Evertiq - First In Electronics News & Expo

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Energy_BESS

March 16, 2026
ABO Energy sold the facility in the second quarter of 2025 to Field, a London-based renewable energy infrastructure company operating across Europe. The plant has an output of 16 megawatts and a capacity of over 33 megawatt hours.

pcb

March 12, 2026
Lead times for PCBs are increasing as shortages of key base materials and rising demand from AI infrastructure place growing pressure on the global supply chain. This is according to German PCB manufacturer ILFA GmbH.

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founders

March 12, 2026
The seed funding will be used to expand manufacturing capabilities, testing of critical infrastructure and to accelerate commercial deployment.

Fehring-plant

March 03, 2026
Austrian IC substrates and PCB manufacturer AT&S will invest more than EUR 30 million in its Fehring plant by March 2027. The programme covers new production technologies, sustainability measures and the creation of around 50 jobs.

Ralf-Hasler-appointed-as-member-of-Incap-Groups-Management-Team

March 02, 2026
Having officially closed its acquisition of Lacon Group, EMS provider Incap Group has appointed Dr Ralf Hasler as the Director of Operations, Germany and Romania, and member of Incap Group’s Management Team.

Expo-waw25-05

February 27, 2026
At Evertiq Expo Warsaw on 23 October 2025, Mareike Haass of market research firm in4ma and Christoph Solka of the Global Electronics Association presented new data showing a European EMS industry still struggling to recover from a sharp post-pandemic correction.

Hungary-2026

February 23, 2026
German sensor manufacturer SICK has inaugurated a capacity expansion at its site in Kunsziget, Hungary, following a EUR 30 million investment that has created more than 300 new jobs.

Jochen-Hanebeck-portrait

February 20, 2026
German semiconductor manufacturer Infineon Technologies plans to extend the contracts of Chief Executive Officer Jochen Hanebeck and Chief Financial Officer Sven Schneider ahead of schedule.

flags-HQ

February 19, 2026
On February 10, 2026, ams Osram reported fourth-quarter revenue above the midpoint of its guidance and, at the same time, announced a new “Simplify” savings and transformation programme targeting EUR 200 million, which will affect around 2,000 employees globally.

GaN-300-millimeter-Technology

February 18, 2026
German semiconductor manufacturer Infineon Technologies expects the gallium nitride (GaN) power semiconductor market to reach nearly USD 3 billion by 2030, according to the 2026 edition of its annual “GaN Insights” report.

Drone

February 16, 2026
German defence technology company Stark has announced the opening of an R&D hub in Ukraine and a regional office in Greece, marking a strategic expansion across Europe.

businessmen-handshaking

February 15, 2026
GigaDevice, a fabless semiconductor supplier, has signed a distribution agreement with German electronics distributor SEMITRON, expanding its sales and support footprint in the DACH region.

Headquarters

February 12, 2026
Automotive technology company Aumovio plans to reduce up to 4,000 research and development positions globally as part of measures to improve efficiency in a challenging market environment, the company said.

RWS-CAVS

February 06, 2026
Kongsberg Defence & Aerospace has signed a contract with Patria for the delivery of Protector Remote Weapon Stations (RWS) to the German and Swedish Common Armoured Vehicle System (CAVS) 6x6 programme.

Carsem-building

February 05, 2026
German semiconductor manufacturer Infineon Technologies has completed the sale of its backend manufacturing site in Bangkok/Nonthaburi, Thailand, to the company's supplier, Malaysian Pacific Industries Berhad (MPI)

Mandar-Mahajan

February 03, 2026
German EMS provider Zollner has announced the establishment of a Shared Service Centre in Pune, India, as part of its internationalisation strategy. The new entity will operate under the name Zollner Services India Pvt. Ltd. and is currently in the founding phase.

Factronix-Evertiq-interview-waw25

January 29, 2026
At Evertiq Expo Warsaw 2025, Factronix CEO Stefan Theil used his presentation on “Component Reclaim – a green solution for the electronic industry” to underline how recovered components are moving from a niche option to a practical supply-chain tool.

Marco-Peter-2026

January 29, 2026
When German memory company Neumonda talks about bringing semiconductor memory manufacturing back to Germany, it sparks curiosity — not about the technology itself, but about the scale, the investment needed, and whether it’s actually possible.

dresden-render

January 28, 2026
European Semiconductor Manufacturing Company (ESMC) has celebrated the topping-out of its new office buildings at its Dresden semiconductor fab, the company said in a LinkedIn update. The ceremony marked the placement of the final structural beam in the central building.

PCB-India_2

January 26, 2026
Under the partnership, Infineon will collaborate with NIELIT — an autonomous body under India’s Ministry of Electronics and Information Technology (MeitY) — to develop training programs in semiconductor assembly, test and packaging.

Spark_Quantum_Computer

January 23, 2026
With the IQM Spark system, the German university is integrating a dedicated quantum-computing platform at its TechCampus to advance teaching, research and applied development.

January 22, 2026
German semiconductor company Elmos Semiconductor has opened a new research and development site in Brno, Czech Republic.

opening-Chiang-Mai-Thailand

January 19, 2026
German EMS provider Zollner has opened a new cleanroom facility at its Bluechips Microhouse site in Chiang Mai, Thailand. The new facility is ISO Class 7 certified and covers an area of 1,000 square metres.

Forge_Agile_MOU

January 12, 2026
Driven by Bharat Forge’s domain expertise and Agile Robots’ intelligent robots and automation solutions, this collaboration will see the deployment of cutting-edge solutions for the automotive, healthcare, and consumer electronics industries.

logos-on-buildings

January 07, 2026
Hanza has completed the acquisition of German EMS provider BMK Group GmbH. The deal was executed through a share issue in kind, with BMK’s three founders receiving approximately 17 million newly issued Hanza shares as full payment.

Dennis-Dahlgren_Column-3

December 29, 2025
As 2025 draws to a close, I’ve been looking back at the stories that shaped the year in electronics — stories that reveal an industry caught between ambition and anxiety, progress and hesitation, but also consolidation. It has been a year defined less by dramatic shocks and more by accumulating pressures: delayed investments, geopolitical strain, fragile supply chains.

ICEYE_satellite

December 22, 2025
To deliver this capability, Rheinmetall has partnered with ICEYE to establish Rheinmetall ICEYE Space Solutions. Based in Neuss, the joint venture will provide a high volume of SAR images via its exclusive constellation.

Erfurt-Germany-facility

December 16, 2025
The European Commission has approved EUR 623 million in German State aid to support the construction of two semiconductor manufacturing facilities in Dresden and Erfurt,

Office-Building

December 12, 2025
The companies aim to deploy a sovereign, space-based intelligence, surveillance, and targeting (IST) constellation with an interconnected comms layer for Europe by 2029.

Egypt-opening-2025

December 11, 2025
German automotive supplier Leoni is expanding its production footprint in Egypt. The company has officially inaugurated its Badr 4 production facility east of Cairo – and at the same time, the foundation stone for the Badr 5 plant was laid nearby.

Ideenion_MOU

December 08, 2025
Together, the companies will co-develop next-generation electrification solutions for high-performance and commercial vehicles, marine platforms, and energy storage systems, with a strong focus on the European market.

Kaohsiung_site

December 05, 2025
Covering 150,000 square meters, the Kaohsiung site is the company’s largest semiconductor materials campus worldwide. It focuses on thin films, formulation materials and specialty gases for high-precision layering, etching and patterning processes in advanced semiconductor production.

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