Arteris joins Intel Foundry Accelerator Ecosystem Alliance
May 15, 2025
This collaboration will help mutual customers design electronics using Intel Foundry’s advanced process technologies. It will also support increased interoperability and the advancements beyond traditional node scaling by growing the chiplet ecosystem.
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Gravity to bring 5-minute EV charging to Greater LA
May 14, 2025
Each new site will be equipped with roughly twelve 500kW Distributed Energy Access Points (DEAPs) — nearly twice the speed of Tesla Superchargers. All sites will be designed to anticipate the needs of autonomous vehicles.
Chemical mechanical planarization market to reach $10.5B by 2035
May 13, 2025
This upward trajectory is driven by the increased complexity in semiconductor architectures, growing demand for miniaturized electronic components, and the expanding integration of advanced node technology across the microelectronics industry.
Japan’s EdgeCortix wins US defense innovation unit contract
May 13, 2025
The agreement empowers the US Defense Innovation Unit to rapidly evaluate and eventually deploy EdgeCortix’s hardware and software solutions across diverse US Department of Defense edge applications.
Drive TLV partners with NXP to advance smart mobility solutions
May 13, 2025
Drive TLV will facilitate collaborations between NXP and participating companies, identifying startups with the necessary capabilities and technologies to tackle industry challenges and bring market-ready solutions to fruition.
Sweden’s semiconductor moment in focus during Malmö panel
May 12, 2025
As demand for advanced technologies continues to rise, semiconductors have taken on a central role in enabling innovation across industries. On May 15th, during Evertiq Expo Malmö, a panel discussion will bring together voices from within the Swedish semiconductor ecosystem to examine the country’s position – and its prospects – within the global semiconductor landscape.
Tough times for hackers – Part 1: Basic regulatory principles
May 12, 2025
Cybersecurity is shifting into the focus of European regulation. According to the EU Radio Equipment Directive, by August 2025, products with radio technology and internet access must protect networks and personal data and prevent fraud. The EN18031 standard is designed to assist manufacturers in implementation.
DENSO, ROHM to establish semiconductor partnership
May 12, 2025
Going forward, both companies will integrate DENSO’s advanced system construction capabilities in the automotive sector with ROHM’s cutting-edge semiconductor technology, cultivated in the consumer market.
Mitsubishi Motors and Foxtron sign MOU for OEM supply of EV
May 12, 2025
The EV model to be supplied to Mitsubishi Motors as an OEM model will be developed by Foxtron, manufactured in Taiwan by Yulon Motor, and introduced in the Oceania region (Australia and New Zealand) in the second half of 2026.
AESC secures $1.3 billion to build EV battery plant in UK
May 12, 2025
The new gigafactory in Sunderland is expected to provide employment to over 1000 people and power 100,000 electric vehicles annually, six times more than the country’s current capacity.
Partstat, WIN team up to enhance chip storage solutions
May 12, 2025
The partnership between US-based Partstat and Taiwan’s WIN Semiconductors combines Partstat’s expertise in inventory management and storage with WIN’s advanced semiconductor manufacturing capabilities.
Sponsored content by SMT Renting & Panasonic
Automation in Focus: Panasonic Software and SMT Renting Drive Kemptron’s Smart Factory Integration
Kemptron Oy has taken a major step toward full factory automation with a complete solution delivered by SMT Renting and SMT House — covering everything from the turnkey Panasonic SMT line to the fully integrated automated warehouse system from Neotel Technology. Panasonic’s software platform seamlessly connects the production line with the warehouse solution from Neotel, enabling real-time material flow and boosting efficiency and autonomy. The entire setup was financed through SMT Renting’s flexible model, offering Kemptron a low-risk path to state-of-the-art manufacturing.
BAM, HZB, HU Berlin plan to establish Berlin Battery Lab
May 09, 2025
The lab will pool the expertise of the three institutions to advance the development of sustainable battery technologies. The joint research infrastructure will also be open to industry for pioneering projects in this field.
NEO unveils 1T1C and 3T0C IGZO-based 3D X-DRAM tech
May 09, 2025
Built on a 3D NAND-like architecture and with proof-of-concept test chips expected in 2026, the new 1T1C and 3T0C designs combine the performance of DRAM with the manufacturability of NAND.
