Samsung, Broadcom expand collaboration across memory, foundry tech July 28, 2026 On the memory front, Samsung and Broadcom plan to pursue a strategic collaboration for the supply of industry-leading memory solutions, including HBM, supporting Broadcom’s next-generation AI accelerators.
CEA, Playground Global sign MoU to bolster deep tech companies July 28, 2026 The collaboration aims to strengthen the pathway from laboratory innovation to global commercial impact by combining Playground’s expertise in building and scaling frontier technology companies with the CEA’s scientific research and technology-transfer capabilities.
Nvidia, Amkor sign $1.5 billion chip packaging agreement July 24, 2026 Nvidia and Amkor Technology will align their long-term roadmaps to advance technologies including high-density interconnects and next-generation heterogeneous integration.
University of Arizona, TU/e expand semiconductor, photonics cooperation July 24, 2026 The University of Arizona and the Eindhoven University of Technology in the Netherlands have signed a five-year MOU to align education and research activities with the needs of a rapidly growing semiconductor sector.
Taara launches link planner for wireless optical communications July 24, 2026 The platform allows users to plan deployments of Taara Lightbridge, the company’s wireless optical communications technology, which uses narrow, invisible beams of light to deliver high-capacity connectivity through the air between two fixed and easily deployable terminals.
AdvancedPCB installs new SES line at Aurora facility July 23, 2026 Supplied by Equip Tech and manufactured by Universal Circuit Board Equipment (UCE), the SES line incorporates automated chemical management, conveyorized material handling, and integrated process controls throughout the strip, etch and strip (SES) cycle.
Stop lobbying, start listening: Better policy begins with a conversation July 22, 2026 In late June I spent a full day in Brussels, moderating a room full of speakers, panelists, policymakers and manufacturers, all there to talk about the future of European electronics. By the end of it, one thing was obvious. Everyone in that room agreed the industry matters. Almost nobody disagreed about the stakes. And yet agreement is not the same as alignment, and the gap between "we support you" and "here is what we will actually do" is exactly where good intentions tend to disappear.
Paras to set up $644 million chip packaging facility in India July 22, 2026 Paras Semiconductors, a subsidiary of Indian company Paras Defence and Space Technologies, has signed an MOU with the Madhya Pradesh government’s department of science and technology to jointly set up an OSAT facility in the state’s Indore-Ujjain region.
Farnell partners with Hailo to accelerate edge AI innovation July 22, 2026 Farnell will offer Hailo’s AI products via their global distribution network, e-commerce platforms, and engineering community, enabling engineers, developers and enterprises to integrate advanced edge AI capabilities into their edge designs more efficiently and at scale.
Keiron raises €20.7M to advance LiFT precision solder paste printing July 22, 2026 Solder paste printing is responsible for over 70% of PCBA defects. Keiron’s HF2 LiFT (Laser-Induced Forward Transfer) printer replaces the stencil printer, jet printer and SPI inspection system with one digital, non-contact platform.
Qolab secures $54M to advance scalable quantum systems July 21, 2026 The financing will support the US company’s continued development of scalable superconducting quantum computing technologies, expansion of semiconductor collaborations, and acceleration of its target toward fault-tolerant quantum computing.
IndiGo selects Honeywell avionics, APUs to equip 810 new aircraft July 20, 2026 Under this agreement, Honeywell Aerospace will supply 131-9A auxiliary power units, advanced weather radar systems, traffic collision avoidance systems and flight management systems to Indian carrier IndiGo for its order of new Airbus A320neo aircraft.
Gremsy partners with Hexadrone to advance UAV solutions July 17, 2026 By combining Vietnamese firm Gremsy’s stabilization and multi-sensor technology with French company Hexadrone’s versatile, open-innovation aircraft architecture, the two companies are set to accelerate the commercialization of turnkey aerial systems.
Waaree Energy launches BESS container manufacturing facility July 17, 2026 The facility is equipped with advanced Industry 4.0 technologies, Automated Guided Vehicles (AGVs), intelligent material handling, automated assembly lines, and advanced testing and quality assurance systems.
ELIgnite awarded €5M to boost deep-tech innovation in Europe July 16, 2026 ELIgnite, a new Horizon Europe project coordinated by the Extreme Light Infrastructure ERIC (ELI), will streamline access to advanced laser facilities, making it easier for researchers to discover, apply for, and use ELI’s capabilities.
