Siemens joins Arm's Semiconductor Education Alliance
March 01, 2024
Industrial giant Siemens is the latest firm to sign up for Arm's Semiconductor Education Alliance, which aims to boost global chip skills and research.
AI chip deals remain low; chip makers take over as major buyers
February 28, 2024
New research from Omdia reveals that while demand for AI chips is soaring, AI chip deals remain low – and that chip manufacturers are taking over as the major buyers.
How to inspect chip for counterfeits
January 21, 2024
Several inspection methods can help to identify counterfeit, or signal that a deeper inspection level is required. Systems design software provider Cadence has taken a deep dive into this subject.
Cadence acquires Invecas
January 09, 2024
Cadence Design Systems says it has acquired Invecas, a provider of design engineering, embedded software and system-level solutions, headquartered in Santa Clara, California.
12 auto and chip companies form SoC research consortium
December 28, 2023
Honda, Nissan, Renesas and Socionext are among the firms to have launched the "Advanced SoC Research for Automotive" (ASRA) association.
Cadence to Acquire Intrinsix Corporation from CEVA
September 22, 2023
Cadence Design Systems and CEVA, a licensor of wireless connectivity and smart sensing technologies, have entered into a definitive agreement for Cadence to acquire CEVA's subsidiary Intrinsix Corporation, a provider of design engineering solutions focused on the US aerospace and defense industry.
Apple and Arm ink long-term deal
September 07, 2023
US electronics company Apple has reportedly signed a new deal with Arm for chip technology that "extends beyond 2040."
Arm: industry is approaching a skills 'tipping point'
August 04, 2023
Chip giant Arm has warned the industry about a global skills gap – and has launched a new global education programme to address the crisis.
Applied Materials unveils a new approach to wafer manufacturing
July 13, 2023
Materials engineering specialist Applied Materials has introduced what it describes as 'the most significant wafer manufacturing platform innovation in more than a decade'.
Keysight expands EDA software portfolio via acquisition
February 28, 2023
Keysight Technologies has acquired Cliosoft and will be adding the company's line of hardware design data and intellectual property (IP) management software tools to its portfolio of electronic design automation (EDA) solutions.
Tachyum and Cadence settle lawsuit
January 18, 2023
Tachyum says it has reached an amicable settlement with Cadence Design Systems, Inc. in a lawsuit brought by Tachyum back in the summer of 2022.
BAE Systems awarded a $60 million contract
January 20, 2022
BAE Systems has been awarded a USD 60 million contract from the Army Contracting Command – Rock Island under the Cornerstone Other Transaction Authority to develop certain types of next-gen, radiation hardened by design (RHBD) microelectronics leveraging Intel Foundry Services.
EMA Design Automation expands operations in Central Europe
January 18, 2022
EMA Design Automation says it is expanding its global reach with the merger of EMA and FlowCAD, an EDA solutions provider in Central Europe.
Cadence to acquire NUMECA
January 25, 2021
Cadence Design Systems has entered into a definitive agreement to acquire NUMECA International, a company focused on computational fluid dynamics (CFD), mesh generation, multi-physics simulation and optimization.
Nokia and Finland’s Tampere University join forces to develop 5G chipsets
October 08, 2020
Nokia has joined forces with Tampere University to establish a ‘Center of Excellence’ to enhance the development of System-on-Chip (SoC) custom processors for its ReefShark chipset portfolio.
TowerJazz, Cadence, and KPI to open analog design lab
January 24, 2020
TowerJazz, Igor Sikorsky Kyiv Polytechnic Institute (KPI), the national technical university of Ukraine, and Cadence Design Systems, are collaborating to open a new analog circuit design lab in Ukraine.
Cadence completes acquisition of AWR from NI
January 17, 2020
Cadence Design Systems, Inc. has completed the acquisition of AWR Corporation from National Instruments Corporation.
Rocket Lab expands capabilities in So Cal
January 16, 2020
Rocket Lab announced this week it will open a new facility to serve as its corporate headquarters and provide increased production capacity.
Cadence expands collaboration with Broadcom
January 15, 2020
Cadence Design Systems says it has expanded its collaboration with Broadcom Inc. for the creation of semiconductor solutions targeting next-generation networking, broadband, enterprise storage, wireless and industrial applications.
Cadence to acquire AWR from NI
December 05, 2019
Cadence Design Systems and National Instruments have entered into a definitive agreement under which Cadence expects to acquire AWR Corporation, a wholly owned subsidiary of National Instruments (NI).
Mythic Secures $30M in new financing
June 13, 2019
Mythic, an AI inference processor company with analog compute-in-memory technology, has secured USD 30 million in Series B-1 funding led by Valor Equity Partners, with additional new investors Future Ventures, Atreides, Micron Ventures, and Lam Research.
Faraday Future’s speeding up production
February 19, 2018
After the first debut of its production-intent FF 91 at last year’s CES, FF aims to fulfill delivery of the vehicle through its Hanford, California manufacturing facility, which will begin to come online toward the end of the first quarter.
Micron and Intel to keep developing 3D NAND technology
January 15, 2018
The companies have agreed to complete development of their third generation of 3D NAND technology, which will be delivered toward the end of this year and extending into early 2019.
Harris delivers fourth GPS III satellite navigation payload
December 20, 2017
Harris Corporation has delivered the advanced navigation payload for the fourth GPS III Space Vehicle (SV04) to Lockheed Martin – establishing a proven production cadence.
Samsung Foundry tapes out industry first eMRAM test chip based on 28nm FD-SOI process
September 25, 2017
Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology, today announced it has expanded its differentiated FD-SOI process technology leadership by offering derivatives that include RF and eMRAM.
DSP Concepts raises $10 million in series A funding
September 20, 2017
-DSP Concepts, Inc., a developer of embedded digital signal processing audio solutions and specialist in voice UI technologies, has raised USD 10 million in Series A funding, led by BMW i Ventures, with participation from Walden International Ventures and angel investor David Tsang.
Cypress adopts Cadence design tools 40nm automotive chips
May 12, 2016
Cypress Semiconductor has selected the full Cadence RTL-to-signoff digital design flow and complete Spectre circuit simulation platform for all of its 40nm automotive chip designs.
Toshiba adopts Cadence Innovus implementation system
April 27, 2016
Toshiba Corporation has adopted the Cadence Innovus Implementation System for its memory controller's production design project.
Mentor Graphics names new Americas sales executive
April 21, 2016
Mentor Graphics has appointed Veronica Watson as vice president, Regional Sales for the Americas.
Cadence to acquire Rocketick
April 12, 2016
Cadence Design Systems has entered into a definitive agreement to acquire Rocketick Technologies Ltd., an Israel based provider of multicore parallel simulation.
Sinocare Group closes acquisition of Nipro Diagnostics
January 08, 2016
The acquisition of Nipro Diagnostics by Sinocare Group has been completed,and with completion of the acquisition, the company has been renamed Trividia Health.
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