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Liquide

July 03, 2026
Air Liquide will deliver large volumes of nitrogen, oxygen, argon, hydrogen and other industrial gases to SK hynix’s new cutting-edge advanced chips packaging facility.

groundbreaking-sherman-texas-2026

July 03, 2026
Coherent has signed a letter of intent to receive up to USD 50 million under the US CHIPS and Science Act to expand its indium phosphide semiconductor manufacturing facility in Sherman, Texas. The expansion will double manufacturing space and quadruple wafer production capacity, and is expected to create more than 1,000 jobs.

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open-smart-power-fab

July 02, 2026
Infineon Technologies has opened its Smart Power Fab in Dresden, Germany – described as the world's largest fab for power semiconductors and analog/mixed-signal technologies.

Kulim-site-2026

July 02, 2026
Austrian PCB and IC substrate manufacturer AT&S is expanding its Kulim manufacturing site in Malaysia, backed by agreements with AMD and another unnamed technology company.

Erfurt-Main-entrance

July 02, 2026
X-FAB MEMS Foundry has received a grant notification of EUR 127.4 million from the German federal government and the Free State of Thuringia for the construction of a new cleanroom at its Erfurt site. The Fab4Micro project will expand capacity for MEMS, microsystems and photonics, with initial production targeted for the end of 2028.

chip_technology

June 29, 2026
IBM’s new sub-1 nm chip packs nearly 100 billion transistors onto a chip the size of a fingernail, nearly twice the density of IBM’s 2 nm chip, unveiled in 2021.

June 25, 2026
Qualcomm has agreed to acquire Modular Inc, an AI software infrastructure company whose platform allows developers to build and deploy AI across different hardware architectures without rewriting code for each one. The deal is expected to close in the second half of 2026.

Munich-facility

June 24, 2026
The European Commission has approved EUR 76 million in German state aid for QuantumDiamonds GmbH to establish a semiconductor testing equipment facility in Munich, Germany. The facility will be the first in the EU to produce semiconductor metrology and inspection systems based on quantum sensing.

Space_AI

June 24, 2026
The investment will accelerate the commercial rollout of Irish firm Ubotica’s Live Maritime Intelligence platform, which enables governments and maritime agencies to detect emerging threats across maritime territories in real time.

Dallas_office

June 22, 2026
The investment in advanced test and packaging (ATP) operations in Allentown, Pennsylvania, will increase domestic production capacity of the optical networking technologies that power scalable AI infrastructure connectivity in the US.

Exolaunch

June 22, 2026
EQT will support Exolaunch in scaling its global operations and investing into the development of new satellite launch and deployment technologies. It will also help drive the expansion into additional services across the satellite mission lifecycle.

hynix_HBM4E

June 19, 2026
The 12-layer HBM4E shows improvements in both performance and power efficiency. The product features a maximum data processing speed of 16Gbps per pin and power efficiency that is up more than 20 percent from previous models.

axonite_chip

June 17, 2026
The joint effort with the Fondazione Chips-IT builds on Japan and Europe semiconductor cooperation. Rapidus has also signed an MOU with the UK Semiconductor Centre, a national body promoting the semiconductor industry in the UK.

Borje-Ekholm-CEO

June 16, 2026
Ericsson has announced that Börje Ekholm is stepping down as President and CEO, with Per Narvinger appointed as his successor. Narvinger, currently Executive Vice President and Head of Business Area Networks, takes over on October 1, 2026.

Liquide_SK_hynix

June 16, 2026
In order to supply SK hynix’s new packaging and testing fab “P&T7”, located in Cheongju, in the Chungcheongbuk province, Air Liquide will build and operate a state-of-the-art nitrogen production unit.

Robotics

June 12, 2026
German company Neura Robotics is building a new category of AI infrastructure where cognitive robots continuously learn, collaborate and operate across real world environments through a shared intelligence ecosystem called the Neuraverse.

