Sponsored content by PEI-GENESIS Connector Technology at the Core of Ground Vehicle Modernization Ground combat vehicles are rapidly evolving from fixed-function platforms into modular, software-defined systems. This shift demands interconnect solutions that support continuous upgrades without requiring redesigns of wiring infrastructure. Scalable, high-reliability connectors, particularly those based on MIL-DTL-38999, are central to enabling this transformation.
Air Liquide invests over $170M to back SK hynix’s US fab July 03, 2026 Air Liquide will deliver large volumes of nitrogen, oxygen, argon, hydrogen and other industrial gases to SK hynix’s new cutting-edge advanced chips packaging facility.
MediaTek, Samsung achieve 3Tx 5-layer uplink breakthrough July 03, 2026 Building off the first successful three transmit antennas (3Tx) advancement, this trial integrated 3Tx, leveraging a multi-band setup that combined n66 (1.7GHz) as the primary cell and dual n77(3.7GHz) carriers across five uplink layers, delivering speed and efficiency.
Kimball Electronics acquires Dutch medical CDMO Helvoet July 02, 2026 US electronics manufacturer Kimball Electronics has acquired Helvoet Polymer Technologies B.V., a Dutch contract development and manufacturing organisation specialising in micro-molding and precision injection molding for medical applications. The purchase price is EUR 90 million, or approximately USD 103 million.
Shell Recharge, SINEXCEL launch lab to advance EV charging tech July 02, 2026 The Joint Laboratory in Shenzhen will serve as a hub for technical exchange, collaborative R&D, project incubation and pilot exploration with a focus on areas such as ultra-fast charging, cloud-charger synergistic scheduling and megawatt charging.
Kurita, Membrane establish JV to cater to Indian chip industry July 02, 2026 Japan’s Kurita Industries provides a range of water treatment solutions for the electronics industry, including semiconductors, in Japan, East Asia, North America and Europe, which is essential for their manufacturing processes.
Kingboard sells stake in subsidiary to ramp up PCB capacity July 01, 2026 Kingboard Holdings has sold a 4.92% stake in its laminates subsidiary, Kingboard Laminates Holdings, raising net proceeds of approximately HKD 11.8 billion – roughly EUR 1.4 billion. The capital is earmarked for PCB capacity expansion and multi-layer and HDI capabilities.
Fujifilm partners with Gujarat to boost chip materials manufacturing July 01, 2026 Fujifilm India aims to assess opportunities to establish a semiconductor materials production base in Dholera, Gujarat, while working closely with government stakeholders, industry bodies and private enterprises to strengthen a semiconductor supply chain.
Assel upgrades SMT line to boost production capacity June 30, 2026 EMS provider Assel has completed the modernisation of its surface-mount technology (SMT) line. The Polish company has replaced its existing pick-and-place machines with three new ASM SIPLACE SX systems. The investment is expected to increase production efficiency, improve placement accuracy, and reduce line changeover times.
MKS expands Atotech site in Guangzhou with $25 million investment June 30, 2026 MKS is expanding its Atotech equipment manufacturing site in Guangzhou, China, adding around 323,000 square feet of space and aiming to double the site's production capacity by the fourth quarter 2027. The investment totals USD 25 million.
FTG opens its first manufacturing facility in India June 30, 2026 Firan Technology Group has held the grand opening of FTG Aerospace Hyderabad, marking the culmination of a three-year effort to establish operations in India. The facility produces cockpit and avionics products and becomes FTG's fourth global manufacturing location, alongside Canada, the United States and China.
Frankenburg Technologies opens missile assembly factory in Riga June 30, 2026 Frankenburg Technologies has opened a missile assembly factory in Riga, Latvia – the first missile production facility in the Baltic region. The site produces the company's Mark I guided air defence missile and forms the first part of what will become a two-site Latvian production system.
Five cities, five expos, one season – and then something new June 29, 2026 Dennis Dahlgren and Ewelina Bednarz reflect on the spring Expo season and look ahead to their first trip to the International in4ma EMS & PCB Forum in Würzburg.
Indian space-tech startup QOSMIC raises $3.3 million June 29, 2026 The fresh funding will be used to deliver operational optical ground stations and satellite terminals to international customers, scale integration, testing and manufacturing, and expand its engineering teams across optics, mechanical systems and electronics.
Voltatron wins contract to supply electronics solutions June 29, 2026 The agreement covers the supply of complex, highly integrated functional modules to the customer for use in peripheral devices deployed in industrial applications within the field of electric mobility. The annual order volume exceeds EUR 10 million.
Sponsored content by POLYRACK TECH-GROUP How developers choose the right solution between LCD, OLED and e-paper Today, displays are a central element of electronic systems – far beyond their traditional role as output devices. They directly influence user interaction, power consumption, thermal behavior and ultimately the overall system architecture. Whether in embedded systems, medical devices, test equipment or mobile applications, developers must define the display technology early in the design phase. This decision has a direct impact on hardware, software and mechanical integration – and is difficult and costly to change later.
