Indian startup BigEndian Semiconductors raises $6 million May 11, 2026 The fresh funds will be used to commercialise the Bengaluru-based fabless startup’s first system on chip SoC, scale product engineering, and boost partnerships across foundries, IP ecosystems and OEMs.
Inside Fab 21: TSMC reveals Arizona chip production site May 08, 2026 TSMC has released a video showcasing its semiconductor manufacturing operations in Arizona, offering a rare glimpse inside its expanding US production site, known as Fab 21.
NEO partners with South Korean Army to advance battery solutions May 08, 2026 The agreement builds on NEO’s momentum in its Korean Defense Integration Strategy and serves as a milestone due to the Capital Defense Command’s ability to advocate for the prompt implementation of non-Chinese battery solutions.
Lattice Semiconductor to buy software firm AMI in $1.65B deal May 08, 2026 The acquisition brings together Lattice’s low power FPGAs with AMI’s platform firmware and infrastructure manageability solutions for cloud and AI to create a complete portfolio of secure management and control solutions.
India approves semiconductor projects worth $400 million May 07, 2026 Crystal Matrix will establish an integrated facility for compound semiconductor fabrication and ATMP while Suchi Semicon will set up an OSAT facility for manufacturing discrete semiconductors, in Gujarat.
Applied Materials acquires NEXX business from ASMPT May 06, 2026 US semiconductor equipment maker Applied Materials has entered into a definitive agreement to acquire the NEXX business from ASMPT, adding panel-level electrochemical deposition technology to its advanced packaging lineup.
Rebellions partners with SKT, Arm to bolster AI infrastructure May 06, 2026 This alliance aims to address the surging demand in the inference market and set standards for high-performance, energy-efficient sovereign AI infrastructure.
Mosaic SoC raises $3.8M to advance spatial intelligence May 06, 2026 The Swiss semiconductor startup builds integrated circuits that process visual and positional sensor data to give devices a real-time understanding of where they are and what’s around them.
Europe is building a system without a physical foundation May 05, 2026 Europe is investing billions in artificial intelligence, semiconductors, and data centres. These investments are meant to strengthen the region’s technological position and reduce external dependencies. But the question is becoming harder to ignore: to what extent is Europe building a system on a foundation that does not physically exist?
GPV improves profitability in Q1 despite falling sales May 05, 2026 Danish EMS provider GPV reported improved earnings in the first quarter of 2026, as structural measures implemented during 2025 began to take effect — even as sales declined and supply chain pressures mounted.
Digitalisation increases risk. Companies are not ready May 05, 2026 Just a year ago, during the panel “Cybersecurity in the era of integrated electronic systems” at Evertiq Expo Kraków, uncertainty dominated the discussion. Companies knew new regulations were coming, but lacked clarity – both in terms of scope and implementation. Today, that situation is beginning to shift. Regulations are coming into force, and with them, pressure is mounting – particularly in the industrial and electronics sectors – to treat cybersecurity as an operational concern, not merely a formal requirement.
Rheinmetall, Boeing partner on German MQ-28 Ghost Bat May 04, 2026 Boeing’s MQ-28 Ghost Bat, a proven autonomous collaborative combat aircraft (CCA), has completed more than 150 flights and has been designed, developed and manufactured in Australia for the Royal Australian Air Force and other allied nations.
Advantest partners with Applied Materials, joins EPIC platform May 04, 2026 As the first automated test equipment (ATE) company to join the platform, Advantest will partner with Applied Materials to strengthen the links between front-end manufacturing technologies and back-end testing of chips and packages.
Accenture, Vodafone Procure & Connect, SAP advance humanoid robotics May 01, 2026 SAP led the integration of the robots into the warehouse management system, while Accenture designed and deployed the robot intelligence and operational framework, drawing on its expertise in physical AI, advanced robotics and digital twin environments.
IndieSemiC, Nordic to develop wireless modules for connected devices April 27, 2026 Under the partnership, IndieSemiC will be responsible for the module lifecycle — including RF design, antenna engineering, hardware development, firmware support, testing, validation, certification, and manufacturing — while Nordic Semiconductor will provide the core chipset technology.
Rina, Hanwha to advance battery-hybrid propulsion systems April 27, 2026 The partnership brings together Hanwha’s expertise in propulsion, energy storage and systems integration with Rina’s regulatory and certification know-how, fostering the development and adoption of next-generation propulsion solutions for the maritime sector.
