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signing-the-contract_2

October 06, 2026
Altera Corporation and Rutronik have signed a strategic distribution agreement to expand access to Altera’s FPGA portfolio across the European market, the companies announced in a press release.

dresden-cleanroom

October 06, 2026
Infineon Technologies has completed its acquisition of C2i Semiconductors, a Bengaluru-based company specialising in software-defined multiphase controllers and smart power stages for AI data centres. The C2i team now becomes part of Infineon's Power Systems division.

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October 06, 2026
Huawei and Qualcomm have signed a multi-year cross-licence agreement covering their patent portfolios in 5G, compute, AI and networking. As part of the deal, Qualcomm will also buy some of Huawei's US patents.

building

October 05, 2026
Under the agreement, Aviat has granted DEAPL, a subsidiary/JV of Indian EMS provider Dixon, a limited license to use specified intellectual property, including technical know-how, solely for the manufacture, use, offer for sale and sale of microwave radios.

October 05, 2026
The collaboration will combine Sony’s sensing and AI technologies with Aramco’s industrial data, operational experience, established infrastructure and portfolio of real-world industrial use cases.

Reactive_Technologies

October 05, 2026
Reactive Technologies’ platform, known as GridVerix, provides real-time measurements of key indicators of grid stability, including inertia as well as the strength and stability of voltage across different parts of the grid.

Electronics_chiller_factory

October 05, 2026
The company plans to invest a total of USD 110 million in a new air-cooled chiller production facility in the US and in expanding two air-cooled chiller production lines in South Korea.

Safran_Brazil

October 05, 2026
A key initiative under the agreement will be to establish solid rocket motor development and production capabilities at Brazilian EDGE Group entity SIATT’s facilities in Brazil.

modern-factory-with-robots_4

October 05, 2026
The new funding brings the total capital raised by the US startup to USD 500 million, valuing it at USD 1.45 billion. The fresh capital will accelerate the scaling of Palette Neat, an agentic software environment for Physical AI.

team

October 02, 2026
German energy-tech company Reverion’s solid oxide technology converts gas electrochemically into electricity, without combustion, and captures the CO₂ in the fuel stream in pure form that can be reused or permanently stored.

TDB

October 02, 2026
The technology is intended to support applications including wide-area and long-range surveillance, human and vehicle detection, and target classification, while enabling imaging across diverse weather and lighting conditions.

signing-the-contract_2

October 02, 2026
Founded in Shanghai in 2016, Puya Semiconductor supplies NOR Flash and EEPROM memories spanning a wide range of densities, voltage options, temperature grades, and package configurations for industrial, consumer, wearable, PC, mobile, automotive and IoT applications

opens-backend-manufacturing-hub-Thailand

October 01, 2026
Infineon Technologies has inaugurated a new backend manufacturing site in Samut Prakan, Bangkok. The site currently has one module but is designed to grow to five, which could make it one of Infineon's largest backend sites over time.

AST-JV-facility

September 30, 2026
Advanced Substrate Technologies (AST), a joint venture between TOPPAN and Broadcom, has opened Singapore's first facility for high-end FC-BGA substrates. The plant comes online as substrate capacity remains a bottleneck for AI and networking chips.

EPIC-center

September 30, 2026
Flash memory maker KIOXIA will join Applied Materials' EPIC Center in Silicon Valley as an innovation partner. It is the latest in a series of chipmakers to sign up.

Gotion

September 30, 2026
German automaker Volkswagen and Chinese battery manufacturer Gotion High-Tech are expanding their cooperation in electric vehicle battery production. Gotion will invest €1.1 billion (around $1.25 billion) in the PowerCo plant in Valencia, Reuters reported. Following the transaction, the Chinese company will hold a 49% stake in the factory, while Volkswagen will retain a majority stake.

Substrates

September 30, 2026
LG Innotek aims for its package solution business, which produces semiconductor substrates, to generate USD 647 million in operating profit by 2031. That is nearly eight times the level reached in 2025, as the company pushes into substrates for AI memory and CPUs.

building_logo

September 30, 2026
Samsung Electronics to invest USD 500 million; five other Samsung affiliates investing the remainder. Samsung commits to Helix’s global AI infrastructure build-out alongside KKR, Kuwait Investment Authority, NVIDIA and Vistra.

Discussion-Krakow-2026

September 29, 2026
In modern electronics, reliability is no longer solely a characteristic of an individual component. In defense systems, automation, robotics and transportation, the success of a project depends on an entire chain of interdependencies: from accurately defining operating conditions, through the selection of materials and technologies, to component availability, manufacturing capabilities and product lifecycle management.

Electronics_Besi_MOU

September 29, 2026
Leveraging Besi’s portfolio of advanced packaging solutions and global expertise, the collaboration will support the technology readiness of Tata Electronics’ semiconductor packaging facility in Assam and advance its journey toward next-gen packaging capabilities.

fab_Singapore

September 28, 2026
VisionPower Semiconductor Manufacturing Company (VSMC) is a joint venture established by Vanguard International Semiconductor Corporation and NXP Semiconductors. Following 22 months of construction, the fab successfully processed its first sample lot.

Dallara_car

September 28, 2026
The work combines Dallara’s expertise in high-performance vehicle engineering with IBM’s expertise in AI for physics and quantum computing to investigate how to accelerate aerodynamic design and open a path to even more advanced simulation workflows.

IC_Leadership_Team

September 28, 2026
In combination with mainstream CMOS semiconductor technology, the TUSK IC solution brings scalable, affordable connectivity to the next generation of LEO and MEO (Low & Medium Earth Orbit) satellite constellations.

Cleanroom_Texas

September 28, 2026
The new cleanroom is four times the size of Firefly Aerospace’s existing cleanroom and part of the company’s 144,000-square-foot campus in Cedar Park, Texas.

headquarters

September 25, 2026
Through AI-powered EDA flows, multiphysics-aware signoff methodologies, multi-die design flows, and silicon-proven Interface and Foundation IP, Synopsys and TSMC are helping customers address growing design complexity.

TSMC_design

September 24, 2026
As part of this collaboration, Siemens and TSMC have enabled an AI-powered agent for automated design rule check (DRC) fixing across digital and custom integrated circuit (IC) design flows.

Lockheed_Martin

September 24, 2026
An intermediary was transporting the parts on behalf of F-35 manufacturer Lockheed Martin. It wasn’t immediately clear why the shipment was rerouted or how it ended up in Hong Kong. The F-35 is one of the world’s most advanced fighter jets.

September 24, 2026
The acquisition is intended to foster an open robotics ecosystem, providing developers with the tools, software and frameworks needed to move more efficiently from research and experimentation to prototyping, deployment and production at scale.

Marco-Mezger-2026

September 23, 2026
It is only September, yet Christmas has already arrived in the supermarkets. Gingerbread and holiday decorations are filling shelves, while retailers are preparing for the most important shopping season of the year.

September 23, 2026
Valens will work with onsemi on the cost-optimized A-PHY offering that can be integrated into onsemi’s image sensors. The collaboration strengthens the A-PHY ecosystem by bringing together complementary expertise in connectivity and automotive imaging technologies.

September 22, 2026
beflex complements Kontron Electronics’ service portfolio in early-stage and near-series project phases, from the implementation of initial functional samples to near-series prototypes.

Energy_Osaka_hub

September 22, 2026
In collaboration with the Suminoe Production Development Facility in Osaka City, Energy Innovation Square will help accelerate the development and mass production of next-generation batteries for automotive and data center applications.

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