imec spin-off eyeo raises €15 million to give cameras perfect eyesight
May 08, 2025
eyeo, a new imec spin-off, has raised EUR 15 million in seed funding, co-led by imec.xpand, Invest-NL, joined by QBIC fund, High-Tech Gründerfonds (HTGF) and Brabant Development Agency (BOM). The spin-off aims to revolutionise the imaging market for consumer, industrial, XR and security applications by drastically increasing the light sensitivity of image sensors.
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Scanfil expands US manufacturing with second line in Atlanta
May 08, 2025
EMS provider Scanfil says that it will invest EUR 2.4 million in a second electronics manufacturing line at its Atlanta, USA facility, aiming to meet growing customer demand in the US market.
ABB's YuMi becomes a burger-flipping robot
May 08, 2025
ABB Robotics is serving up the future of fast food with BurgerBots – a robotics restaurant concept launched in Los Gatos, California. The automated kitchen uses ABB’s IRB 360 FlexPicker and YuMi collaborative robot.
InspeCity secures $5.6M to boost satellite life-extension tech
May 08, 2025
The funding will be deployed to space-qualify the Indian startup’s proprietary tech, grow its high-performance engineering team, and fasten the deployment of satellite life-extension platforms in global markets.
GPV reports 5% drop in Q1 revenue – optimises its footprint
May 07, 2025
Denmark-based EMS provider GPV has had a satisfactory start to 2025. The electronics manufacturer generated sales of DKK 2.2 billion (EUR 294.8 million) in the first quarter of 2025, against DKK 2.3 billion (EUR 308.2 million) in the same period last year, a YoY decrease of 5%, in line with expectations.
Techno Electric unveils $1 billion data centre plan in India
May 07, 2025
The Indian company plans to set up hyperscale and edge data centres with a cumulative capacity of 250 MW spread across the country. Techno is partnering with RailTel Corporation to build edge data centres in 102 cities.
SisTech selects Europlacer to power high-mix, high-rel growth
May 06, 2025
EMS provider SisTech Manufacturing continues to scale its capabilities with the help of Europlacer's placement platforms.
Semiconductors take centre stage at Evertiq Expo Malmö 2025
May 06, 2025
Sweden is setting its sights on a stronger position in the global semiconductor industry. At Evertiq Expo Malmö 2025, experts, researchers, and industry leaders will gather to explore the future of Swedish electronics – from innovation and supply chains to concrete investments in domestic semiconductor capabilities.
Sustio completes €68.5M expansion, doubling HDI capacity in Penang
May 06, 2025
Sustio Sdn. Bhd., a subsidiary of South Korea's Simmtech Group, has completed its second manufacturing facility in Batu Kawan, Penang, following an investment of MYR 326 million (EUR 68.5 million). The expansion effectively doubles Sustio’s high-density interconnect (HDI) manufacturing capacity.
Libra Industries boosts SMT capabilities at Dallas facility
May 06, 2025
Libra Industries has boosted its SMT capabilities at its electronics manufacturing facility in Dallas, Texas. The investment includes new equipment aimed at supporting high-precision, high-volume production for sectors such as aerospace, medical, and industrial manufacturing.
KIST develops ultrasonic wireless battery charging technology
May 06, 2025
The receiver overcomes many of the limitations of existing wireless power transmission methods while improving biocompatibility, and is expected to be applied to next-generation wearable and implantable electronic devices.
TV brands yay pass US tariff costs to consumers –
May 06, 2025
TrendForce’s latest research indicates that US reciprocal tariffs are likely to drive TV brands to pass rising costs onto consumers through higher retail prices in the second half of 2025, further weakening consumer spending momentum.
IIT Madras launches two silicon photonics products
May 05, 2025
An R&D centre at IIT Madras has developed a fibre array attachment tool in partnership with izmo Microsystems, which will be integrated with izmo’s packaging facility for photonics chip packaging. The centre also launched a high-speed silicon photonics QRNG.
TSMC breaks ground on third Arizona fab
May 05, 2025
TSMC has broken ground on its third fabrication facility in Phoenix, Arizona, marking a major expansion of the company's US-based manufacturing.
Tasmania’s Incat launches ‘world’s largest battery-electric ship’
May 05, 2025
When it enters service between Buenos Aires and Uruguay, the 130 metre-long vessel, called Hull 096, will operate entirely on battery-electric power, carrying up to 2,100 passengers and 225 vehicles across the River Plate.