India approves $13.3 billion for fresh semiconductor push July 16, 2026 Companies involved in the manufacturing and R&D of the machines and manufacturing of materials, chemicals and gases that are essential for manufacturing semiconductors will be incentivized.
Kyndryl, Aptiv partner to power mission-critical systems globally July 16, 2026 Aptiv selected Kyndryl to provide advisory, implementation and managed service support to modernize their customer experience and product engineering. Kyndryl will deploy Aptiv’s Wind River software as part of its solutions portfolio.
Intel uses next-gen ASML tool to produce its laptop chips July 15, 2026 Intel Foundry has entered high-volume manufacturing for a subset of Intel Core Ultra Series 3 processors, code-named Panther Lake, using ASML’s EXE High NA EUV technology.
Mitsubishi Motors, Highlanders sign MOU to develop humanoid robots July 15, 2026 Under this MOU, the two companies will explore the joint development of humanoid robots for use at Mitsubishi Motors’ manufacturing facilities as well as mass production of Highlanders products at Mitsubishi Motors’ Kyoto Plant.
10 years on – Brexit and the “new normal” July 15, 2026 A decade after the UK voted to leave the European Union, the EMS and CEM sector is still adapting to the consequences. Brexit realised many fears around supply-chain disruption, labour shortages and regulation, but it also accelerated structural change and pushed companies to modernise operations.
Venus Aerospace raises $91 million to advance high-thrust RDRE July 15, 2026 The round will fund Venus as the Texas-based company scales development and production, moving its RDRE propulsion system from successful flight demonstration toward deployment for a range of near-term defense and space applications.
esmo marks 25 years, expands in Germany, China and Taiwan July 15, 2026 Today, the esmo Group employs approximately 285 people and generates annual revenue of around EUR 60 million through its two business divisions: semiconductor test solutions and special-purpose machinery.
Kontron launches production of 5G modules in Düsseldorf July 14, 2026 The new production line for 5G Automotive Network Access Devices (NADs) and 5G Industrial M.2 communication modules will consolidate Kontron’s position in a key future market.
Bosch announces $225 million funding deal with US government July 14, 2026 Bosch is investing up to $2 billion to transform the Roseville, California site into a facility that produces and tests SiC semiconductors with state-of-the-art processes and equipment.
Hanza optimizes its manufacturing cluster in Finland July 14, 2026 As part of this review, Hanza has transferred certain operations from its Finnish facilities in Nivala and Sievi to Hanza’s larger and more scalable production facility in Oulainen, Finland.
Richardson to manufacture power supply for C-Motive’s ZeroMag motor July 13, 2026 Richardson Electronics will provide DFM, engineering support, Alpha and Beta pilot production, production test development, quality planning, regulatory support and volume manufacturing services for C-Motive’s motor drive controller to prepare for commercial production.
Envision partners with Pulse on 310 MWh BESS project in UK July 13, 2026 Leveraging its expertise in AI-powered Future Energy Systems, Chinese green tech company Envision Energy will deliver a system-level storage solution integrating its Gen 7 BESS platform, advanced battery technologies and grid-forming capabilities.
Hical breaks ground on Tamil Nadu manufacturing facility July 13, 2026 The facility is being developed to expand the Bangalore-based company’s aerospace-qualified precision machining, fabrication and special process capabilities for global OEM programmes.
Sumitomo Chemical to establish JV with Samsung Electro-Mechanics July 13, 2026 The joint venture company will engage in the business of glass core substrates for advanced semiconductor packages. Glass core substrates are known for features like excellent rigidity, dimensional stability, low warpage and low thermal expansion.
Wolfspeed files patent infringement lawsuit against Navitas July 10, 2026 Products accused of infringement encompass major product lines of Navitas, including its GaN-based FETs — such as the GaNFast, GaNSlim, and GaNSafe product families — as well as Navitas's GeneSiC MOSFETs and SiCPAK modules. Navitas has refuted the allegations.
QUDORA partners with QAI to advance ion-trap quantum computing July 10, 2026 By combining German firm QUDORA’s quantum computing platform with Korean company QAI’s AI infrastructure and application expertise, the collaboration aims to demonstrate practical hybrid AI-quantum services in a real operational environment.
Six Robotics raises €12M to scale autonomy for unmanned systems July 10, 2026 Norwegian startup Six Robotics is developing an autonomy platform that enables multiple unmanned systems to operate together, adapting in real time to complex and contested environments.