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ZuriQ-partnership-advance-scalable-quantum-chips

October 08, 2026
Infineon and Swiss quantum computing start-up ZuriQ are expanding their collaboration to scale ZuriQ's trapped-ion architecture towards larger qubit counts. The partnership combines ZuriQ's chip design with Infineon's semiconductor manufacturing, advanced packaging and integrated photonics.

PCB-India_2

October 08, 2026
Gradiant named Hari Prasad as Managing Director, India, to lead its growth across semiconductors, data centers, and energy. The new contracts span chips, electronics, and clean energy, and include a repeat award from a global chipmaker expanding its fab.

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Cellnex-Poland

October 07, 2026
Cellnex Poland has selected Ericsson as one of its suppliers for the modernisation and expansion of its 5G radio access network. The scope covers radios, RAN compute modules, microwave links, antennas and enclosures, and several of the products are being deployed at scale for the first time.

Taichung-Taiwan

October 07, 2026
A union representing Micron employees in Taoyuan, Taiwan, has secured its members' backing for a strike over the company's bonus scheme, Reuters reports. Taiwan is a key production base for Micron's DRAM and HBM chips, and a strike could add to supply concerns in an already tight memory market.

breaks-ground-new-cleanroom-Erfurt-2026

October 06, 2026
X-FAB has started construction of a new cleanroom at its site in Erfurt, Germany, to expand production of microsystems and photonics. The Fab4Micro project receives EUR 127.4 million in funding from the German federal government and the state of Thuringia under the EU Chips Act.

Electronics_chiller_factory

October 05, 2026
The company plans to invest a total of USD 110 million in a new air-cooled chiller production facility in the US and in expanding two air-cooled chiller production lines in South Korea.

Liquide_gases

October 02, 2026
Air Liquide will build, own and operate several production units to deliver large volumes of ultra-pure nitrogen, oxygen, argon and hydrogen, including significant backup storage capacity.

AST-JV-facility

September 30, 2026
Advanced Substrate Technologies (AST), a joint venture between TOPPAN and Broadcom, has opened Singapore's first facility for high-end FC-BGA substrates. The plant comes online as substrate capacity remains a bottleneck for AI and networking chips.

EPIC-center

September 30, 2026
Flash memory maker KIOXIA will join Applied Materials' EPIC Center in Silicon Valley as an innovation partner. It is the latest in a series of chipmakers to sign up.

CSBC_agreement

September 28, 2026
US-based Havoc and CSBC will work toward pairing CSBC’s shipbuilding and production capabilities with Havoc’s collaborative autonomy technology, integrating Havoc’s autonomy software onto CSBC-built platforms produced and sustained in Taiwan.

IC_Leadership_Team

September 28, 2026
In combination with mainstream CMOS semiconductor technology, the TUSK IC solution brings scalable, affordable connectivity to the next generation of LEO and MEO (Low & Medium Earth Orbit) satellite constellations.

campus-veldhoven

September 24, 2026
While High NA EUV will be adopted for production using the current 6-inch masks, the transition to larger, 12-inch masks is expected to further increase fab productivity, lower chipmaking costs and remove stitching constraints, benefiting the entire semiconductor industry.

Kulim-site-2026

September 24, 2026
Austrian IC substrate and PCB manufacturer AT&S has signed an expanded long-term agreement with semiconductor company Marvell Technology to supply advanced IC substrates for next-generation AI and cloud infrastructure.

Nexstrom

September 24, 2026
The funding will support ongoing platform development, collaborations with semiconductor foundries and expansion of Nexstrom’s engineering and leadership teams as the company advances high-performance, low-power chips for AI, data centers and computing applications.

PCB-Taiwan_2

September 23, 2026
TSMC, the world’s largest contract chipmaker, will ‌build two buildings at the Baipu Industrial Park, including a technology validation laboratory and a talent training centre.

