Graid secures $30M to boost data storage, protection
March 10, 2025
This Series B funding round was led by HH-CTBC Partnership, a joint venture fund between Foxconn and CTBC, alongside Yuanta Ventures.
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US to hold over 20% of advanced chip capacity by 2030
March 06, 2025
The US is projected to hold 22% of global advanced semiconductor manufacturing capacity by 2030, driven by TSMC’s expanded investment in US production, according to TrendForce. TSMC has increased its total investment in its US operations to USD 165 billion, with three newly planned fabs set to begin mass production after 2030.
Tata Electronics to set up display chip unit in Gujarat
March 06, 2025
Tata Electronics signed an MoU with Taiwan’s Himax Technologies and PSMC to boost India’s display and ultralow power AI sensing product and technology ecosystem.
Trump slams CHIPS act in congress – credits tariffs for investments
March 05, 2025
In an address to Congress on Tuesday, US President Donald Trump called the CHIPS Act a “horrible, horrible thing” and credited his administration's economic policies for a surge in domestic investment.
Intel postpones $28 billion chip manufacturing project
March 05, 2025
Intel has announced the postponement of its planned USD 28 billion chip manufacturing project in Ohio until 2030.
Toray opens semiconductor R&D centre in Taiwan
March 05, 2025
The new facility will reinforce R&D in advanced semiconductor technologies and materials and provide technical services in the Taiwan market.
Taiwan semiconductor market to reach $66 billion by 2031
February 28, 2025
It is anticipated that the industry will maintain strong growth to meet rising demand for semiconductor materials in emerging technologies like AI, autonomous driving, the Internet of Things, and 5G.
Spirox opens semiconductor verification lab in Taiwan
February 26, 2025
Semiconductor equipment provider, Spirox Corporation, plans to build the first power semiconductor dynamic reliability verification laboratory in the Asia-Pacific region.
Cambridge GaN Devices secures $32M to drive growth
February 19, 2025
Cambridge GaN Devices (CGD) has successfully raised $32 million in a Series C funding round, led by a strategic investor with contributions from British Patient Capital and existing backers. This funding will allow the company to expand its operations in Cambridge, North America, Taiwan and Europe.
GA-ASI, CAE sign agreement to develop next-gen Mission Trainer
February 19, 2025
The agreement will enhance the training capabilities for operators of MQ-9B and builds on the long-standing business relationship between GA-ASI and CAE, according to a media release.
Blueshift Memory start £2.77M project with AP Memory & Syntronix
February 19, 2025
Blueshift Memory, designer of a novel high-speed memory architecture, has secured a UK-Taiwan Bilateral R&D grant from Innovate UK for a project worth GBP 1.2 million in the UK.
Mitsubishi Electric, HD Renewable Energy sign JV
February 17, 2025
As part of their collaboration, the companies will establish an aggregation business joint venture and Mitsubishi Electric will acquire a stake in HD Renewable Energy, according to a media release.
Fujifilm to invest $26M in Belgium for CMP slurries
February 07, 2025
Fujifilm is making an investment of approximately 4 billion yen (around 25 million EUR or 26 million USD) to expand the production capacity of its Belgium site, based in Zwijndrecht, Antwerp.
Satya to manufacture and distribute Duracell products
February 05, 2025
The licensing agreement is expected to enhance Satya Intl’s market position by leveraging Duracell’s reputation for quality and reliability in battery technology.
The EU in Trump's crosshairs as tariff war expands
February 03, 2025
President Donald Trump is escalating his trade war, imposing new tariffs on key US trading partners, with the European Union now in his sights.
L&T Semiconductor Technologies unveils $10 bn fab plan
January 27, 2025
Huge silicon fabrication plant investment dependent on revenue targets
India to launch first semiconductor chip in 2025
January 27, 2025
Davos announcement confirms that India is set to take the plunge into new market this year
Minimal impact on wafer fabs following Taiwanese earthquake
January 23, 2025
A magnitude 6.4 earthquake struck southern Taiwan near Chiayi in the early hours of January 21, 2025. According to TrendForce, preliminary assessments indicate minimal damage to nearby wafer fabs.
US tightens export controls on advanced AI technologies
January 15, 2025
The US Department of Commerce's Bureau of Industry and Security (BIS) has issued an interim final rule, effective January 13, 2025, enhancing export controls on advanced computing ICs and certain artificial intelligence (AI) model weights.
TSMC's Arizona facility has started 4nm production
January 13, 2025
Taiwan Semiconductor Manufacturing Co is now officially manufacturing 4-nanometer chips for its US customers in Arizona, says the US government.
Rapidus targeting 2nm chip production for Broadcom
January 13, 2025
Fresh reports say Japanese foundry Rapidus will begin trial production of 2nm chips in April 2025, and has Broadcom lined up as its first major customer.
TSMC's 2024 annual revenue is an all-time record
January 13, 2025
Taiwan Semiconductor Manufacturing Company (TSMC) has recorded total revenue of USD 90 billion for 2024. It's the firm's highest annual sales total since it went public in 1994.
Eighteen new semiconductor fabs start construction in 2025
January 08, 2025
The semiconductor industry is gearing up for a major expansion, with 18 new fabs set to start construction in 2025, according to the latest World Fab Forecast report from SEMI. These projects, spanning three 200mm and fifteen 300mm facilities, will primarily start operations between 2026 and 2027.
Inventec laboratory for developing UWB solutions is powered by NXP
January 08, 2025
Investec has launched a lab at its facility in Taoyuan, Taiwan. The laboratory aims to design and develop Ultra-Wideband (UWB) based systems for the automotive industry by leveraging NXP’s solution offering including the NXP Trimension UWB portfolio.
TSMC plans two more fabs in Kaohsiung
December 30, 2024
The construction of the P4 and P5 fabs is scheduled to be completed in 2027, the Taipei Times report said. The five facilities are expected to create 8,000 jobs.
Foxconn invests $82M in EV battery plant in Zhengzhou
December 26, 2024
The move is another attempt by Foxconn to diversify beyond its iPhone business with forays into sectors such as EVs, semiconductors and robotics, the South China Morning Post report indicates.
Ventec expands with new PCB material facility in Thailand
December 17, 2024
Ventec International Group has chosen Thailand as the location for a new state-of-the-art PCB materials manufacturing facility.
Rohm, TSMC launch GaN partnership for EV sector
December 13, 2024
The partnership will integrate Japanese semiconductor company Rohm’s device development technology with TSMC’s GaN-on-silicon process technology.
Global semiconductor market to grow by 15% in 2025
December 12, 2024
Market intelligence firm IDC says that AI and High-Performance Computing (HPC) will drive growth in advanced chips, 2nm technology, and packaging, reshaping the semiconductor industry in 2025.
Global semiconductor equipment sales to reach $139B in 2026
December 11, 2024
Global sales of total semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecast to set a new industry record, reaching USD 113 billion in 2024, growing 6.5% year-on-year, SEMI reports.
TSMC, Nvidia in talks for AI chip production in Arizona
December 06, 2024
However, Nvidia’s Blackwell chips will have to be shipped back to Taiwan for packaging since the Arizona facility does not have the necessary CoWoS capacity, the Reuters report says.
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