Endurance Technologies to set up lithium-ion battery plant in Pune
May 09, 2025
The project involves a capital expenditure of USD 5.5 million and marks a strategic move by the Indian auto components manufacturer to expand into the growing mobility and battery energy storage sectors.
Veeco taps into AI-driven demand with $35M AP300 lithography orders
May 08, 2025
Veeco Instruments says it has received over USD 35 million of orders for its AP300 Lithography systems in recent quarters from a range of IDM and OSAT customers.
Germany greenlights €1B in support for Infineon's massive Dresden fab
May 08, 2025
Infineon Technologies has secured final approval from the German Federal Ministry for Economic Affairs for public funding to support its EUR 5 billion investment in a new semiconductor manufacturing fab in Dresden (Smart Power Fab).
InspeCity secures $5.6M to boost satellite life-extension tech
May 08, 2025
The funding will be deployed to space-qualify the Indian startup’s proprietary tech, grow its high-performance engineering team, and fasten the deployment of satellite life-extension platforms in global markets.
Smart Photonics speed up production set up with Aixtron
May 07, 2025
Aixtron supplies the Netherlands-based Indium Phosphide (InP) foundry Smart Photonics with its new G10-AsP system. The MOCVD solution for high-volume production of GaAs/InP materials will enable the foundry to increase its capacity and capabilities.
Jenoptik opens the doors to its new fab in Dresden
May 07, 2025
After around two and a half years of construction, Jenoptik has completed its largest single investment in recent history and officially inaugurated its new fab in Dresden, Germany.
Siemens and Intel expand collaboration on IC and packaging solutions
May 07, 2025
Siemens Digital Industries Software says its continued collaboration with Intel Foundry, has resulted in new product certifications, updated foundry reference flows, and new technology enablements for Intel’s advanced process nodes and packaging technologies.
CODICO and Cavli Wireless form partnership
May 07, 2025
Distributor Codico has entered into a strategic partnership with Cavli Wireless, a provider of cellular IoT connectivity solutions. Through the collaboration, Codico becomes the official distribution partner for Cavli’s advanced IoT modules throughout the European market.
Semiconductors take centre stage at Evertiq Expo Malmö 2025
May 06, 2025
Sweden is setting its sights on a stronger position in the global semiconductor industry. At Evertiq Expo Malmö 2025, experts, researchers, and industry leaders will gather to explore the future of Swedish electronics – from innovation and supply chains to concrete investments in domestic semiconductor capabilities.
AT&S starts high-volume manufacturing at new Kulim plant
May 06, 2025
IC substrate and PCB manufacturer AT&S is commencing high-volume manufacturing at its new facility in Kulim, Malaysia. AT&S Malaysia will deliver high-end IC substrates for AMD’s data centre processors, as well as for other customers.
VSORA raises $46M to bring powerful AI inference chip to market
May 05, 2025
The investment was led by Otium and a French family office with additional participation from Omnes Capital, Adélie Capital and co-financing from the European Innovation Council (EIC) Fund.
Southampton opens E-beam lithography chip facility
May 05, 2025
University of Southampton’s new E-beam lithography facility, just the second in the world, provides incredible accuracy critical to designing the tiny components that power technologies of the future.
NEXT partners with BAE to develop next-gen space-qualified chips
May 05, 2025
NEXT’s latest APU, the NX450, is the world’s first 200 GS/s antenna processor with 100-GHz of instantaneous RF bandwidth split across four independent receive and transmit channels respectively.
OKI develops 124-layer PCB tech for AI chip testing tools
May 02, 2025
This is a 15% increase in the number of layers over conventional 108-layer designs. Japan’s OKI Circuit Technology is seeking to establish mass production technology by October 2025 at its Joetsu plant.
LG Innotek targets $700M in FC-BGA sales with ‘Dream Factory’
May 01, 2025
LG Innotek has officially unveiled its fully automated semiconductor substrate plant, dubbed the “Dream Factory,” with the goal of growing its Flip Chip Ball Grid Array (FC-BGA) business into a USD 700 million operation by 2030.
Teledyne names George Bobb as CEO
April 30, 2025
Teledyne Technologies Incorporated has named George C. Bobb III as its President and Chief Executive Officer, effective immediately.
Report: Huawei develops new AI chip to compete with Nvidia
April 28, 2025
China’s Huawei Technologies hopes that its new chip, Ascend 910D, will prove to be more powerful than Nvidia’s AI chip H100, according to a report by The Wall Street Journal.
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