SpainSatNG-III

September 23, 2026
Building on the design and implementation of its predecessors, the secure communications satellite introduces technological enhancements, delivering greater operational agility, expanded bandwidth and superior protection against jamming and electronic threats.

quantum-technologies-1

September 23, 2026
The federal funding deployed through the CHIPS and Science Act supports R&D and US quantum semiconductor manufacturing capabilities needed to deploy large-scale, fault-tolerant trapped-ion quantum computers.

Electronics_Sumitomo_Chemical

September 23, 2026
Under the MoU, both companies have agreed to explore a collaboration whereby Sumitomo will supply semiconductor materials, including photoresists, functional chemicals, and high-purity chemicals to Tata Electronics’ upcoming Fab in Dholera, Gujarat.

products

September 22, 2026
The global DRAM module market generated USD 21.2 billion in revenue in 2025, up 59% YoY, according to TrendForce — a sharp acceleration from the 7% growth recorded in 2024.

founders

September 22, 2026
The funding will advance its sensing capabilities through the next-gen Honeybee hyperspectral constellation, extending observations into shortwave infrared (SWIR), while adding new technologies including SAR and UHR optical imaging.

building_logo

September 21, 2026
The new platform is designed to make more powerful memory chips at lower cost and using less power, Reuters reports. The potential breakthrough could make China compete for the memory market share with the likes of Samsung and SK hynix.

wafer

September 21, 2026
Anderon, an IBM company, operates a state-of-the-art 300-millimeter pure-play quantum wafer foundry, backed by an additional USD 1 billion investment from IBM. Headquartered in New York, the new venture serves the quantum industry as a pure-play foundry.

Neue_Klasse

September 21, 2026
The high-performance components integrated into the vehicle support key power electronics functions and are designed to deliver high energy efficiency as well as reliable operation under demanding automotive conditions.

tool

September 17, 2026
Rather than serving a single point in the water cycle, Gradiant will deliver its full semiconductor portfolio across these sites — from ultrapure water production to high-recovery wastewater treatment, scrubber reclaim, treatment of complex streams and zero liquid discharge.

headquarters

September 16, 2026
The center in Germany will accelerate the development of next-generation process solutions, deepen collaboration with leading semiconductor manufacturers, and further strengthen SUSS’s position in the fast-growing Advanced Packaging market.

September 16, 2026
At least two potential scenarios are being discussed: SK hynix would lease part of Intel’s chipmaking ‌facility in Ohio, or form a venture with Intel and cloud firms looking for a secure memory chip supply, according to Reuters.

September 14, 2026
Under the agreement, Samsung will integrate Mistral’s AI services and solutions — including its flagship large language model, Mistral Large — across its semiconductor operations to develop customized on-premises AI models optimized for intelligence-driven infrastructure.

workforce

September 11, 2026
Through this collaboration, Canadian photonic quantum computing company Xanadu and ASML will explore lithography-enabled process approaches for improved patterning control and lower-loss photonic structures.

September 10, 2026
GlobalFoundries has finalised a definitive agreement with the US Department of Commerce for a USD 375 million research and development award to advance its Quantum Technology Solutions business. The funding is tied to milestone achievements over a five-year period.

CEO-vincent-Roche

September 10, 2026
Analog Devices has announced a definitive agreement to acquire Alif Semiconductor in an all-cash transaction valued at USD 1.35 billion, with potential additional contingent consideration of up to USD 200 million. The deal is expected to close before the end of 2026.

building_logo

September 10, 2026
The two companies aim to deepen collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies. Samsung plans to introduce ASML’s High NA EUV lithography into future DRAM high-volume manufacturing by 2028.

Taichung-Taiwan

September 09, 2026
Labour unions representing nearly two-thirds of Micron Technology's Taiwan workforce are threatening to strike unless the US memory chip maker changes how it distributes profits to employees, Reuters reports. More than 80% of union members who took part in an internal survey in August backed strike action.

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