Schweizer Electronic and Ascent Circuits plan PCB cooperation in India June 26, 2026 German PCB manufacturer Schweizer Electronic and Indian PCB maker Ascent Circuits – part of the Amber Group – have announced plans for a strategic cooperation in PCBs. The partnership targets automotive and industrial applications and is framed around supply chain resilience for customers in Europe and the United States.
Samsung unveils ‘industry’s fastest’ UFS 5.0 solution June 26, 2026 The enhanced performance is expected to allow mobile device users with significantly reduced latency and faster response times when running large language models (LLMs) in on-device AI environments.
Incap Slovakia adds cleanroom capability in Námestovo June 26, 2026 Incap Electronics Slovakia has invested in cleanroom production capability at its Námestovo facility in Slovakia to support customers with contamination-sensitive assembly requirements, particularly in semiconductor-related applications.
Joynext opens new production hall in Poland June 25, 2026 Chinese automotive electronics manufacturer Joynext opened a new 13,300 square-metre production hall at its site in Oborniki Śląskie near Wrocław in Poland in April, bringing the site's total production area to approximately 26,000 square metres.
Why does signal integrity determine the effectiveness of defence systems? June 25, 2026 The effectiveness of modern defence systems is no longer defined solely by the number of tanks, aircraft, missile launchers, or soldiers. Increasingly, real military capability depends on the reliability of the electronics responsible for maintaining communications, surveillance, data processing, and weapons control.
Evertiq Expo Berlin 2026 – through the lens June 25, 2026 Siemensstadt was a deliberate choice for the move of Evertiq Expo Berlin. The district was once a city within a city – an entire industrial ecosystem built around a single company, now being reimagined for the next generation of technology. It felt like the right place for a day spent discussing what European electronics manufacturing is, and what it needs to become.
Adam Ryder appointed Managing Director of Incap UK June 23, 2026 EMS provider Incap has appointed Adam Ryder as Managing Director of Incap Electronics UK, effective June 17. He joins the company's extended management team.
Evertiq Expo Berlin 2026 wraps up the first half of the year June 22, 2026 Evertiq Expo Berlin 2026 took place on June 18 at TEC Event Campus in Berlin's Siemensstadt district – a new venue for the event, which previously called Technology Park Berlin Adlershof home. The day brought together 328 people from 199 companies, with 163 visitors meeting 78 exhibiting companies.
Fideltronik secures USD 30 million contract in the renewable energy sector June 22, 2026 Polish electronics manufacturer Fideltronik has signed an agreement with one of the leading companies operating in the renewable energy industry. The contract, valued at USD 30 million, covers comprehensive printed circuit board (PCB) assembly services.
Renesas acquires Pictorus to accelerate embedded system development June 19, 2026 With the acquisition of Pictorus, Renesas gains a cloud‑based behavioral modeling platform that accelerates embedded system development, moving the engineering experience beyond point tools by providing a connected platform for model-based system design.
Brewer to acquire Heraeus Epurio’s semiconductor chemical business June 19, 2026 The acquisition expands Brewer Science’s advanced materials portfolio and strengthens its ability to support semiconductor customers with highly specialized, ultrapure chemical solutions critical to advanced lithography and microdevice fabrication.
Edge, Safran sign deal to deepen aerospace, defense cooperation June 19, 2026 The two companies have also announced a joint venture term sheet for the co-development of an extended-range precision-guided weapon based on the Hammer family.
Europe's top 20 EMS companies: a fragmented landscape with pockets of strength June 18, 2026 With 31 companies in the global EMS/ODM Top 100, Europe has breadth – but not scale. A look at the region's top 20 reveals a manufacturing base spread across 14 countries, led by Germany and with the Nordics punching well above their weight.
Rohm partners with Aixtron to scale GaN power device production June 18, 2026 The installation of Aixtron’s G10-GaN system at the Hamamatsu plant supports Rohm’s transition toward increased vertical integration and strengthens its ability to scale production for next-generation power semiconductor applications.
DELTEC acquires Cicor's Tunisia facility – expands into international EMS network June 18, 2026 German EMS provider DELTEC has acquired Cicor Digital Tunisie, the Borj-Cedria facility in Tunisia that Cicor announced it was divesting earlier this month. The acquisition, completed by DELTEC owner Carsten Ellermeier, brings around 100 employees into the DELTEC network.
Samsung, LG Uplus collaborate on ISAC technology for 6G June 18, 2026 Under the partnership, Samsung Research will develop core Integrated Sensing and Communication (ISAC) and AI-driven 6G technologies while LG Uplus will lead validation including data provision and field-testing infrastructure setup.