Mastering Heat, Securing Performance Würth Elektronik eisos Mastering Heat, Securing Performance Various cooling concepts are available to efficiently dissipate heat from electronic components. However, if power losses are not removed reliably, performance degradation, premature aging, or even component failure may result. Selecting the appropriate heat sink and thermal interface material is therefore essential.
Murata to invest €5.7 billion to double MLCC sales October 30, 2026 Japanese component maker Murata plans to invest about JPY 1 trillion (about EUR 5.7 billion) over five years to expand its global production capacity for multilayer ceramic capacitors (MLCCs). The company expects MLCC sales in fiscal 2030 to be at least double those of fiscal 2025.
Wolfspeed announces SiC device supply deal with BorgWarner October 30, 2026 The agreement strengthens the companies’ longstanding collaboration while providing BorgWarner with a reliable, long-term supply of high-performance silicon carbide technology for next-generation EV and power conversion applications.
Fire at Rheinmetall construction site. Police suspect arson October 30, 2026 Three construction vehicles have been destroyed by fire at the site of Rheinmetall’s planned logistics centre and drone testing facility in Calden, central Germany. Police suspect arson and are investigating whether the fire was politically motivated.
Report: FCC votes to ban all Chinese labs from testing US electronics October 30, 2026 The FCC prohibitions, which are slated to take effect in December 2028, will bar test labs and certification bodies in countries including China that deny reciprocal treatment to US-based test labs.
ESCATEC adds controlled production room for medical manufacturing in the UK October 29, 2026 ESCATEC has completed a new controlled production room at its ESCATEC Mechatronics Ltd (EUK) site in Lutterworth, UK. The investment is meant to strengthen the plant’s ability to take on manufacturing for medical devices, healthcare and other highly regulated programmes.
Microsoft launches major buyout program for up to 60,000 employees October 27, 2026 Microsoft is launching a voluntary buyout program that could be available to as many as 60,000 employees, Reuters reported. The company aims to reduce costs while planning to invest $175 billion, primarily in artificial intelligence infrastructure.
Sponsored content by StarPower Europe AG StarPower and the New Discipline of Power Electronics Power electronics has entered a new phase—one defined not by incremental improvements, but by the ability to turn semiconductor performance into real, scalable system value. Efficiency, power density, and reliability are no longer isolated metrics; they are interconnected outcomes shaped by device physics, packaging, thermal design, and manufacturing execution. In this evolving landscape, StarPower is positioning itself as more than a component supplier—it is becoming an engineering partner in electrification.
Sponsored content by TME Transfer Multisort Elektronik Power Control and Circuit Protection – Solutions from Littelfuse and IXYS Power electronics systems must not only efficiently control the flow of energy but also handle phenomena that may threaten their components. In converters, inverters, power supplies, or drive systems, semiconductors frequently switch large currents and operate at high voltages. At the same time, they may be exposed to overvoltages originating both from the power grid and generated within the device itself.
US to provide up to $389 million in CHIPS awards to 4 firms October 23, 2026 Under the final awards, each company will conduct R&D to address critical projects spanning power semiconductor devices, modules and materials essential to the semiconductor supply chain.
Semtech secures dedicated SiGe capacity at Tower October 22, 2026 Semtech will invest in dedicated silicon germanium (SiGe) capacity at Tower Semiconductor under an expanded multi-year agreement. The capacity spans Tower’s fabs in the US, Israel and Japan and will support Semtech’s growing business in optical and copper interconnect components for AI data centres.
Neways to package Melexis pressure sensors in multi-year deal October 20, 2026 Neways has signed a multi-year partnership with Melexis covering the packaging of Melexis’ Triphibian pressure sensors. The sensors are used in thermal management for electric vehicles and AI data centres.
Flip Electronics announces distribution partnership with Synaptics October 19, 2026 Through this agreement, Flip Electronics will distribute Synaptics’ expansive portfolio of embedded compute, wireless connectivity, and sensing solutions, focusing on aged, end-of-life, and obsolete devices that support innovation across automotive and IoT market.
MintNeuro raises $5 million to scale chip platform for neural devices October 19, 2026 The London-based startup will use the investment to grow its engineering and commercial teams, bring its products to market, support customers as they adopt its chips, and strengthen its presence in the US alongside its UK and European base.
TCS launches Industrial Intelligence Foundry to boost AI-led engineering October 16, 2026 The Foundry will help enterprises embed intelligence into core engineering and manufacturing workflows for aerospace, mobility, semiconductors, medical devices, industrial electronics, utilities and energy.
XIVER adds ASML DUV lithography to its Eindhoven foundry October 15, 2026 Dutch specialty foundry XIVER has acquired an ASML PAS 5500 DUV lithography tool to make finer structures for photonic and semiconductor devices. The tool is expected to be in operation in 2027.