Neura partners with AWS to accelerate Physical AI at scale April 27, 2026 By running the Neuraverse on Amazon Web Services (AWS) and connecting Neura Gym to AWS services, Neura Robotics can accelerate how robotic intelligence is trained, tested, and continuously improved across customer, partner and internal use cases.
ASML reports €8.8 billion in Q1 sales, raises full-year outlook April 22, 2026 ASML reported total net sales of EUR 8.8 billion and net income of EUR 2.8 billion for the first quarter of 2026.
Air Liquide invests €200M in Japan to support chip manufacturer April 20, 2026 Set to begin operations by the end of 2028, Air Liquide’s production units will deliver large volumes of ultra-pure nitrogen, oxygen and argon to support the production of advanced chips.
German startup Peak Quantum raises €2.2 million April 17, 2026 This brings the company’s total funding to more than EUR 5 million. The funds will be used to further develop the technology and to establish a European pilot production facility for superconducting quantum processors.
Molex to acquire Teramount to accelerate Co-Packaged Optics push April 16, 2026 Molex has entered into an agreement to acquire Israel-based Teramount, a developer of fiber-to-chip connectivity solutions, in a move aimed at accelerating the adoption of scalable Co-Packaged Optics (CPO).
Extended lead times for key components weigh on server growth April 15, 2026 Extended lead times for key semiconductor and hardware components are increasingly shaping supply conditions in the server market, according to TrendForce.
How chips competence centres could change semiconductor hiring in Europe April 15, 2026 Europe is investing heavily in semiconductors. New fabs are being planned, public funding is flowing, Chips Act 2.0 is on its way and long-term initiatives are taking shape. But there’s a more basic question that doesn’t seem to get asked enough: Even if all of this gets built, who is going to run it?
Japan approves extra $4 billion for chipmaker Rapidus April 13, 2026 Established in 2022, Rapidus has secured funding from both the public and private sectors. It is aiming to mass-produce cutting-edge chips using 2-nanometer technology by 2027.
Gartner: Semiconductor revenue to exceed $1.3 trillion in 2026 April 13, 2026 Market research firm Gartner forecasts that global semiconductor revenue will exceed USD 1.3 trillion in 2026, representing 64% growth – the strongest growth in more than two decades – driven by continued strong demand related to AI, data centers and rising memory prices.
Europe at a turning point for PCB base materials April 08, 2026 As performance requirements for printed circuit boards continue to rise — driven by high-speed digital as well as RF and microwave applications — the development and selection of base materials is becoming a balancing act between electrical performance, regulatory compliance and supply chain resilience. What used to be a largely engineering-driven decision is now increasingly influenced by external constraints that are harder to control and even harder to predict.
Intel joins Musk-led Terafab project April 07, 2026 Intel has announced it will join the Terafab project, spearheaded by Elon Musk, alongside SpaceX, Tesla and xAI.
Spain allocates €19 million to semiconductor research and quantum chip development April 07, 2026 The Spanish government has approved the allocation of €19 million to support research in semiconductors and the development of quantum chips, according to a statement from the Ministry for Digital Transformation and Public Service.
SUMCO shifts strategy from new fab to equipment upgrades April 07, 2026 SUMCO Corporation has received approval from Japan’s Ministry of Economy, Trade and Industry (METI) for an amended version of its “Plan for Ensuring Stable Supply” under the Economic Security Promotion Act, the company announced on March 27, 2026.
Singapore charges another individual in AI server fraud case April 02, 2026 Singapore has charged an additional individual in an ongoing fraud investigation linked to the handling of AI server equipment, according to Reuters.
TSMC targets 3nm production at second Japan fab by 2028 April 01, 2026 TSMC is planning to begin equipment installation and launch mass production of advanced 3-nanometre chips at its second fabrication plant in Japan in 2028, according to a Taiwanese government filing.
Flex to acquire Electrical Power Products in $1.1 billion deal March 30, 2026 Electronics manufacturing services provider Flex has entered into a definitive agreement to acquire US-based Electrical Power Products (EP2), a supplier of engineered-to-order electrical power control and protection systems. The transaction is valued at approximately USD 1.1 billion, including anticipated tax benefits of around USD 0.1 billion.