Expo-ZRH26-claus-speaking

June 12, 2026
At Evertiq Expo Zürich, Claus Aasholm of Semiconductor Business Intelligence delivered a data-driven examination of a semiconductor industry in structural transition – and the picture looked considerably different from what most quarterly reports suggest.

Singapore-facility

June 11, 2026
Applied Materials has expanded its manufacturing and R&D operations in Singapore with the opening of the Tampines Campus, a USD 500 million facility that more than doubles the company's cleanroom capacity in the country. The campus is already operating at volume production.

GettyImages_TechCrunch_Rafal_Modrzewski_ICEYE

June 11, 2026
ICEYE has completed its Series F financing round, raising more than EUR 1 billion in total. The company secured EUR 450 million in new capital, while the overall transaction value – including share sales by existing shareholders – exceeded EUR 1 billion. Following the round, ICEYE's valuation has risen to more than EUR 10 billion.

robotics

June 11, 2026
The collaboration will bring together Nvidia’s full-stack accelerated computing platforms with Doosan Group’s capabilities in industrial automation, power generation and advanced electronics materials to support next-generation AI infrastructure.

cells

June 10, 2026
Designed specifically for uncrewed, battery-powered systems like drones, surface and underwater vessels, ground vehicles, and humanoids, Natrion’s cells deliver nearly 80% more energy density than available Li-ion cell alternatives.

PCB-Japan_2

June 09, 2026
As a result of this latest capital increase by Japan’s Information-Technology Promotion Agency (IPA), Rapidus’ funding now totals 424.95 billion yen (about USD 2.7 billion).

AI_factory_Missouri

June 08, 2026
Creating 1,200 construction jobs and 130 permanent high-tech positions at full operation, Nebius’s Independence (Missouri) investment is also expected to generate USD 650 million in tax payments to local school districts and taxing jurisdictions.

axonite_chip

June 05, 2026
The technology combines micro-scaled opto-semiconductor chips capable of 12V single-chip operation with a high-voltage (HV) driver technology, enabling a reduction of more than 10% in the number of driver-related components used in hybrid and electric vehicles.

Chips-Act

June 04, 2026
The European Commission has presented the European Technological Sovereignty Package, a set of legislative and strategic measures aimed at reducing Europe's dependence on foreign suppliers in semiconductors, AI, cloud computing and open source technology.

Tessalia

June 04, 2026
Foxconn, Radiall and Thales laid the foundation stone of their future JV. Tessalia is expected to have 800 employees at full production. Production is expected to start at the end of 2029 and to reach more than 50 million SiP components per year by 2033.

tsmc_chip_design

June 03, 2026
Nvidia CUDA-X libraries and AI models are accelerating TSMC workloads across lithography, transistor and process simulation, advanced process control and fab operations optimization.

in4ma-interview-zurich

June 01, 2026
Following his keynote at Evertiq Expo Zürich, in4ma founder and analyst Dieter Weiss had an interview with Evertiq to discuss the numbers behind global EMS growth in 2025 – and what they reveal about where the European industry stands.

geralt-computer-chip

May 28, 2026
The financing round was led by Accel, Factorial Funds, and Founders Fund, with participation from Conviction, Gigascale, 01A, Felicis, Buckley Ventures and 8VC, alongside existing backers.

He-Tingbo

May 27, 2026
At the IEEE International Symposium on Circuits and Systems in Shanghai on May 25, Huawei presented the Tau scaling law — a new principle for guiding semiconductor development that the company proposes as a replacement for Moore's Law, which has underpinned the industry for more than five decades.

Quantum_Wafer

May 27, 2026
The CHIPS incentive from the US Department of Commerce will support R&D efforts of a new IBM company, Anderon, which will operate as a 300-mm quantum wafer foundry. In addition to the USD 1 billion CHIPS incentive, IBM will contribute USD 1 billion of cash into Anderon.

May 27, 2026
This latest heat management solution helps reduce thermal resistance by 30% and enables chips to operate stably even in high-temperature and high-pressure conditions.

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