EU funding strengthens semiconductor innovation in Finland
February 19, 2025
The European semiconductor industry is receiving a boost through the APECS pilot line project, which has been awarded funding under the EU Chips Act. This initiative focuses on developing and providing new packaging and integration solutions for the industry.
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French research institute kicks off EUR 830m chips project
July 01, 2024
France's CEA-Leti lab has officially launched its FAMES Pilot Line to support higher-performance, more energy-efficient and more sustainable chip designs across Europe.
Kalray plans mergeer with Pliops to 'lead in AI GPUs'
June 17, 2024
Kalray and Pliops are set to become one company in a joint drive to be mayor players in the market for AI and storage servers in data centres.
EU Chips Act to attract EUR 100bn of private investment?
May 23, 2024
European Commission officials believe the EU Chips Act can attract huge inwards investment and propel the continent's semiconductor space to global prominence by 2030.
EU's Edge-AI body now accepting design proposals
March 01, 2024
The European Union has issued a call for proposals to its PREVAIL consortium, which was set up to accelerate the development of next-generation, edge-AI technologies across the continent.
Applied Materials and CEA-Leti unveil joint lab
December 07, 2023
Applied Materials and CEA-Leti have expanded their longstanding collaboration to focus on developing differentiated materials engineering solutions for several speciality semiconductor applications.
Soitec opens new SiC dedicated plant
October 03, 2023
French semiconductor materials provider Soitec has officially inaugurated its new plant in Bernin, near Grenoble. The launch of the new plant is a key step in Soitec’s plan, targeting a threefold increase in addressable markets by 2030.
Soitec to expand its manufacturing footprint in France
March 11, 2022
Soitec is looking to expand its manufacturing footprint in Bernin, France to be ready to produce high volume SiC semiconductor wafers for electric vehicles and industrial markets and increase its SOI capabilities.
Altix receives Direct Imaging order from CEA-Liten
February 03, 2022
European research institute, CEA-Liten, who focuses on the development of sustainable energy technologies, has placed an order for a Direct Imaging system from Normandy-based Altix.
STMicro to acquire majority stake in GaN specialist Exagan
March 05, 2020
The acquisition aims to accelerate ST’s GaN expertise, roadmap and business for high-frequency, high-power automotive, industrial and consumer applications.
ST and TSMC team up on Gallium Nitride-based products
February 20, 2020
STMicroelectronics and TSMC are collaborating to accelerate the development of Gallium Nitride (GaN) process technology and the supply of both discrete and integrated GaN devices to market.
Semiconductor R&D to nudge higher through 2024
January 31, 2020
Technical challenges including the move to EUV lithography, sub-3nm process technology, 3D die-stacking technologies, and advanced packaging are expected to lift R&D growth rates.
Soitec & Applied Materials to develop next-gen SiC substrates
November 18, 2019
Designer and manufacturer of semiconductor materials, Soitec, is entering a joint development program with Applied Materials on next-generation silicon carbide substrates.
Soitec and KOKUSAI expands collaboration
July 11, 2019
Designer and manufacturer of semiconductor materials, Soitec, and KOKUSAI ELECTRIC CORPORATION, a pure play manufacturer of semiconductor manufacturing systems, have expanded their collaboration to R&D activities at Grenoble's Substrate Innovation Center in France.
GaN specialist Exagan opens power solutions centre in Europe
May 07, 2019
Continuing its progress in accelerating the adoption of gallium-nitride (GaN)-on-silicon semiconductors in power markets, GaN innovator Exagan has opened a new Power Solutions Centre in Toulouse, France.
‘Micro LED-like’ products will be available in 2018
July 21, 2017
A major bottleneck in the commercialization of Micro LED displays is the mass transfer of micron-size LEDs to a display backplane, new research from LEDinside, a division of TrendForce, reveals.
EU/South Korean project for world’s first 5G-system prototype
April 05, 2017
Leti, a research institute of CEA Tech,will head a European and South Korean project, 5G CHAMPION, to deliver the world’s first fully integrated and operational 5G prototype in conjunction with the 2018 Winter Olympics.
Global arms industry: USA remains dominant despite decline
December 16, 2016
Sales of arms and military services by the largest arms-producing and military services companies – the SIPRI Top 100 – totalled USD 370.7 billion in 2015 according to SIPRI.
Leti orders Hercules NIL System from EV Group
September 22, 2016
EV Group (EVG), and Leti, an institute of CEA Tech, has ordered a Hercules NIL track system from EV Group.
Exagan selects Aixtron system to ramp up production
February 29, 2016
Aixtron SE has shipped an AIX G5+ C system to French start-up company Exagan, a producer of materials and high-efficiency gallium nitride (GaN) power switches.
SET joins IRT Nanoelec 3D integration program
January 18, 2016
SET, Smart Equipment Technology, a supplier of die-to-die and die-to-wafer bonders, is participating in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti.
SPTS installs new machinery at CEA-Leti
December 23, 2015
SPTS Technologies, an Orbotech company, has supplied CEA-Leti, a European micro- and nanotechnologies research institute, with its vapor HF etch release systems for 300mm MEMS on CMOS development.
Europe: Top military equipment OEMs
December 22, 2015
Western European companies’ arms sales decreased by 7.4 percent in 2014. Only German (+9.4 percent) and Swiss (+11.2 percent) companies show overall growth in their arms sales in real terms.
Thinfilm to participate in research consortium on printed electronics
May 22, 2015
Thin Film Electronics has been selected by the European Commission to participate in a group research and innovation initiative focused on the advancement of printed electronics technology.
Samtec joins IRT Nanoelec silicon photonics program
May 12, 2015
Samtec is joining CNRS, STMicroelectronics, Mentor Graphics and CEA-Leti to develop and industrialise optical communications solutions using Silicon Photonics technology for addressing Data Centers and High Performance Computing applications.
CEA-Leti signs agreement with Qualcomm
December 09, 2013
CEA-Leti signed an agreement with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to assess the feasibility and the value of Leti’s sequential 3D technology.
Leti in MEMS research collaboration with Omron
November 27, 2013
While Leti has a Tokyo office and has partnered with Japanese companies and research organizations for many years, the agreement is Leti’s first collaboration with a Japanese MEMS producer.
Project to industrialize new world record high-density capacitors
October 25, 2013
CEA-Leti, Fraunhofer IPMS-CNT and three European SMEs, IPDiA, Picosun and SENTECH Instruments, have launched a project to industrialize 3D integrated capacitors with world-record density.
'Nano2017' R&D program at STMicro’s Crolles site
July 24, 2013
Nano2017 is a five-year public-private strategic R&D program, led by ST, which gathers many players, including the leading French research laboratory CEA-LETI (a historical partner of the ST Crolles R&D center since its set up in 1992).
'Nano2017' R&D program at STMicro’s Crolles site
July 23, 2013
Nano2017 is a five-year public-private strategic R&D program, led by ST, which gathers many players, including the leading French research laboratory CEA-LETI (a historical partner of the ST Crolles R&D center since its set up in 1992).
SOCRATE Project focusing on miniature antennas
July 16, 2013
CEA-Leti and three partners in the SOCRATE project are developing innovative concepts to significantly improve the directivity of electrically small antennas.
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