VSORA raises $46M to bring powerful AI inference chip to market
May 05, 2025
The investment was led by Otium and a French family office with additional participation from Omnes Capital, Adélie Capital and co-financing from the European Innovation Council (EIC) Fund.
Southampton opens E-beam lithography chip facility
May 05, 2025
University of Southampton’s new E-beam lithography facility, just the second in the world, provides incredible accuracy critical to designing the tiny components that power technologies of the future.
NEXT partners with BAE to develop next-gen space-qualified chips
May 05, 2025
NEXT’s latest APU, the NX450, is the world’s first 200 GS/s antenna processor with 100-GHz of instantaneous RF bandwidth split across four independent receive and transmit channels respectively.
OKI develops 124-layer PCB tech for AI chip testing tools
May 02, 2025
This is a 15% increase in the number of layers over conventional 108-layer designs. Japan’s OKI Circuit Technology is seeking to establish mass production technology by October 2025 at its Joetsu plant.
LG Innotek targets $700M in FC-BGA sales with ‘Dream Factory’
May 01, 2025
LG Innotek has officially unveiled its fully automated semiconductor substrate plant, dubbed the “Dream Factory,” with the goal of growing its Flip Chip Ball Grid Array (FC-BGA) business into a USD 700 million operation by 2030.
Teledyne names George Bobb as CEO
April 30, 2025
Teledyne Technologies Incorporated has named George C. Bobb III as its President and Chief Executive Officer, effective immediately.
Europe's semiconductor target appears out of reach
April 30, 2025
It is very unlikely that the EU will meet its target of a 20% share of the global market for microchips by 2030, according to a new report by the European Court of Auditors (ECA).
Dust, water and radar – a hidden threat to autonomous vehicle reliability
April 30, 2025
A key challenge in autonomous driving technology – how dust and moisture contaminants impair the reliability of automotive radar sensors – will be in focus during a presentation by Jeongmin Kang, Postdoctoral Researcher at Halmstad University, at the upcoming Evertiq Expo Malmö on May 15, 2025.
Nanoramic opens new headquarters and manufacturing facility
April 29, 2025
Energy storage and advanced materials company Nanoramic has oficially opened its new headquarters in Woburn, Massachusetts.
Facing the inevitable: how to outsmart semiconductor obsolescence
April 29, 2025
At Evertiq Expo in Tampere, Ronny Nitsche, Regional Sales Manager at Rochester Electronics, discussed strategies for minimising the impact of semiconductor shortages and product discontinuations through proactive obsolescence management.
Flex boosts US production capacity for data centre power products
April 29, 2025
EMS provider Flex says that it has significantly increased its US production capacity to meet rising demand for data centre power products, citing the growing infrastructure needs driven by AI adoption.
IBM to invest $150 billion in the US over 5 years
April 29, 2025
This includes an investment of over USD 30 billion in R&D and manufacturing of mainframe and quantum computers. IBM said it will continue to design, build and assemble quantum computers in the US.
India’s Indofast, Green Tiger team up to offer EV retrofit kits
April 28, 2025
The approach enables riders to convert their petrol two-wheelers to EVs with Green Tiger Mobility’s conversion kits. Riders can then use Indofast Energy’s battery-swapping network to deal with issues like range and charging times.
Europe's electronics erosion threatens strategic autonomy
April 28, 2025
A new report from IPC warns that Europe’s continued decline in electronics manufacturing capacity — particularly in printed circuit boards (PCBs), advanced packaging, and EMS — poses a growing threat to the continent’s defence readiness, industrial resilience, and technological sovereignty.
BOS teams up with Intel to boost automotive AI innovation
April 28, 2025
Powered by BOS’s automotive AI chiplet SoC, Eagle-N and other products, Intel’s AI-enhanced software-defined SoCs will provide automakers with higher-performance, higher-compute AI solutions, building a solid foundation for in-vehicle AI applications.
Hindalco delivers 10,000 aluminium battery enclosures for Mahindra e-SUVS
April 28, 2025
Indian aluminium company Hindalco also unveiled its EV component manufacturing facility in Maharashtra, built with a capital investment of USD 57 million and spread across 5 acres.
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