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Project

September 29, 2025
The STARLight project brings together a consortium of leading industrial and academic partners with the aim of establishing a high-volume manufacturing line, developing leading-edge optical modules, and fostering a complete value chain.

lab

June 17, 2025
Applied Materials and CEA-Leti have entered what they call the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors. Under a memorandum of understanding (MOU), the companies plan to expand their joint lab and develop materials engineering solutions to address emerging infrastructure challenges in AI data centres.

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project

June 09, 2025
With a budget of close to €55 million, GENESIS will drive innovative solutions in emission control, eco-friendly materials such as alternatives to PFAS-based ones, waste minimization, and raw material reuse.

Top-20_defence

May 28, 2025
The global defence industry never sleeps. Geopolitical tensions – from Russia’s invasion of Ukraine and conflict in the Middle East to the arms build-up in East Asia – are fuelling record-breaking investments in military technology and production.

PCB-EU_2

March 25, 2025
Participants whose requests are selected will have access to FAMES technologies as they become available. Open-Access Calls will take place each spring through 2028.

engineer-looking-at-wafer

February 19, 2025
The European semiconductor industry is receiving a boost through the APECS pilot line project, which has been awarded funding under the EU Chips Act. This initiative focuses on developing and providing new packaging and integration solutions for the industry.

FAMES

July 01, 2024
France's CEA-Leti lab has officially launched its FAMES Pilot Line to support higher-performance, more energy-efficient and more sustainable chip designs across Europe.

chip

June 17, 2024
Kalray and Pliops are set to become one company in a joint drive to be mayor players in the market for AI and storage servers in data centres.

flags

May 23, 2024
European Commission officials believe the EU Chips Act can attract huge inwards investment and propel the continent's semiconductor space to global prominence by 2030.

lab

March 01, 2024
The European Union has issued a call for proposals to its PREVAIL consortium, which was set up to accelerate the development of next-generation, edge-AI technologies across the continent.

employees-in-cleanroom

December 07, 2023
Applied Materials and CEA-Leti have expanded their longstanding collaboration to focus on developing differentiated materials engineering solutions for several speciality semiconductor applications.

Fab-Worker-SiC-Wafer

October 03, 2023
French semiconductor materials provider Soitec has officially inaugurated its new plant in Bernin, near Grenoble. The launch of the new plant is a key step in Soitec’s plan, targeting a threefold increase in addressable markets by 2030.

production

March 11, 2022
Soitec is looking to expand its manufacturing footprint in Bernin, France to be ready to produce high volume SiC semiconductor wafers for electric vehicles and industrial markets and increase its SOI capabilities.

adix-sa-system

February 03, 2022
European research institute, CEA-Liten, who focuses on the development of sustainable energy technologies, has placed an order for a Direct Imaging system from Normandy-based Altix.

handshake

March 05, 2020
The acquisition aims to accelerate ST’s GaN expertise, roadmap and business for high-frequency, high-power automotive, industrial and consumer applications.

businessmen-handshaking

February 20, 2020
STMicroelectronics and TSMC are collaborating to accelerate the development of Gallium Nitride (GaN) process technology and the supply of both discrete and integrated GaN devices to market.

businessman-graph

January 31, 2020
Technical challenges including the move to EUV lithography, sub-3nm process technology, 3D die-stacking technologies, and advanced packaging are expected to lift R&D growth rates.

employee-Smart-Cut-based-SiC-wafer

November 18, 2019
Designer and manufacturer of semiconductor materials, Soitec, is entering a joint development program with Applied Materials on next-generation silicon carbide substrates.

handshake-l

July 11, 2019
Designer and manufacturer of semiconductor materials, Soitec, and KOKUSAI ELECTRIC CORPORATION, a pure play manufacturer of semiconductor manufacturing systems, have expanded their collaboration to R&D activities at Grenoble's Substrate Innovation Center in France.

business-building-l

May 07, 2019
Continuing its progress in accelerating the adoption of gallium-nitride (GaN)-on-silicon semiconductors in power markets, GaN innovator Exagan has opened a new Power Solutions Centre in Toulouse, France.

summorizing-report

July 21, 2017
A major bottleneck in the commercialization of Micro LED displays is the mass transfer of micron-size LEDs to a display backplane, new research from LEDinside, a division of TrendForce, reveals.

aerial-view-building

April 05, 2017
Leti, a research institute of CEA Tech,will head a European and South Korean project, 5G CHAMPION, to deliver the world’s first fully integrated and operational 5G prototype in conjunction with the 2018 Winter Olympics.

apache

December 16, 2016
Sales of arms and military services by the largest arms-producing and military services companies – the SIPRI Top 100 – totalled USD 370.7 billion in 2015 according to SIPRI.

businessmen-handshaking

September 22, 2016
EV Group (EVG), and Leti, an institute of CEA Tech, has ordered a Hercules NIL track system from EV Group.

information-sign

February 29, 2016
Aixtron SE has shipped an AIX G5+ C system to French start-up company Exagan, a producer of materials and high-efficiency gallium nitride (GaN) power switches.

businessman-sitting-in-front-of-blackboard

January 18, 2016
SET, Smart Equipment Technology, a supplier of die-to-die and die-to-wafer bonders, is participating in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti.

contract-signing1

December 23, 2015
SPTS Technologies, an Orbotech company, has supplied CEA-Leti, a European micro- and nanotechnologies research institute, with its vapor HF etch release systems for 300mm MEMS on CMOS development.

martin_mfc-jassm

December 22, 2015
Western European companies’ arms sales decreased by 7.4 percent in 2014. Only German (+9.4 percent) and Swiss (+11.2 percent) companies show overall growth in their arms sales in real terms.

printed-electronics

May 22, 2015
Thin Film Electronics has been selected by the European Commission to participate in a group research and innovation initiative focused on the advancement of printed electronics technology.

handshake

May 12, 2015
Samtec is joining CNRS, STMicroelectronics, Mentor Graphics and CEA-Leti to develop and industrialise optical communications solutions using Silicon Photonics technology for addressing Data Centers and High Performance Computing applications.

semiconductor-generic1

December 09, 2013
CEA-Leti signed an agreement with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to assess the feasibility and the value of Leti’s sequential 3D technology.

handshake

November 27, 2013
While Leti has a Tokyo office and has partnered with Japanese companies and research organizations for many years, the agreement is Leti’s first collaboration with a Japanese MEMS producer.

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