BAE Systems awarded a $60 million contract
January 20, 2022BAE Systems has been awarded a USD 60 million contract from the Army Contracting Command – Rock Island under the Cornerstone Other Transaction Authority to develop certain types of next-gen, radiation hardened by design (RHBD) microelectronics leveraging Intel Foundry Services.
EMA Design Automation expands operations in Central Europe
January 18, 2022EMA Design Automation says it is expanding its global reach with the merger of EMA and FlowCAD, an EDA solutions provider in Central Europe.
Cadence to acquire NUMECA
January 25, 2021Cadence Design Systems has entered into a definitive agreement to acquire NUMECA International, a company focused on computational fluid dynamics (CFD), mesh generation, multi-physics simulation and optimization.
Nokia and Finland’s Tampere University join forces to develop 5G chipsets
October 08, 2020Nokia has joined forces with Tampere University to establish a ‘Center of Excellence’ to enhance the development of System-on-Chip (SoC) custom processors for its ReefShark chipset portfolio.
TowerJazz, Cadence, and KPI to open analog design lab
January 24, 2020TowerJazz, Igor Sikorsky Kyiv Polytechnic Institute (KPI), the national technical university of Ukraine, and Cadence Design Systems, are collaborating to open a new analog circuit design lab in Ukraine.
Cadence completes acquisition of AWR from NI
January 17, 2020Cadence Design Systems, Inc. has completed the acquisition of AWR Corporation from National Instruments Corporation.
Rocket Lab expands capabilities in So Cal
January 16, 2020Rocket Lab announced this week it will open a new facility to serve as its corporate headquarters and provide increased production capacity.
Cadence expands collaboration with Broadcom
January 15, 2020Cadence Design Systems says it has expanded its collaboration with Broadcom Inc. for the creation of semiconductor solutions targeting next-generation networking, broadband, enterprise storage, wireless and industrial applications.
Cadence to acquire AWR from NI
December 05, 2019Cadence Design Systems and National Instruments have entered into a definitive agreement under which Cadence expects to acquire AWR Corporation, a wholly owned subsidiary of National Instruments (NI).
Mythic Secures $30M in new financing
June 13, 2019Mythic, an AI inference processor company with analog compute-in-memory technology, has secured USD 30 million in Series B-1 funding led by Valor Equity Partners, with additional new investors Future Ventures, Atreides, Micron Ventures, and Lam Research.
Faraday Future’s speeding up production
February 19, 2018After the first debut of its production-intent FF 91 at last year’s CES, FF aims to fulfill delivery of the vehicle through its Hanford, California manufacturing facility, which will begin to come online toward the end of the first quarter.
Micron and Intel to keep developing 3D NAND technology
January 15, 2018The companies have agreed to complete development of their third generation of 3D NAND technology, which will be delivered toward the end of this year and extending into early 2019.
Harris delivers fourth GPS III satellite navigation payload
December 20, 2017Harris Corporation has delivered the advanced navigation payload for the fourth GPS III Space Vehicle (SV04) to Lockheed Martin – establishing a proven production cadence.
Samsung Foundry tapes out industry first eMRAM test chip based on 28nm FD-SOI process
September 25, 2017Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology, today announced it has expanded its differentiated FD-SOI process technology leadership by offering derivatives that include RF and eMRAM.
DSP Concepts raises $10 million in series A funding
September 20, 2017-DSP Concepts, Inc., a developer of embedded digital signal processing audio solutions and specialist in voice UI technologies, has raised USD 10 million in Series A funding, led by BMW i Ventures, with participation from Walden International Ventures and angel investor David Tsang.
Cypress adopts Cadence design tools 40nm automotive chips
May 12, 2016Cypress Semiconductor has selected the full Cadence RTL-to-signoff digital design flow and complete Spectre circuit simulation platform for all of its 40nm automotive chip designs.
Toshiba adopts Cadence Innovus implementation system
April 27, 2016Toshiba Corporation has adopted the Cadence Innovus Implementation System for its memory controller's production design project.
Mentor Graphics names new Americas sales executive
April 21, 2016Mentor Graphics has appointed Veronica Watson as vice president, Regional Sales for the Americas.
Cadence to acquire RocketickLoad more news
April 12, 2016Cadence Design Systems has entered into a definitive agreement to acquire Rocketick Technologies Ltd., an Israel based provider of multicore parallel simulation.