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EPIC-Semiconductor-Centre

March 11, 2026
Applied Materials and SK hynix have signed a long-term research and development agreement aimed at accelerating the development of next-generation memory technologies for artificial intelligence systems.

EPIC-Semiconductor-Centre

March 10, 2026
Applied Materials and Micron Technology are teaming up to develop next-generation memory technologies for AI systems. The work will take place at Applied Materials’ EPIC Center in Silicon Valley and Micron’s research facility in Boise, Idaho.

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February 26, 2026
SK hynix and Sandisk have announced the start of a global standardisation initiative for next-generation memory solution, High Bandwidth Flash (HBF) aimed at the AI inference era.

DRAM5-products

February 26, 2026
A sharp upswing in DRAM contract prices drove global industry revenue to USD 53.58 billion in the fourth quarter of 2025, up 29.4% sequentially, according to the latest analysis from TrendForce.

inspection

February 13, 2026
Camtek has received an order worth approximately USD 25 million for its Hawk inspection systems from a tier-1 integrated device manufacturer (IDM).

global-wafer-shipments-msi-february-2026

February 12, 2026
Global silicon wafer shipments increased in 2025, while total wafer revenue declined slightly, according to year-end data from SEMI.

DRAM5-products

February 02, 2026
The global memory market is heading toward historically sharp price increases in the first quarter of 2026, according to a new forecast from market research firm TrendForce.

February 02, 2026
SK hynix has announced plans to establish a new AI-focused subsidiary in the United States as part of its strategy to expand beyond memory manufacturing and strengthen its position in the AI data centre ecosystem.

Groundbreaking-singapore-expansion-2026

January 27, 2026
Micron Technology has broken ground on a new advanced wafer fabrication facility in Singapore, marking a planned investment of approximately USD 24 billion over the next ten years.

COO-Marco-Mezger-column-portrait

January 16, 2026
The memory super cycle is no longer a forecast - it is a reality. Across all major financial institutions and industry media, we see the same message. 2026 will be defined by structural undersupply, especially in DRAM and NAND. Here’s what we are seeing.

Santa-Clara-HQ-Entrance

January 13, 2026
Worldwide semiconductor revenue reached USD 793 billion in 2025, up 21% from 2024, according to preliminary results from Gartner.

DRAM5-products

January 05, 2026
Global memory prices are set to rise sharply in the first quarter of 2026 as suppliers continue to prioritise server and AI-related applications, according to TrendForce.

December 18, 2025
ASMPT said it has secured new orders for 19 chip-to-substrate (C2S) thermo-compression bonding (TCB) tools from an unnamed outsourced semiconductor assembly and test (OSAT) provider supplying a leading foundry focused on AI chips.

semiconductor-equipment-market-by-segment

December 17, 2025
Global sales of total semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecast to reach a record high of USD 133 billion in 2025, growing 13.7% year-on-year, reports SEMI.

Claus-Aasholm

December 16, 2025
What can be learned from the Q3-25 results of the Semiconductor Industry?

global-map

December 03, 2025
Industry analyst Claus Aasholm on why the supply-demand forces that once stabilised DRAM pricing have permanently shifted.

DRAM5-products

November 26, 2025
The global DRAM industry reported total revenue of USD 41.4 billion in the third quarter of 2025, up 30.9% quarter-on-quarter, according to research firm TrendForce. The increase was driven by higher conventional DRAM contract prices, rising bit shipments, and growing volumes of high-bandwidth memory (HBM).

COO-Marco-Mezger-column-portrait

November 17, 2025
Device manufacturers were able to enjoy two years of low memory prices. However, this year, the tide has completely turned. Memory manufacturers have pulled the ripcord on both NAND flash memory and DRAM, announcing that they will focus on new memory generations in the future.

DRAM-NAND-flash-Capex

November 13, 2025
TrendForce’s latest investigations reveal that despite higher ASPs boosting profitability across the memory industry, capital spending on DRAM and NAND Flash is only anticipated to increase modestly in 2026.

DRAM5-products

October 30, 2025
TrendForce’s latest investigations show that server DRAM contract prices are strengthening in 4Q25, driven by ongoing data centre expansion among global CSPs.

pile-of-wafers

October 29, 2025
Global shipments of silicon wafers are projected to increase 5.4% in 2025 to 12,824 million square inches (MSI) followed by steady growth through 2028 when the market is expected to reach a new industry record of 15,485 MSI, SEMI reports.

Freudenstadt

October 23, 2025
SCHMID Group has secured two major orders for production equipment used in PCB for AI server applications, the company announced.

graphs-charts

October 01, 2025
TrendForce reports that following the completion of inventory digestion in the downstream consumer market concluded at the end of Q4 2023, DRAM suppliers shifted focus towards HBM and server DDR5 products, leading to tighter supply for other DRAM types.

global-wafer-shipments

August 06, 2025
SEMI reports that worldwide silicon wafer shipments increased 9.6% year-on-year to 3,327 million square inches (MSI) from the 3,035 MSI recorded during the same quarter of 2024.

begins-mass-production-of-industrys-highest-238-layer-4d-nand

July 24, 2025
SK Hynix reported a bigger-than-expected 68% jump in operating income in the June quarter. The South Korean chipmaker, a key supplier to AI giant Nvidia, said new model launches by customers would drive high-end AI chip demand growth, and that it was on track to double HBM chip sales for the full year.

Boise-Idaho-CEO-Sanjay-Mehrotra

June 26, 2025
Micron Technology reported record revenue of USD 9.30 billion for the third quarter of its fiscal 2025, marking a significant sequential and year-over-year increase as demand for AI-related memory solutions continues to accelerate.

Boise-Idaho-CEO-Sanjay-Mehrotra

June 12, 2025
Micron Technology will expand its US investment to approximately USD 150 billion in memory manufacturing and USD 50 billion in R&D, marking one of the largest semiconductor initiatives since the CHIPS Act.

panel-level-packaging-2024-2030

June 10, 2025
ERS electronic GmbH has opened a new demonstration centre in Zhubei, Taiwan, aimed at supporting the rising demand for panel-level packaging (PLP) in the region.

IC-sales-1Q25

May 21, 2025
The global semiconductor manufacturing industry entered 2025 with typical seasonal patterns. However, looming tariff threats and evolving supply chain strategies are expected to create atypical seasonality for several industry segments as the year progresses, reports SEMI.

TC_BONDER4

May 19, 2025
TC BONDER 4 is dedicated equipment capable of HBM4 production, featuring significantly improved productivity and precision compared to competitors, tailored to the characteristics of HBM4 which requires even higher precision.

Semiconductor_3D_X-DRAM

May 09, 2025
Built on a 3D NAND-like architecture and with proof-of-concept test chips expected in 2026, the new 1T1C and 3T0C designs combine the performance of DRAM with the manufacturability of NAND.

testing

May 02, 2025
This is a 15% increase in the number of layers over conventional 108-layer designs. Japan’s OKI Circuit Technology is seeking to establish mass production technology by October 2025 at its Joetsu plant.

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