silicon Valley startup xLight to develop the world’s most powerful EUV free electron lasers (FEL), which has the potential to revolutionize advanced semiconductor manufacturing and unlock other critical economic and national security applications.

July 25, 2025
The MEMS sensors portfolio to be acquired by ST primarily targets automotive safety sensors, both passive (airbags) and active (vehicle dynamics), as well as monitoring sensors (TPMS1, engine management, convenience, and security).

July 23, 2025
The 1024QAM modulation for downlink offers approximately 25% improvement in data throughput compared to the current 256QAM standard for the same frequency bandwidth.

Underfill

July 17, 2025
Underfill is typically a thermoset epoxy applied between semiconductor packages and PCBs or substrates. It delivers essential benefits: reinforcing solder-joint reliability, mitigating thermal expansion mismatches, improving thermal management, and enhancing mechanical durability.

Herzogenrath-2

July 16, 2025
Aixtron’s Close Coupled Showerhead (CCS) system is set in a 200mm configuration and is currently being installed at the Cambridge Graphene Centre to be used for the UK’s Layered Materials Research Foundry (LMRF).

ERP_Austin_campus

July 11, 2025
The new location, situated within a prominent Austin business complex, provides ample room for current operations and offers flexible space for future expansion as the company continues to scale.

building_logo

July 10, 2025
ROHM’s earlier Level 1 SPICE models for SiC MOSFETs addressed this need by precisely replicating key device characteristics. However, challenges such as simulation convergence issues and prolonged computation times revealed the need for further refinement.

India

July 09, 2025
The newly established India ESC is designed to help innovators and technology manufacturers adopt advanced technologies such as edge computing, energy management, automation and e-mobility.

chip

July 09, 2025
The heart of Arago's processor, codenamed “JEF,” is a proprietary photonic technology: instead of transistors, it uses lasers to process data with photons. The chip is designed to deliver 10× lower energy consumption than today’s leading GPUs at equivalent performance and cost.

GaN_Singapore

July 08, 2025
The centre brings advanced GaN manufacturing capabilities to Singapore, positioning local innovators to compete in high-growth global markets such as advanced 5G and 6G communication systems, radars and satellite communications.

Winslow

July 08, 2025
Anglia Components adds IC sockets, adapters and semiconductor hardware from Winslow Adaptics, a UK-based designer and component manufacturer.

office_logo

July 07, 2025
These advances are expected to greatly improve the reliability and efficiency of devices used in power conversion applications, such as electric vehicles and renewable energy systems.

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