Nokia to sell private wireless business to Aurelius October 13, 2026 Nokia is selling Enterprise Campus Edge, its private wireless and industrial edge business, to investment firm Aurelius. The divestment is another step in Nokia’s strategy to concentrate its resources on fewer areas.
From inspiration to transformation: How Apator is building the factory of the future October 13, 2026 There is a certain paradox in electronics manufacturing. The more processes become automated, the more important those that still rely on human expertise seem to be. These are often the very stages where the quality of the finished product is determined – at workstations where correct assembly still depends on the operator's experience, concentration and attention to detail.
SEL to invest more than $500 million in US manufacturing October 13, 2026 Schweitzer Engineering Laboratories is investing more than USD 500 million in new plants, production equipment and staff across four US states. The goal is to raise its output of electronic devices by up to 60% to keep pace with growing demand from power grids and data centres.
Sponsored content by TME Transfer Multisort Elektronik About products Selec brand installation meters and current transformers Energy consumption in industrial plants is becoming an increasingly complex process due to many connected devices and continuous load fluctuations resulting from the nature of work. Most devices in industrial applications require high power to provide sufficient electrical energy to power large motors, heating systems, LED lighting, inverters, rectifiers, power supplies, and inductive circuits
US Department of War offers Wolfspeed $1.5 billion loan October 09, 2026 Silicon carbide maker Wolfspeed could receive up to USD 1.5 billion in 30-year financing from the US Department of War. In return, the department would get warrants for up to 7.5% of the company.
SiMa.ai raises $150 million in Series C to scale Physical AI October 05, 2026 The new funding brings the total capital raised by the US startup to USD 500 million, valuing it at USD 1.45 billion. The fresh capital will accelerate the scaling of Palette Neat, an agentic software environment for Physical AI.
Sponsored content by TME Transfer Multisort Elektronik Raytac Bluetooth Low Energy modules in TME's offer Contemporary communication has been dominated by wireless systems. Electronics increasingly rely on data exchange without the use of cables. This applies to household appliances, as well as industrial, medical automation, and Internet of Things solutions. One of the most commonly used short-range communication standards is Bluetooth, particularly its energy-efficient variant, Bluetooth Low Energy (BLE), which allows for the construction of compact battery-powered devices.
Aspirity acquires majority stake in Onomondo, leads €100M investment October 01, 2026 The investment will drive Danish IoT infrastructure and connectivity company Onomondo’s next phase of growth by expanding its international market presence and scaling its infrastructure deployment.
Broadcom and TOPPAN JV opens FC-BGA substrate plant in Singapore September 30, 2026 Advanced Substrate Technologies (AST), a joint venture between TOPPAN and Broadcom, has opened Singapore's first facility for high-end FC-BGA substrates. The plant comes online as substrate capacity remains a bottleneck for AI and networking chips.
Electronics reliability for demanding applications September 29, 2026 In modern electronics, reliability is no longer solely a characteristic of an individual component. In defense systems, automation, robotics and transportation, the success of a project depends on an entire chain of interdependencies: from accurately defining operating conditions, through the selection of materials and technologies, to component availability, manufacturing capabilities and product lifecycle management.
VSMC opens its first 12-inch fab in Tampines, Singapore September 28, 2026 VisionPower Semiconductor Manufacturing Company (VSMC) is a joint venture established by Vanguard International Semiconductor Corporation and NXP Semiconductors. Following 22 months of construction, the fab successfully processed its first sample lot.
Tata Electronics, Kelington to advance development of Dholera Fab September 25, 2026 Kelington will support the delivery of critical infrastructure and systems required for semiconductor manufacturing. The partnership will enable Tata Electronics to accelerate the facility’s operational readiness for silicon wafer production.
Semiconductor supply chain on the edge? September 24, 2026 The Q2-2026 semiconductor earnings rush is long gone, and even the laggards have now reported in their first Q3-2026 earnings calls. It is time to get a grip on what is going on in the semiconductor industry and its supply chain.
Will there be no tech under the Christmas tree this year? September 23, 2026 It is only September, yet Christmas has already arrived in the supermarkets. Gingerbread and holiday decorations are filling shelves, while retailers are preparing for the most important shopping season of the year.
Nexperia partners with Tata Electronics on semiconductor manufacturing in India September 23, 2026 Nexperia has announced a strategic partnership with Tata Electronics covering wafer fabrication, assembly and test, and technology development across two sites in India.
Tata Electronics, Sumitomo Chemical to boost India’s chip supply chain September 23, 2026 Under the MoU, both companies have agreed to explore a collaboration whereby Sumitomo will supply semiconductor materials, including photoresists, functional chemicals, and high-purity chemicals to Tata Electronics’ upcoming Fab in Dholera, Gujarat.